Plasma Science and Fusion Center researchers created a superconducting circuit that could one day replace semiconductor components in quantum and high-performance computing systems.
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By performing deep learning at the speed of light, this chip could give edge devices new capabilities for real-time data analysis.
Ball Grid Array (BGA) is a high-density packaging technology using solder balls for connections. This guide covers BGA design principles, performance advantages, modern applications (2000+ pins in 45mm), and cutting-edge implementation techniques for engineers.
Embedded Multimedia Card (eMMC) is a non-volatile flash memory mainly used in mobile devices and embedded systems. It has a single package design featuring a NAND flash memory integrated with a memory controller.
8 minutes read
Parylene coatings present unique challenges when it comes to rework and removal. They often outperform other conformal coatings. Parylene has better barrier properties, uniform coverage, and performance in thinner layers.
The solution came from a powerful tool: xDS, or Extensible Discovery Service. Originally built for Envoy, xDS is a family of dynamic configuration APIs—Cluster Discovery Service (CDS), Endpoint Discovery Service (EDS), Listener Discovery Service (LDS), and Route Discovery Service (RDS).
Flat flexible cables and flexible printed circuit solutions enable high-density, high-speed connections across a wide range of modern electronic applications. While Molex delivers the interconnect technology, Sager supports engineers with design guidance, prototyping, and supply chain execution.
Memory safety, a key concept in software development, addresses how an application handles memory operations, such as reading, writing, allocation, and deallocation.
Physicists at ETH Zurich have developed a lens with magic properties. Ultra-thin, it can transform infrared light into visible light by halving the wavelength of incident light.
4 minutes read
CheriBSD is a Capability Enabled, Unix-like Operating System that extends FreeBSD to take advantage of Capability Hardware on Arm's Morello and CHERI-RISC-V platforms.
OEM means the client designs and the manufacturer builds. ODM means the manufacturer handles both design and production. This guide helps engineers compare IP control, customization, cost, and time to market to decide which model fits their product best.
Previously only thought to be insulating, a shift in the angle between silicon and oxygen atoms creates a highway for an electrical charge.
Watch the webinar on sustainable PCB manufacturing hosted by Voltera and Jiva Materials.
Research and Development product leaders like you and me drive innovation. We turn ideas and problems into safe and manufacturable products by exploring new technologies, materials, and processes to meet technical needs and customer expectations.
In this context, dynamic constraint checking includes software runtime checks (assertions that make checks over the correct behavior of the system) and hardware checks provided by some microprocessors, for example, memory protection provided by a Memory Management Unit (MMU).
