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What is High Bandwidth Memory 3 (HBM3)? This comprehensive engineering guide covers architecture, applications, and performance, along with some advanced techniques used by leading AI companies and best implementation strategies!
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What is High Bandwidth Memory 3 (HBM3)? This comprehensive engineering guide covers architecture, applications, and performance, along with some advanced techniques used by leading AI companies and best implementation strategies!
PCB Trace Width Calculator
Glossary of Semiconductors Terms
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At UltiMaker, we've seen how additive manufacturing can reshape packaging workflows from prototyping to production. Here's how packaging professionals are using 3D printing to solve common challenges - and how you can, too.
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Scientists at ITMO have come up with a new way to protect microelectronics devices from counterfeit. The new technology is based on gold and silicon nanoparticles with unique optical properties that make it possible to create unclonable functions with a record information density.
Engineers Wiki. Most Asked Questions.
Comprehensive Guide
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
Understanding Logic Gate Symbols: Comprehensive Guide for Engineers
By Umar Waseem.
15 minutes read.
Transistor Circuit Design – Theory and Practice for Modern Engineers
By Muhammad Sufyan.
14 minutes read.
UART Protocol: Understanding Serial Communication for Engineers
By Ramsha Jawaid.
18 minutes read.
Arduino UNO Pinout: Comprehensive Guide for Engineers and Students
By Umar Waseem.
16 minutes read.
How to Read Resistor Color Code: Theory, Practice and Design
By Umar Waseem.
13 minutes read.
Transistor Circuits: Theory, Types, and Practical Applications
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ORGANIZATIONS. SHAPING THE INDUSTRY.
Nordic Semiconductor
Semiconductors
Nordic Semiconductor is a fabless semiconductor company specializing in wireless technology that powers the IoT.
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TAGGED WITH flexible electronics
This article provides a detailed examination of logic gate symbols, truth tables, and transistor level implementations, with practical insights for digital design and hardware professionals.
This article covers every aspect of the Arduino UNO pinout, presenting a technical, pin-by-pin explanation to help readers confidently design, analyze, and implement Arduino-based systems.
This article explores how to read resistor color code correctly, covering the fundamental theory, relevant standards, practical examples, and design-oriented insights, providing practical tips for efficient and accurate circuit prototyping.
Miniature RFID tags by Murata enable seamless system integration with durable, reprogrammable identification — delivering reliable tracking, authentication & traceability beyond the limits of traditional barcodes.
TAGGED WITH pcb
Learn why growing hardware teams slow down as they scale, and how aligned workflows, parallel collaboration, and real-time design visibility restore speed and momentum.
This article explores how to read resistor color code correctly, covering the fundamental theory, relevant standards, practical examples, and design-oriented insights, providing practical tips for efficient and accurate circuit prototyping.
This article outlines the main connector types used in electronic systems and the design trade-offs engineers must consider when selecting them.
Learn how to select the right Murata MLCCs for modern power architectures, balancing low ESL, stable capacitance, and smart placement to ensure power integrity in high-speed, high-current systems.
Latest Posts
What is High Bandwidth Memory 3 (HBM3)? This comprehensive engineering guide covers architecture, applications, and performance, along with some advanced techniques used by leading AI companies and best implementation strategies!
At UltiMaker, we've seen how additive manufacturing can reshape packaging workflows from prototyping to production. Here's how packaging professionals are using 3D printing to solve common challenges - and how you can, too.
2 minutes read
Scientists at ITMO have come up with a new way to protect microelectronics devices from counterfeit. The new technology is based on gold and silicon nanoparticles with unique optical properties that make it possible to create unclonable functions with a record information density.
3 minutes read
Polymer glass transition temperature (Tg) refers to the temperature at which an amorphous polymer transitions from a glassy, rigid state to a rubbery, flexible state. Understanding the polymer glass transition temperature is crucial for various industries, including engineering and manufacturing.
event | OCT 31 - NOV 02, 2025
Hackaday Supercon is returning for an exciting weekend filled with technical talks, badge hacking, and hands-on workshops
The low-cost, scalable technology can seamlessly integrate high-speed gallium nitride transistors onto a standard silicon chip.
Master HBM memory technology with our comprehensive engineering guide covering 3D stacking architecture, bandwidth calculations, and design optimization techniques. Discover implementation strategies for AI and HPC applications!
How today's semiconductors are powering the current and future landscape of autonomous driving
Researchers at ETH Zurich and Empa have developed a new image sensor made of perovskite. This semiconductor material enables better colour reproduction and fewer image artefacts with less light. Perovskite sensors are also particularly well suited for machine vision.
4 minutes read
Plasma Science and Fusion Center researchers created a superconducting circuit that could one day replace semiconductor components in quantum and high-performance computing systems.
Discover how Dry Phase Patterning (DPP) showcased a 99 percent reduction both in carbon footprint and electricity used compared to conventional wet etching.
This technical guide explores the various types, material properties, manufacturing processes, and key design considerations associated with blank PCB technology!
By performing deep learning at the speed of light, this chip could give edge devices new capabilities for real-time data analysis.
Ball Grid Array (BGA) is a high-density packaging technology using solder balls for connections. This guide covers BGA design principles, performance advantages, modern applications (2000+ pins in 45mm), and cutting-edge implementation techniques for engineers.
Michigan Engineers are leading hardware efforts to enable the AI required for full autonomy.
3 minutes read
