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In this context, dynamic constraint checking includes software runtime checks (assertions that make checks over the correct behavior of the system) and hardware checks provided by some microprocessors, for example, memory protection provided by a Memory Management Unit (MMU).
New smart textiles developed by researchers at ETH Zurich use acoustic waves and glass fibres to help make precise measurements. They are light, breathable and inexpensive, and offer great potential for medicine, sports and everyday life.
3 minutes read
An edible robot made by EPFL scientists leverages a combination of biodegradable fuel and surface tension to zip around the water's surface, creating a safe - and nutritious - alternative to environmental monitoring devices made from artificial polymers and electronics.
3 minutes read
Nexperia NEVB-MTR1-KIT1 is a motor driver evaluation kit that can be set up in under two minutes, supports USB-C Power Delivery, allows microcontroller and component swapping, and offers open-source firmware for fast customization and real-world motor control development.
Functional inks are the backbone of printed electronics, transforming ordinary substrates like plastic, paper, or textiles into smart, interactive devices.
Manufacturing semiconductors is made simpler and more cost-effective with the use of cutting-edge microdispensing technologies that can print on a range of substrates.
Reliability is a top priority in defense and aerospace electronics in harsh, unforgiving environments. The MIL-I-C standard is a guideline for conformal coating materials that helps keep PCBAs safe from military environments, ensuring dependable performance.
MIT engineers developed ultrathin electronic films that sense heat and other signals, and could reduce the bulk of conventional goggles and scopes.
Discover how Dry Phase Patterning offers a faster, greener, and cheaper alternative to silver inks in flexible electronics and printed circuit boards.
LGA uses flat pads for connections, while BGA relies on solder balls for permanent mounting. This guide compares their thermal performance, electrical traits, reliability, and assembly pros and cons to help you choose the best IC package for your needs.
With help from recent gifts, the Stanford Wearable Electronics Initiative eWEAR-X is supercharging its efforts to transform researchers inspiration into reality by augmenting the Ideation and Prototyping Lab and providing seed funding for members of the university community.
4 minutes read
Explore how TDKs Direct Retinal Projection DRP technology offers a breakthrough, enabling compact, energy-efficient AR glasses designed for all-day wear.
Learn how to calculate impedance in AC circuits – from basic RLC components to complex transmission lines and PCB traces. This guide covers the theory, formulas, methods, and tools needed to determine impedance accurately and ensure proper impedance matching in their designs.
This article is a detailed guide on Vcc vs Vdd power rail naming conventions in analog and digital circuits (CMOS vs bipolar), with practical tips for schematics, PCB layout, and IC selection!
