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Plasma Science and Fusion Center researchers created a superconducting circuit that could one day replace semiconductor components in quantum and high-performance computing systems.

Closing in on superconducting semiconductors

Ball Grid Array (BGA) is a high-density packaging technology using solder balls for connections. This guide covers BGA design principles, performance advantages, modern applications (2000+ pins in 45mm), and cutting-edge implementation techniques for engineers.

Ball Grid Array Technology: Complete Engineering Guide

In this context, dynamic constraint checking includes software runtime checks (assertions that make checks over the correct behavior of the system) and hardware checks provided by some microprocessors, for example, memory protection provided by a Memory Management Unit (MMU).

Building Safety by Design: CHERI in Critical Systems Development

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