<p data-pm-slice="1 1 []" id="isPasted">This article is published as part of TechBlick (www.TechBlick.com) series on additive and sustainable electronics. Here, Stephan from the Holst Centre outlines how one can make electronics more sustainable, considering materials, manufacturing, and design aspects. This article appeared originally&nbsp;<a href="https://www.techblick.com/post/roadmap-to-sustainable-printed-electronics-tno-at-holst-centre" target="_blank" rel="noopener noreferrer">here. </a></p><p data-pm-slice="1 1 []">Author: Stephan Harkema and Corn&eacute; Rentrop | TNO at Holst Centre | <a rel="noopener noreferrer" href="mailto:stephan.harkema@tno.nl" target="_blank">stephan.harkema@tno.nl</a></p><p>A growing desire for continuous data collection, real-time information, and connectivity has resulted in increased demand for electronic functionalities that are fully integrated in everyday objects. Consumer electronics, healthcare, wearable electronics, IoT, and smart packaging are examples of market segments that follow this trend. Printed circuit boards (PCBs) are state-of-the-art when it comes to creating electronic functions, but pose challenges with respect to sustainability. These highly integrated electronic products, where plastics, metals and semiconductor components are seamlessly combined, are a challenge to recycle. The only suitable end-of-life scenario is still limited to shredding and incineration. With increasing electrification, digitization, broad wireless integration (IoT) and welfare, the amount of waste from electronics and electronic devices increases drastically. An estimated 1.2 Mtons of Printed Circuit Boards (PCBs) end up in the total amount of annual e-waste[1]. Only a third is recycled in environmentally sound facilities. This means that around 800 million kilograms may be traded, recycled in a non-compliant and polluting manner or may end up on a landfill. There is a more eco-friendly alternative to PCBs: Hybrid and Printed Electronics (HPE). This technology is a big step forward compared to PCBs, but much more is needed to achieve circular production of next-generation electronics.</p><p>Despite their name, printed circuit boards (PCBs) are not actually printed. They consist of multiple layers of electroplated copper on glass-fiber epoxy substrates onto which electrical components, so-called surface-mounted devices (SMDs) are assembled. The copper layers are etched with hazardous chemicals to create the circuitry. At end-of-life, the encapsulated copper and unrecyclable epoxy carrier make PCBs a recycling challenge. Transitioning from PCBs to HPE (Hybrid and Printed Electronics) provides immediate opportunities to achieve ecological benefits: reduced device thickness, lower weight, printed sensors, and additive instead of deductive manufacturing of the circuitry. Printed electronics is a disruptive technology that is on the verge of breakthrough in the automotive, lighting, and medical domains. Each use case represents a slimmer, lighter, more appealing, more practical, and less polluting alternative to the conventional device based on printed circuit boards (PCBs). However, in both types of electronics, PCBs, and HPE, the circuitry and SMDs contain potentially critical, high-impact metals embedded in plastics to protect them from external influences, such as mechanical damage and moisture. As opposed to PCBs, the environmental impact of HPE can be further reduced by using recyclable, bio-based, and renewable or compostable materials.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0Nzc0NDU4Nzk1LVNjcmVlbnNob3QgMjAyMy0wOS0xNSAxMDA3MDgucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 754px;" class="fr-fic fr-dib"></p><figure><figcaption>Figure 1: Roadmap to sustainable electronics</figcaption></figure><h3>Roadmap to sustainable printed electronics</h3><p>Most, if not all, products are mass produced. A first primary focus lies with a successful market entry which is often achieved by innovative functionalities in an aesthetic product design at competitive price levels. Manufacturing of such products is often not immediately optimized for low material usage, low power usage, and a minimal carbon footprint. Instead, single use and low recyclability are often accepted at this stage to achieve commercial success, which may be essential for the survival probability of the company. Petrochemical materials offer a high degree of reliability, low cost and supply security and are therefore ideally suited for high volume production in this first stage of the roadmap, as shown in Figure 1.</p><p>A first step towards increasing a product&rsquo;s sustainability is to address, and preferably extend, its end-of-life by enabling repairability, for instance by a modular design with repairable or replaceable components, or by enabling upgrades. Such steps do not immediately improve recyclability or reduce the environmental impact of production and the materials, but they do provide a significant improvement to the environmental impact by the simple fact that the product does not need to be replaced by a new one. Also energy consumption during the use phase may be addressed. For some examples, such as devices containing highpower elements (e.g. lighting), optimization of power usage may be an effective means of lowering the overall environmental impact.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0Nzc0NDkwMzgyLVROTyBhdCBIb2xzdCBDZW50cmUgKEJFUkxJTi1PY3QtMjAyMykuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 762px;" class="fr-fic fr-dib"></p><figure><a href="https://www.techblick.com/electronicsreshaped" target="_blank"></a><figcaption>Join us at TechBlick&#39;s Future of Electronics RESHAPED conference &amp; tradeshow in Berlin on 17-18 OCT 2023 - <a target="_blank" rel="noopener noreferrer" data-fr-linked="true" href="//www.techblick.com/electronicsreshaped">www.techblick.com/electronicsreshaped</a>. Contact authors for discounted rates.</figcaption></figure><p>Following this second stage, a third step may be taken in which a product undergoes a simplification of its design with a reduction of coatings to limit material usage, production steps and overall energy consumption. Printed electronics technology offers an increasingly credible alternative to PCBs and perfectly matches this stage in the roadmap: 1) lower thickness, 2) printed functionalities instead of discrete SMD components that have a higher footprint, 3) recyclable thermoplastic polymers and 4) additive manufacturing as opposed to deductive etching of copper. Nonetheless, challenges still remain in terms of costs and reliability in comparison to the PCB.</p><p>Circular use of materials, as depicted in the fourth stage in Figure 1, requires more drastic changes, especially to enable other choices at end-of-life. When end-of-life is reached, the product needs to be dismantled into its chemical building blocks. Here, printed electronics also provides opportunities, as many of the starting materials are meltable and therefore relatively easy to dismantle. The favoured cradle-to-cradle recycling approach is a possibility to further reduce the environmental impact. However, seamlessly integrated electronic products manufactured to survive rigorous testing in harsh environments cannot be disassembled so easily, which leaves shredding and incineration of these products as the only option at end-of-life. The plastics serve as energy carriers for metallurgic processes. While metallurgic processing at an industrial scale may be very efficient for metal recovery, the plastics are lost entirely. Recuperation of the plastics faces the challenge of achieving a high enough purity level to reach the material properties of the initial plastic. When combining plastics with coatings or metals or other plastics, purity levels plummet and only secondary use is realistic. Recycling of integrated electronics to yield metals, components and plastics separately and in a pure and circularly usable form therefore requires a method of disassembly prior to recycling. Not only does this allow circular use of all components and materials, it also enables higher recycling rates. It is therefore vital for electronics production in a circular economy to include design-for-recycling principles.</p><p>In the before-last stage, bio-based materials may be introduced as a replacement for generally used fossil-based polymers. In the final stage, biodegradability is an option for specific use cases where disposal into the environment is likely or a more effective approach to recycling. Devices applied to the human body with a limited lifetime of days to weeks are well-suited to go this far in their sustainable developments, while others intended for long-term use are less likely to benefit from biodegradability. Materials from bio-based origins are considered to be environmentally friendly, but large volume production may put additional strain on food supplies and animal feed (1st generation feedstock) or land use for non-food biomass (2nd generation)[2]. Algae are a promising candidate for third-generation bio-mass due to a very high growth rate (5-10x terrestrial plants)[3]. Moreover, cultivation of algae do not strain food supplies and available cultivated farmland.</p><h3>Achievable lower environmental impacts</h3><p>Quantification of the environmental impact typically proceeds through a life-cycle assessment. Guidelines to achieve a lower environmental footprint for printed electronics were provided by Prenzel et al.[4]. Copper has a significantly lower global warming potential than silver, possibly up to a factor of 70[5]. While this choice for a different metal would lead to a more than 95% lower contribution to the GWP, it is limited to the printed circuitry alone, if processing remains otherwise identical. Similar values are possible for the plastic carrier if e.g. paper is a suitable alternative. However, reliability would then be at stake due to a high sensitivity to moisture/water, revealing the potential, but also the intricacies related to developing sustainable electronic products. At a higher integration level, ultra-thin organic photovoltaic solar cells were reported to demonstrate a 10-85% reduction in carbon footprint by a combination of a different substrate, less silver and a modified design[6]. For printed electronics devices closer to industrialisation, a recent life-cycle assessment by Tactotek indicated that, compared to PCBs, in-mould structural electronics (IMSE) enabled a reduction of the carbon footprint by 34-62%, depending on the application and its details[7]. The reductions in carbon footprint for these printed electronics examples are very hopeful and do not stand alone. More examples are available in the literature.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0Nzc0NTIzNTA3LVROTyBhdCBIb2xzdCBDZW50cmUtYm9vdGguanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 725px;" class="fr-fic fr-dib"></p><figure><a href="https://www.techblick.com/electronicsreshaped" target="_blank"></a><figcaption>Join us at TechBlick&#39;s Future of Electronics RESHAPED conference &amp; tradeshow in Berlin on 17-18 OCT 2023 - <a target="_blank" rel="noopener noreferrer noopener noreferrer" data-fr-linked="true" href="//www.techblick.com/electronicsreshaped">www.techblick.com/electronicsreshaped</a>. Contact author for discounted rates.&nbsp;</figcaption></figure><h3>Design-for-recycling (DfR)</h3><p>The benefits of the application of a design-for-recyclability would further enhance these values as a DfR enables the recovery of the materials. When comparing automated shredding and sorting of PCBs containing electronic waste to manual extraction of the PCB for recycling, higher recovery rates were obtained for the latter (95-99% vs 12-60%)[8]. Another study indicated that extensive dismantling and high-quality recycling would lead to the highest reduction of the product&rsquo;s global warming potential[9]. Norgren et al. applied design-for-recycling to several use cases and examined the role of a DfR in a circular economy[10]. As described, design-for-recycling holds the potential to increase the quantity and value of materials recovered and reused from products that have reached their end-of-life. Important to realize is that improved recyclability provides a balance between reliability and recyclability: a part is typically designed to withstand rigorous testing (peel tests, pull-out tests, bending tests, stretching, ..), sometimes in combination with harsh environmental exposure (climate chamber set at elevated temperature and humidity, thermal shock tests, aging test at high T and/or with UV exposure). The specs and standards that must be met are often based on conventional PCB electronics and warrant re-evaluation of their applicability in a circular economy. The additional trade-off of recyclability versus costs may come in next, as additional measures or specialistic materials may be necessary to reach the DfR. The question is then when the gains in environmental impact exceed the potential loss in reliability and or potential increase in costs and which methods for quantification are accepted by the industry and policy makers.</p><p>TNO at Holst Centre has developed a DfR approach that can be applied to various printed electronics devices, including in-mould structural electronics, flexible lighting, flexible sensors, and (medical) health patches. In this design, the encapsulant of the printed electronics and discrete semiconductor components can be removed at end-of-life. First demonstrations of the principles on in-mould structural electronics (IMSE) in the EU Treasure project led to successful device disassembly[11]. Upon removal of the polycarbonate encapsulant, that had been applied by injection moulding to a polycarbonate substrate with printed silver circuitry, the printed silver circuitry was exposed. Subsequent hydro-metallurgic processes by Treasure partner Univaq (University of L&rsquo;Aquila) could target the printed silver directly and specifically without the need to chemically remove the PC beforehand[12]. A full life-cycle assessment, including the comparison of a recycling end-of-life scenario compared to shredding and incineration, is underway.</p><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0Nzc0NTU3MjM4LVNjcmVlbnNob3QgMjAyMy0wOS0xNSAxMDA3MjMucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 682px;" class="fr-fic fr-dib"></p><figure><figcaption>Figure 2: schematic representation of a design-for-recycling with a) an electronic device encapsulated in plastic, b) first stage of dismantling with the removal of the plastic encapsulant, c) &amp; d) second stage of dismantling that targets SMDs and (printed) circuitry and e) plastic substrate with any leftover (graphic) layers. Figure courtesy of Amires.</figcaption><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0Nzc0NTc4MzkzLVNjcmVlbnNob3QgMjAyMy0wOS0xNSAxMDA3MzQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 686px;" class="fr-fic fr-dib"></p></figure><figure><figcaption>Figure 3: a) forced mechanical disassembly of an IMSE device without DfR leading to rupture of the substrate, b) disassembly of an IMSE device with DfR; c,d) Flexible lighting device with DfR in on-state and off-state during peel tests</figcaption></figure><h3>Join us and the global community in Berlin on 17-18 OCT 2023. and let us together RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable, or 3D.</h3><p><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjk0Nzc0NjMzMzY2LTIuQWdlbmRhLUV4aGliaXRpb24tTE9HT1MtKEJFUkxJTi0yMDIzKS1zbWFsbC5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 738px;" class="fr-fic fr-dib"></p><h3 data-pm-slice="1 1 []" id="isPasted">Acknowledgements</h3><p>Holst Centre is a research and innovation partner specialized in health technologies, flexible and wireless electronics, powered by the shared expertise of imec and TNO. This research has been funded by the Dutch Ministry of Economic Affairs, and the European Union&rsquo;s Horizon 2020 research and innovation programme under grant agreement No 101003587 (EU Treasure project), No 101070167 (EU Ecotron project). Original electrical and injection-mould design were realized in the Flexlines project</p><p>that received funding from Interreg Vlaanderen-Nederland. The authors would like to gratefully acknowledge the exceptional contributions from Peter Rensing, Pit Teunissen, Jan van Delft, Jeroen Schram, Gerwin Kircher, Adri van der Waal and dr. Margreet de Kok from TNO at Holst Centre, and Sanne Domensino and Joris Vermeijlen from Fontys University of Applied Sciences. We also gratefully acknowledge the wonderful support provided by Rick Leuven and Yibo Su from Brightlands</p><p>Material Center for injection moulding with the Flexlines mould.&nbsp;</p><hr><h3>References:</h3><p>[1] Bald&eacute;, C.P., D&rsquo;Angelo, E., Luda, V., Deubzer, O., and Keuhr, R. Global Transboundary E-waste Flows Monitor &ndash; 2022, United Nations Institute for Training and Research (2022)</p><p>[2] Coma M., Martinez-Hernandez E., Abeln, F., Raikova, S., Donnelly, J., Arnot, T.C., Allen, M.J., Hong, D.D., Chuck, C.J.Faraday Discuss., 202, 175 (2017)</p><p>[3] Maliha A., Abu-Hijleh, B., Energy Systems (2022) doi:10.1007/s12667-022-00514-7</p><p>[4] Prenzel T.M., Gehring, F., Fuhs, F., Albrecht, S. Mat&eacute;riaux &amp; Techniques 109, 506 (2021) doi: &nbsp;<a rel="noopener noreferrer" href="http://doi.org/10.1051/mattech/2022016" target="_blank">doi.org/10.1051/mattech/2022016</a></p><p>[5] Nuss P, Eckelman MJ (2014) PLoS ONE 9(7): e101298. doi:10.1371/journal.pone.0101298 (2014)</p><p>[6] V&auml;lim&auml;ki, M.K., Sokka, L.I., Peltola, H.B. Int J Adv Manuf Technol 111, 325&ndash;339 (2020). doi:10.1007/s00170-020-06029-8</p><p>[7] Tactotek webinar &ldquo;Environmental Performance of IMSE&reg;&rdquo;, 2022, <a rel="noopener noreferrer" href="https://www.tactotek.com/resources/webinar-environmentalperformance-of-imse" target="_blank">https://www.tactotek.com/resources/webinar-environmentalperformance-of-imse</a></p><p>[8] Ardente F., Mathieux, F., Recchioni, M. Resources, Conservation and Recycling 92, 158-171 (2014) doi:10.1016/j.resconrec.2014.09.005</p><p>[9] Alston, S., Arnold, J. Environ. Sci. Technol. 45, 21, 9386&ndash;9392 (2011) doi:10.1021/es2016654</p><p>[10] Norgren A., Carpenter A., Heath, G. Journal of Sustainable Metallurgy 6:761&ndash;774 (2020). doi: 10.1007/s40831-020-00313-3</p><p>[11] Harkema, S., Rensing, P., Domensino S., Verweijlen J., Godoi-Bizarro, D. submitted for publication</p><p>[12] Ippolito, N.M.*, Romano, P., Passadoro, M., Pellei, G., Vegli&ograve;, F. Treasure Project H2020 - Recycling of automotive waste for the recovery of precious and critical metals: pilot plant tests. The 16th International Conference on Chemical and Process Engineering, Naples, May 21-24, 2023</p>

A growing desire for continuous data collection, real-time information, and connectivity has resulted in increased demand for electronic functionalities that are fully integrated in everyday objects. Consumer electronics, healthcare, wearable electronics, IoT, and smart packaging are examples of market segments that follow this trend. 

Roadmap to Sustainable Printed Electronics. TNO at Holst Centre

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Introducing SaralOLED Label Ink set: A paradigm shift in OLED illuminated labels industry

Silicon has emerged as the most widely used semiconductor material in the electronic industry, paving the way for the digital age. However, many are still oblivious to the unique properties and characteristics that make silicon ideal for a range of applications. This article explores the fundamentals of semiconductor materials, the properties of silicon that make it a prominent player in the semiconductor industry, and its diverse applications in electronic devices.

Silicon Semiconductor: A Comprehensive Guide to Silicon and its Use in Semiconductor Technology

<p id="isPasted">As part of the TechBlick (wwww.TechBlick.com) series we invited Hyun Lee, Ph.D, &nbsp;Lead Scientist at Celanese Micromax&trade; Electronic Inks and Pastes to tell us a special development in the world of additive electronics: high temperature pastes. This article was originally published on TechBlick<a href="https://www.techblick.com/post/innovative-high-temperature-inks-for-printed-electronics" target="_blank" rel="noopener noreferrer"> here. </a></p><p>To learn more all aspects of printed and additive electronics, join us in Berlin <a target="_blank" rel="noopener noreferrer noopener noreferrer noopener noreferrer noopener noreferrer noopener noreferrer" data-fr-linked="true" href="https://www.techblick.com/electronicsreshaped" id="isPasted">https://www.techblick.com/electronicsreshaped</a></p><p>The global printed electronics market is huge and estimated to reach USD 23 billion in revenue by 2026, growing at a CAGR of 18.3% from 2023 to 2028 [1]. Increased demand for printed electronic products in automotive and the growth of consumer electronics are two key fueling factors to drive the market growth. The two critical segments require various reliable printed electronic products for applications from low temperature to high temperature.&nbsp;</p><p><br></p><p><span contenteditable="false" class="fr-img-caption  fr-fic fr-dii fr-draggable" style="width: 758px;" draggable="false"><span class="fr-img-wrap"><a href="https://www.techblick.com/exhibitors-2023-berlin" target="_blank" rel="noopener noreferrer"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTYwMDY1LTE2OTE1OTM1NjAwNjQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_5254521966ad48ac916c7baf7ccea480~mv2.png/v1/fill/w_1081,h_265,al_c,lg_1,q_85/090711_5254521966ad48ac916c7baf7ccea480~mv2.png" class="fr-fic fr-dii" style="width: 758px;"><span class="fr-inner" contenteditable="true">Join us and the global additive electronics community in Berlin on 17-18 OCT 2023. Lets RESHAPE the Future of Electronics, making it Additive, Sustainable, Flexible, Hybrid, Wearable, and 3D. &nbsp;</span></a></span></span></p><p><br></p><p>The key enabler for reliable device fabrication in printed electronics is functional inks with tunable electrical properties such as conductivity, dielectric strength, and electrical resistance. &nbsp;Celanese Micromax&trade; Electronic Inks and Pastes is a global supplier of thick film pastes/inks and recently launched HT (High Temperature) ink series - HT602/603 resistors, HT702 dielectric and HT802 conductive inks for high-temperature and high-power applications. HT series inks can be printed additively by using screen printing or nozzle dispensing process on various flexible/rigid substrates including Kapton&reg; FPC, Kapton&reg; RS, FR-4, Aluminum, Alumina, and glass. &nbsp;The operation temperature of conventional PTF (Polymer Thick Film) ink is typically limited up to 200&deg;C due to the thermal degradation issue of polymeric</p><p>&nbsp;resin in ink formulations.&nbsp;</p><p>In the printed electronic industry, high-temperature and high-power applications often require operation temperatures above 200&deg;C. HT series inks were developed by using novel polyimide resin whose thermal resistant temperature is up to 300&deg;C. &nbsp;Polyimide resin is flexible thermoplastic allowing much more flexibility compared to rigid thermoset Epoxy resins that have been used for the majority of high-temperature applications. Another key benefit of our polyimide resin is its chemical resistance. The unique combination of high-temperature resistance, flexibility and chemical resistance of HT series inks is expected to provide solutions for new high-temperature applications in the printed electronics industry which couldn&rsquo;t be achievable by conventional PTF inks. This article will discuss key technical features of HT inks and their potential applications.&nbsp;</p><p><a href="https://www.techblick.com/exhibitors-2023-berlin" target="_blank" rel="noopener noreferrer"></a></p><p><br></p><p><strong>HT602/603 resistors</strong></p><p>Printable resistor ink can be used to deposit passive resistive components directly on a substrate. &nbsp;Applications include heated floors, pressure sensors and variable potentiometers. HT602 and HT603 were formulated by adding different types of Carbon black powders in a polyimide medium for high-temperature or high-power applications. The average Rs (Resistivity) is 25 Ω/□/mil for HT602 and 300 Ω/□/mil for HT603, respectively. Two HT resistors may be blended to meet specific Rs targets. If a higher Rs value is required than Rs of HT603, HT702 dielectric can be blended with HT603. Figure 1 shows (a) plot of Rs vs. blend ratio of HT603 and HT602, and (b) Rs vs. blend ratio of HT603 and HT702.&nbsp;</p><div type="empty-line" data-hook="rcv-block19"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTU5MzMxLTE2OTE1OTM1NTkzMzEucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_24a091b42ee94fbc8b1dad56f9794d32~mv2.png/v1/fill/w_1056,h_421,al_c,q_90/090711_24a091b42ee94fbc8b1dad56f9794d32~mv2.png" class="fr-fic fr-dii"></div><div type="image" data-hook="rcv-block21"><br></div><p>Figure 1. (a) Plot of Rs vs. blend ratio between HT602 and HT603; (b) Plot of Rs vs. blend ratio between HT603 and HT702.&nbsp;</p><div type="empty-line" data-hook="rcv-block23"><br></div><p>For reliable device operation, the resistance variation of the printed resistor should be minimal with temperatures. TCR (Temperature Coefficient of Resistance) of two HT resistors were measured at four different temperatures as shown in Figure 2. TCR data of HT602, 603 showed much lower values vs. conventional resistor inks (7082M, 7102) formulated with non-polyimide resin demonstrating more stable resistance values of HT resistors with temperatures.&nbsp;</p><div type="empty-line" data-hook="rcv-block26"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTU5MTU2LTE2OTE1OTM1NTkxNTYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_101b2a58975e4fbab04423aeebe44864~mv2.png/v1/fill/w_823,h_555,al_c,q_90/090711_101b2a58975e4fbab04423aeebe44864~mv2.png" class="fr-fic fr-dii"></div><div type="image" data-hook="rcv-block27"><br></div><p>Figure 2. TCR comparison between HT602/603 containing polyimide and 7102/7082M containing non-polyimide resin.&nbsp;</p><div type="empty-line" data-hook="rcv-block29"><br></div><p>STOL (Short time overload) test was also performed to check how high power HT602 and HT603 could endure without resistance change. Chip resistor&rsquo;s standard criterion is less than +/- 1% of R change up to 2.5 times of desired operating voltage. Different size of HT resistor pattern was screen printed over Ag electrode as shown in Figure 3 and 0.5mm x 0.5mm printed resistor was used to monitor resistance deviation during STOL test. Test condition is 5sec dwelling time with step increase of voltage. Both HT602 and HT603 showed excellent stable resistance up to 200W/cm2 power density (Figure 4).</p><div type="empty-line" data-hook="rcv-block32"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTU5OTgwLTE2OTE1OTM1NTk5ODAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_29e7cbc68bea4e90b4309dd55b7276d8~mv2.png/v1/fill/w_641,h_673,al_c,lg_1,q_90/090711_29e7cbc68bea4e90b4309dd55b7276d8~mv2.png" class="fr-fic fr-dii" style="width: 624px;"></div><div type="image" data-hook="rcv-block33"><br></div><p>Figure 3. HT603 printed over Ag electrode on Alumina substrate for STOL test.</p><div type="empty-line" data-hook="rcv-block35"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTU5ODU1LTE2OTE1OTM1NTk4NTQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_a57ecf5c424e421d9b175b2464edff80~mv2.png/v1/fill/w_1136,h_568,al_c,q_90/090711_a57ecf5c424e421d9b175b2464edff80~mv2.png" class="fr-fic fr-dii"></div><div type="empty-line" data-hook="rcv-block37"><br></div><p>Figure 4. STOL test to check Resistance change with step-changing voltage (power density).</p><p><br></p><p><strong>HT702 dielectric</strong></p><p>To prevent mechanical damage or chemical oxidation of electronic circuits on Flex or Rigid PCB (printed circuit board), the protective layer is applied on top of the metalized circuit. &nbsp;A Conventional protective layer in the PCB industry is applied by photoimagible soldermask (typically epoxy material) on the rigid substrate or high-pressure assisted thermal lamination of Coverlay (polyimide with acrylic adhesive) on flex circuit. Both photoimaging of solder mask and coverlay lamination not only require multiple process steps but also generate waste of materials. The incumbent protective layers also have deficiencies on the material side; the thermoset epoxy solder mask is typically not flexible and coverlay contains acrylic adhesive which is not thermal resistant above 200&deg;C. &nbsp;</p><p>HT702 formulated with thermoplastic polyimide resin is more flexible than thermoset epoxy solder mask and has much higher thermal resistance than acrylic adhesive used in coverlay. The unique combination of flexibility and thermal resistance of HT702 is expected to create new applications in PCB industry where incumbent protective materials have a deficiency. In addition, direct printable HT702 dielectric ink can lower the overall cost of ownership by decreasing process steps and material waste. Good dielectric strength (BDV &gt; 0.5kV), excellent chemical resistance and excellent adhesion on various substrates are additional benefits of HT702. To achieve good dielectric strength and uniform coverage without pinhole defects, 2~3 printing and drying cycles are recommended. &nbsp;</p><p><strong>HT802 conductor</strong></p><p>HT802 is highly conducive and thermal-resistant ink formulated with silver powders and polyimide resin. High thermal/chemical resistant polyimide resin enables HT802 to be applicable to high-temperature applications such as electrodes for heaters or platable conductors where the plating process involves a caustic acid/base bath process. For example, figure 5(a) shows the HT802 electrode printed on 16in. x 16in. Kapton&reg; RS flexible heater. Uniform heating performance was achieved up to 240&deg;C (Figure 5(b)).&nbsp;</p><div type="empty-line" data-hook="rcv-block47"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTYwMzkwLTE2OTE1OTM1NjAzOTAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_9d9b14d321bc430fb26b20f4d99bd5f7~mv2.png/v1/fill/w_1312,h_540,al_c,q_90/090711_9d9b14d321bc430fb26b20f4d99bd5f7~mv2.png" class="fr-fic fr-dii"></div><div type="empty-line" data-hook="rcv-block49">Figure 5. (a) HT802 printed on Kapton&reg; RS film as an electrode for flexible heater fabrication. (b) Uniform heating up to 240&deg;C was demonstrated.&nbsp;</div><div type="empty-line" data-hook="rcv-block51"><br></div><p>Table 1 shows the performance of HT802 with different cure conditions. Resistivity decreased with higher cure temperatures while maintaining excellent adhesion on Kapton&reg; film. Interestingly, crease resistance also became better (lower % increase of electrical resistance) when HT802 was cured at higher temperatures. &nbsp;</p><div type="empty-line" data-hook="rcv-block53">Table 1. Resistivity, adhesion, and crease resistance of HT802 with cure condition. HT802 was screen printed on Kapton&reg; film.&nbsp;</div><div type="empty-line" data-hook="rcv-block56"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTU5NDIxLTE2OTE1OTM1NTk0MjAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_f1057c15757b49be87f225d832c50c73~mv2.png/v1/fill/w_1313,h_317,al_c,lg_1,q_90/090711_f1057c15757b49be87f225d832c50c73~mv2.png" class="fr-fic fr-dii"></div><div type="empty-line" data-hook="rcv-block58"><br></div><p><strong>Summary</strong></p><p>Micromax&trade; Electronic Inks and Pastes launched a new HT product line using noble Polyimide resin chemistry for high-temperature printed electronics applications. &nbsp;The unique combination of high thermal/chemical resistance, flexibility, and additive printability of HT inks is expected to provide solutions for various high-temperature applications on both flexible and rigid substrates. &nbsp;Visit our website: https://www.celanese.com/products/micromax to find a technical datasheet of HT products [2].</p><div type="paragraph" data-hook="rcv-block60"><strong>References</strong></div><div type="paragraph" data-hook="rcv-block62">[1] <a data-hook="linkViewer" href="https://www.marketsandmarkets.com/Market-Reports/printed-electronics-market-197.html?gclid=EAIaIQobChMIrY-Bu_CdgAMVBNzICh1yNA1FEAAYASAAEgKtI_D_BwE" target="_blank" rel="noopener noreferrer"><u>Printed Electronics Market Revenue Trends and Growth Drivers | MarketsandMarkets</u></a></div><div type="paragraph" data-hook="rcv-block63">[2] <a data-hook="linkViewer" href="https://www.celanese.com/en/products/micromax" target="_blank" rel="noopener noreferrer"><u>Micromax&trade; Electronic Inks and Pastes (celanese.com)</u></a></div><div type="empty-line" data-hook="rcv-block66"><br></div><p><a href="https://www.techblick.com/electronicsreshaped" target="_blank" rel="noopener noreferrer"></a></p><div data-hook="imageViewer" tabindex="0"><span contenteditable="false" class="fr-img-caption  fr-fic fr-dii fr-draggable" style="width: 758px;" draggable="false"><span class="fr-img-wrap"><a href="https://www.techblick.com/electronicsreshaped" target="_blank" rel="noopener noreferrer"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjkxNTkzNTYwODg4LTE2OTE1OTM1NjA4ODgucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_dc5d68d6d8a849f6a309f71aa7d483e3~mv2.jpg/v1/fill/w_1707,h_1707,al_c,q_90/090711_dc5d68d6d8a849f6a309f71aa7d483e3~mv2.jpg" class="fr-fic fr-dii" style="width: 758px;"><span class="fr-inner" contenteditable="true">Join us and the global community in Berlin on 17-18 OCT 2023. Lets RESHAPE the Future of Electronics together, making it Additive, Sustainable, Hybrid, Wearable and 3D. https://www.techblick.com/electronicsreshaped</span></a></span></span></div><p><br></p><div type="image" data-hook="rcv-block67"><br></div><p><br></p>

The key enabler for reliable device fabrication in printed electronics is functional inks with tunable electrical properties incl. conductivity, dielectric strength & electrical resistance. Here, you will learn about unique polyimide based pastes able to withstand temperatures up to 300°C. 

Innovative High-Temperature Inks for Printed Electronics

Castellation PCB is a type of printed circuit board (PCB) that has a series of small, plated through holes along the edges of the board. These holes are used to create a connection between the board and other components in a circuit. This article delves into the design, manufacturing, and testing processes involved in creating castellation PCBs, providing insights into the key considerations and guidelines that engineers and manufacturers should follow to optimize their designs for performance, reliability, and manufacturability.

Castellation PCB: A Comprehensive Guide to Design, Manufacturing, and Applications

<p id="isPasted">As part of the TechBlick (wwww.TechBlick.com) series we invited <a data-hook="linkViewer" href="https://www.linkedin.com/in/wladimirpunt/" id="isPasted" rel="noopener noreferrer" target="_blank"><u>Wladimir Punt</u></a> from Molex to tell us about how &nbsp;hybrid printed electronics can enhance function and manufacturing of wearable medical sensors.&nbsp; Here you wll learn about the trends, archirectures and challenges. Wladimir and his team at Molex are very well placed in this field, having had the opportunity to develop, prototype, and mass produce many wearable medical sensors over the years. This article was originally published on TechBlick<a href="https://www.techblick.com/post/smart-skin-patches-and-noninvasive-medical-sensing-molex" rel="noopener noreferrer" target="_blank">&nbsp;here.</a>&nbsp;</p><p>The advance of electronics miniaturization is opening new frontiers in Medtech, including in the field of adhesive skin patches. In the past, a skin patch might contain a single wired sensor. But today&rsquo;s smart skin patches incorporate a broader range of functions. Hybrid printed electronics permit a variety of electronic devices and noninvasive sensors to be affixed to a thin and flexible substrate, enabling designers to integrate sensors, microcontrollers, wireless connectivity and batteries into a capable, durable and connected device.&nbsp;</p><p>Whether in a clinical or home setting, this enables far more comprehensive patient monitoring. Adding enhanced capabilities to lightweight and flexible skin patches allows patients to go about their day while they (or their healthcare provider) monitor vital signs or activity noninvasively. There is tremendous potential for this flexibility to improve patient monitoring and make it simpler, more comfortable and more accessible.</p><div data-hook="rcv-block9" type="paragraph"><br></div><p><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"></a></p><div data-hook="imageViewer" tabindex="0"><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1690284990194-1690284990194.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_9f48526d064f49abb931769f58299b01~mv2.png/v1/fill/w_1231,h_298,al_c,lg_1,q_90/090711_9f48526d064f49abb931769f58299b01~mv2.png" class="fr-fic fr-dii"></a></div><div data-hook="rcv-block12" type="empty-line"><br></div><h3>The Evolving Need for Connected Medical Sensing</h3><div data-hook="rcv-block14" type="empty-line"><br></div><p>The demand for mobile, connected and noninvasive medical sensing capabilities is growing. During the COVID-19 pandemic, the need for hospitals and clinics to monitor patients remotely became clear. This capability did more than allow doctors to track their patients&rsquo; vital signs while maintaining social distancing &mdash; it also helped address hospital overcrowding and assisted in alleviating staffing issues. Smart skin patches have emerged as a lightweight, comfortable and portable method of monitoring patients both inside and outside a healthcare facility.&nbsp;</p><p>The market for home health monitoring is flourishing as well. With smart skin patches, home users can monitor their heart activity, temperature and muscle health. These devices can be used for monitoring sleep and brainwave activity, making the low profile and light weight nature of smart skin patches especially helpful. Skin patches are increasingly popular for femtech applications such as pregnancy monitoring as well.&nbsp;</p><p>Smart skin patches all use flexible printed circuit technology and safe skin contacting adhesive, but their design architecture varies depending on the application. Each skin patch design is customized and, depending on the need, can be disposable or reusable. Disposable and one-time-use skin patches have a flexible substrate, usually polyethylene terephthalate (PET), with the electronics affixed directly to the substrate. In reusable patches, the electronics are mounted inside a removable &ldquo;puck&rdquo; housing that mechanically and electrically connects to the substrate. The electronic components are reusable and only the electrodes in contact with the skin are disposable, reducing waste. This can, however, add logistics challenges and costs for the refurbishing process in some cases.</p><h3>Opportunities and Challenges of Smart Skin Patches</h3><div data-hook="rcv-block21" type="h3"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1690284989596-1690284989595.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_fe0334c255c64ef9b8d8fba7949a06f2~mv2.jpg/v1/fill/w_900,h_661,al_c,q_85/090711_fe0334c255c64ef9b8d8fba7949a06f2~mv2.jpg" class="fr-fic fr-dii" style="width: 578px;"></div><div data-hook="rcv-block24" type="image"><br></div><p>Designers of monitoring systems can leverage a wide range of smart skin patch feature options. The skin patch can include various types of electronic devices. One or more sensors can be fitted, including temperature sensors, chemical sensors, electrodes and even optical sensors. The skin patch can also include a battery, a microcontroller and a radio frequency (RF) antenna to maintain a wireless connection to the network.&nbsp;</p><p>These are the physical building blocks of the system, and to achieve a specific purpose designers can mix, match and customize them to meet performance targets. Different combinations of sensors and other devices can work with sophisticated software to noninvasively paint a picture of a patient&rsquo;s condition or vital signs.&nbsp;</p><p>Sounds simple, right? Alas, system reliability requires several different engineering disciplines. For example, material science is vital to ensure the substrate can accommodate the expected wear, yet also provide a secure anchor for the electronic components. The type of conductive paste and hydrogel must meet the system&rsquo;s requirements for manufacturability, shelf life and performance. Electronic components need to operate reliably during the expected lifetime of the product. Robust testing and validation are necessary to ensure product performance and support regulatory compliance.</p><h3>From Concept to Production</h3><p>Creating a smart skin patch means assembling multiple puzzle pieces to create a complete system. Collaborating with a company with decades of experience in this field is crucial. At Molex, several engineering disciplines work together to achieve a unified goal:</p><ul><li><p>Hybrid printed electronics desig</p></li><li><p>Material science</p></li><li><p>Wireless connectivity</p></li><li><p>Sensor integration</p></li><li><p>Prototyping</p></li><li><p>Testing and validation</p></li><li><p>Production</p></li><li><p>Packaging</p></li></ul><p>Involving Molex engineers from the earliest stages of the design process helps ensure the product meets performance specifications and manufacturing requirements. In addition to engineering expertise, Molex also offers global manufacturing capabilities to reduce supply chain risks and speed time to market.&nbsp;</p><p>The need for smart skin patches to improve patient wellness and outcomes is enormous and continues to grow. Our medical expertise and collaborative design approach coupled with our diversified supply chain, high-volume production capabilities and regulatory compliance experience (including ISO 13485 standards) enables Molex to support development of innovative skin patches that improve lives. Explore the benefits of this evolving technology - contact us about customized smart skin patch solutions.</p><h3>We exhibiting in Berlin on 17-18 OCT 2023. Join us, 78 other exhibitors, 68 presenters and 600+ peers.&nbsp;</h3><p>Lets RESHAPE Electronics Together, making it Additive, Sustainable, Flexible, and Wearable. <a data-hook="linkViewer" href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><u>Explore now www.techblick.com/electronicsreshaped</u></a></p><p><a data-hook="buttonViewer" href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" tabindex="0" target="_blank">Info &amp; Registration</a></p><p><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"></a></p><div data-hook="imageViewer" tabindex="0"><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1690284990355-1690284990355.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_bfe22a07dc6e40a7996e12e0eda33f46~mv2.jpg/v1/fill/w_1000,h_1000,al_c,q_85/090711_bfe22a07dc6e40a7996e12e0eda33f46~mv2.jpg" class="fr-fic fr-dii"></a></div><p><br></p><div data-hook="rcv-block50" type="image"><br></div><p><br></p>

Status and evolution of intelligent skin patches, enabled by flexible hybrid electronics, going from a single wired sensors to complex wireless multi-function capability. Learn about trends, archirectures and challenges from a manufacturer's point of view to understand how to design for production.

Smart Skin Patches and Noninvasive Medical Sensing

Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.

What is a Semiconductor? A Comprehensive Guide to Engineering Principles and Applications

Electronic circuit board with SiP technology

This article provides a detailed guide to System in Package technology, its advantages and challenges, key components, design, and manufacturing process. 

System in Package: A Comprehensive Guide to SiP Technology

Wafer backgrinding is a crucial step in semiconductor manufacturing, as it prepares the wafer for further processing and packaging. The procedure comprises the thinning of silicon wafers by scraping out material from the backside, which is crucial for enhancing the functionality and dependability of semiconductor devices. This article examines the wafer backgrinding procedure, its difficulties, and the significance of quality control in ensuring the production of high-quality semiconductor devices.

Wafer Backgrinding: An In-Depth Guide to Semiconductor Manufacturing

<div data-hook="post-title" id="isPasted" tabindex="-1"><p data-hook="post-title">This article is part of the TechBlick [www.TechBlick.com] series covering innovations in the amazing world of printed and additive electronics. Here, we hear from one of the main global manufacturers [Tapecon | <a href="https://www.tapecon.com/" id="isPasted" rel="noopener noreferrer" target="_blank">https://www.tapecon.com/</a>], discussing a key rising application: stick-to-skin wearable monitoring devices. This article first appeared <a href="https://www.techblick.com/post/revolutionizing-healthcare-the-rise-of-the-stick-to-skin-wearable-monitoring-devices" rel="noopener noreferrer" target="_blank">here </a>and the author is &nbsp; <a href="https://www.linkedin.com/in/casey-cephas-259a8892/" rel="noopener noreferrer" target="_blank">Casey Cephas &nbsp;</a></p></div><div data-hook="post-description"><article><div data-rce-version="9.11.0"><div data-id="rich-content-viewer" dir="ltr"><div data-hook="rcv-block1" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373125604-1688373125604.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_2c81169952854503a32904d5c4954611~mv2.png/v1/fill/w_1819,h_416,al_c,q_90/090711_2c81169952854503a32904d5c4954611~mv2.png" class="fr-fic fr-dii" style="width: 221px;"><span style='background-color: transparent; color: rgb(66, 66, 66); font-family: "PT Serif", serif; font-size: 19px;'>Healthcare is undergoing a transformative shift with the rise of stick-to-skin wearable monitoring devices. These innovative data-collecting marvels, such as continuous glucose monitoring devices and cardiac monitoring devices, offer a new level of convenience and real-time insights into our health status and wellbeing. This article explores the capabilities required, the diverse application areas, and the market trends that and driving the growth of this groundbreaking technology.</span></div><div data-hook="rcv-block3" type="paragraph"><br></div><div data-hook="rcv-block4" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373126201-1688373126201.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_e1ea9ec691614b68be5859ba6f1c8002~mv2.jpg/v1/fill/w_612,h_395,al_c,lg_1,q_80/090711_e1ea9ec691614b68be5859ba6f1c8002~mv2.jpg" class="fr-fic fr-dii" style="width: 616px;"></div><div data-hook="rcv-block5" type="image"><br></div><p><strong>Use Cases:&nbsp;</strong></p><p>Stick-to-Skin Wearable Monitoring Devices with flexible hybrid electronics find applications in a variety of areas within the life sciences and healthcare industry. For instance, continuous glucose monitoring devices enable individuals with diabetes to track their glucose levels throughout the day, promoting effective management of this chronic disease. Cardiac monitoring devices help monitor heart rate, heart rhythm, and other cardiac parameters, aiding in the detection and prevention of cardiovascular conditions. These devices exemplify the potential of stick-to-skin wearables to provide continuous, non-invasive monitoring for a wide range of healthcare needs.</p><div data-hook="rcv-block10" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373125711-1688373125711.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_5113486e98084dd79129852d9166526c~mv2.jpg/v1/fill/w_434,h_554,al_c,lg_1,q_80/090711_5113486e98084dd79129852d9166526c~mv2.jpg" class="fr-fic fr-dii" style="width: 329px;"></div><div data-hook="rcv-block11" type="image"><br></div><p><strong>Production Considerations:&nbsp;</strong></p><p>The production of stick-to-skin wearable monitoring devices necessitates a partner with a very unique set of capabilities. Flexible circuit fabrication is essential but ideally having the abilities to both advance TRL and MRL prototyping and proof of concept creation, as well as fully scaled roll-to-roll long-run manufacturing is the very best of both worlds. Flexible Hybrid Electronics enables the creation of thin, conformable hardware containing both printed electronics and traditional IC all on a flexible substrate. Sensor integration expertise is crucial for seamlessly incorporating sensors, such as biosensors, thermistors, or electrodes, into on-body compatible, FDA approved materials resulting in devices that are comfortable, lightweight, and conformable to the body. Additionally, knowledge of packaging techniques, wireless connectivity, and quality control and testing are vital to produce reliable and effective stick-to-skin wearables.</p><div data-hook="rcv-block13" type="paragraph"><br></div><div data-hook="rcv-block14" type="empty-line"><br></div><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373126163-1688373126163.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_790a28c801d34860bf10e62fa1ffad1b~mv2.png/v1/fill/w_1282,h_306,al_c,q_90/090711_790a28c801d34860bf10e62fa1ffad1b~mv2.png" class="fr-fic fr-dii"></div></a><div data-hook="rcv-block15" type="image"><br></div><p><em>We exhibiting in Berlin on 17-18 OCT 2023 - join us, 78 other</em>, <em>exhibitors, 68 presenters and 600+ peers.&nbsp;</em>Let&#39;s<em>&nbsp;RESHAPE Electronics &nbsp;Together, making it Additive, Sustainable, Flexible, and Wearable.&nbsp;&nbsp;</em><a data-hook="linkViewer" href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><em><u>Explore now www.techblick.com/electronicsreshaped</u></em></a>&nbsp;</p><div data-hook="rcv-block18" type="empty-line"><br></div><p><strong>Market Trends:&nbsp;</strong></p><p>The need for stick-to-skin wearable monitoring devices is on the rise driven in part by sharp demand for remote healthcare monitoring. These non-invasive, comfortable wearables allow individuals and their caregivers to monitor their health conditions from the privacy and comfort of their homes. The increasing prevalence of chronic diseases and the desire to be proactive in monitoring and maintaining a heahealthythy lifestyle at any age necessitates solutions that provide continuous, remote monitoring, making stick-to-skin wearables a valuable asset. Particularly our aging population seeks healthcare solutions that support independent living, but family members and loved ones don&rsquo;t always live nearby. This makes FHE wearables indispensable for ensuring the well-being of older adults. Technological advancements, wellness and fitness tracking trends, and integration with digital health ecosystems are further propelling adoption.</p><div data-hook="rcv-block20" type="paragraph"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373125895-1688373125895.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_e73da94ae1ea400798c244ee26d965a3~mv2.jpg/v1/fill/w_834,h_451,al_c,q_85/090711_e73da94ae1ea400798c244ee26d965a3~mv2.jpg" class="fr-fic fr-dii" style="width: 709px;"></div><div data-hook="rcv-block22" type="image"><br></div><div data-hook="rcv-block23" type="empty-line"><br></div><p><strong>Forecasted Market Growth:&nbsp;</strong></p><p>Over the next 5-10 years, the market for stick-to-skin wearable monitoring devices is poised for significant growth. Market research reports project the industry will experience a very robust compound annual growth rate (CAGR) averaging 12-16% during this period. Contributing factors include increasing awareness of wearable technologies, advancements in sensor technologies, rising healthcare expenditures, and supportive government initiatives. The COVID-19 pandemic has also accelerated the adoption of remote monitoring solutions, further driving the market growth of stick-to-skin electronics-based wearables. Stick-to-skin wearable monitoring is revolutionizing healthcare by offering continuous, non-invasive monitoring capabilities. With their diverse applications in chronic disease management and general wellness tracking, wearables empower individuals to actively monitor their health and make informed decisions. Ongoing technological advancements in this field will play a pivotal role in transforming healthcare delivery and improving patient outcomes.</p><h3>Join us in Berlin to RESHAPE Electronics making it Additive, Flexible, and Wearable. Explore the program now <a data-hook="linkViewer" href="http://join/" rel="noopener noreferrer" target="_blank"><u>www.techblick.com/electronicsreshaped</u></a></h3><div data-hook="rcv-block27" type="h3"><br></div><div data-hook="rcv-block28" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1688373126116-1688373126116.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_95e4a5b16bce45d7a4b0f791e0150298~mv2.jpg/v1/fill/w_1707,h_1707,al_c,q_90/090711_95e4a5b16bce45d7a4b0f791e0150298~mv2.jpg" class="fr-fic fr-dii"></div><div data-hook="rcv-block29" type="image"><br></div><div data-hook="rcv-block30" type="empty-line"><br></div><div data-hook="rcv-block-last" type="last"><br></div></div></div></article></div><div data-hook="post-main-actions-desktop"><br></div>

Healthcare is undergoing a transformative shift with the rise of stick-to-skin wearable monitoring devices. These data-collecting marvels, such as continuous glucose or cardiac monitoring devices, offer convenience & real-time insights.This article explores capabilities, applications & market trends

Revolutionizing Healthcare: The Rise Of The Stick-To-Skin Wearable Monitoring Devices

<div data-hook="post-title" id="isPasted" tabindex="-1"><p data-hook="post-title">In wearables, the design on paper often does not work in practice. In this world, your idea may only go as far as your chosen contract manufacturer can take you. It is the key role of the contract manufacturers to help you make the vital adjustments and help you realize your products.&nbsp;</p><p data-hook="post-title">For this article we invite<a href="https://www.linkedin.com/in/scottlavine/" rel="noopener noreferrer" target="_blank">d Scott Lavine</a> from <a href="https://conductivetech.com/" rel="noopener noreferrer" target="_blank"><strong>Conductive Technologies</strong></a> Inc to explain more on the key role of contract manufacturers in developing wearable and flexible product.&nbsp; This article originally appeared<a href="https://www.techblick.com/post/how-far-can-we-flex" rel="noopener noreferrer" target="_blank">&nbsp;here.</a></p><p data-hook="post-title"><br></p></div><div data-hook="post-description"><article><div data-rce-version="9.11.0"><div data-id="rich-content-viewer" dir="ltr"><h3>The Role of the Contract Manufacturer in the Wearables Market.</h3><div data-hook="rcv-block1" type="h3"><br></div><p>In the world of wearables, your idea may only go as far as the contract manufacturer you chose to partner with can take it. &nbsp;Taking a concept from the lab to commercialization frequently requires a number of adjustments. &nbsp;Working with a contract manufacturer who has the flexibility to make adjustments in order to bring your product to market may be the difference between commercial success and failure.</p><p>A wearable sensor design, at its basic concept, consists of conductive inks printed on a substrate. &nbsp;In the manufacturing world, a basic concept can quickly turn into a complicated process. The contract manufacturer needs to marry all the aspects of a design together in order to create the perfect component.</p><div data-hook="rcv-block5" type="paragraph"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3ODUyODQzNjU2LTE2ODc4NTI4NDM2NTYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_f506854ff341475e9d5bd75c11c49f09~mv2.jpg/v1/fill/w_1920,h_400,al_c,q_85/090711_f506854ff341475e9d5bd75c11c49f09~mv2.jpg" class="fr-fic fr-dii"><br></div><div data-hook="rcv-block6" type="empty-line"><br></div><p><strong>Conductive Inks</strong></p><p>Your wearable product will call for a conductive ink made of carbon or silver and possibly with a dielectric ink as an insulator. &nbsp;The first instinct with a wearable may be to go with inks that provide the most elasticity. &nbsp;This sounds like it would make sense especially if the wearable is intended to move with the person&rsquo;s body. &nbsp;Even the most elastic of inks start to break down as they are stretched. &nbsp;There are many factors that go into selecting the correct inks. &nbsp;Partnering with a contract manufacturer with established ink vendor relationships, experience in the manufacturing of wearables, and enough experience to identify design change is important to the success of your product.</p><div data-hook="rcv-block8" type="paragraph"><br></div>&nbsp;<a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"></a><div data-hook="imageViewer" tabindex="0"><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3ODUyODQzODMwLTE2ODc4NTI4NDM4MzAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_53ff0a0434aa4a5caa159f56cecb8a17~mv2.jpg/v1/fill/w_868,h_214,al_c,lg_1,q_80/090711_53ff0a0434aa4a5caa159f56cecb8a17~mv2.jpg" class="fr-fic fr-dii" style="width: 758px;"><span class="fr-inner" data-dl-input-translation="true">Conductive Technologies Inc and the entire global community will be in Berlin on 17-18 OCT 2023 to RESHAPE Electronics, making it Wearable, Flexible, and Additive. &nbsp;Explore the programme and book your meetings now to take your next products from concept to pilot to mass production.</span></span></span></a><div id="isPasted"><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"></a><a target="_blank"></a><a target="_blank">https://www.techblick.com/electronicsreshaped</a></div></div><div data-hook="rcv-block12" type="empty-line"><br></div><p><strong>Substrates</strong></p><p>The substrate, or the base material that the sensor is printed on, is a key component to the design of a wearable device. &nbsp;Chosen based on flexibility, durability, or other physical characteristics, the substrate in the planned design may not be compatible with the manufacturing process. &nbsp;So, what do you do now? &nbsp;Your contract manufacturer should have experience with a number of substrates and be able to recommend other materials/</p><div data-hook="rcv-block16" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3ODUyODQ0NDg2LTE2ODc4NTI4NDQ0ODYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/090711_e3f442731b474f678e145883a1cbb589~mv2.jpg/v1/fill/w_1200,h_969,al_c,q_85/090711_e3f442731b474f678e145883a1cbb589~mv2.jpg" class="fr-fic fr-dii"></div><div data-hook="rcv-block17" type="image"><br></div><p><strong>Carriers</strong></p><p>Projects may require, either by design or as a design change during manufacturing, to have the conductive printing applied to an image carrier and then transferred to a substrate. &nbsp;You may find that the substrate used in prototyping doesn&rsquo;t work in the actual manufacturing process. &nbsp;Issues can arise tied to the thickness of the substrate or the ability of the substrate to tolerate the temperature required for the drying process. &nbsp;The design of the housing for the printed sensor may not be flat and a carrier with an adhesive would be required in order to print the sensor and then attach it to the housing.</p><p><strong>More than Printers</strong></p><p>When considering contract manufacturers for your product, it is important to identify all of the capabilities that one vendor can provide. &nbsp;While it&rsquo;s not always possible, it is preferable to have one vendor complete as much of the manufacturing and assembly process as possible.</p><p>The contract manufacturer you pick should have both clean rooms and environmentally controlled rooms available. &nbsp;Environmental contamination from either debris or temperature and/or humidity can damage or degrade printed electronics if they are not stored or handled properly during the manufacturing, assembly, packaging, or shipping processes.&nbsp;</p><div data-hook="rcv-block25" type="empty-line"><br></div><p>Lastly, but likely the most important is that your contract manufacturer be compliant with FDA 21 CFR Part 820 and certification to ISO 13485 ensures their ability to assist your company&rsquo;s medical device project along the path to FDA clearance.&nbsp;</p><p><strong>Conclusion &nbsp;</strong></p><p>The adage, &ldquo;You don&rsquo;t know what you don&rsquo;t know&rdquo; holds true when taking a wearable design from prototype to full-scale commercialization this is all the more reason to pick the contract manufacturer who knows what you don&rsquo;t. &nbsp;</p><hr>Conductive Technologies Inc and the entire global community will be in Berlin on 17-18 OCT 2023 to RESHAPE Electronics, making it Wearable, Flexible, and Additive. Explore the programme and book your meetings now to take your next products from concept to pilot to mass production.<div id="isPasted"><a target="_blank"></a><a target="_blank">https://www.techblick.com/electronicsreshaped</a></div><div data-hook="rcv-block31" type="paragraph"><br></div><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><div data-hook="imageViewer" tabindex="0"><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg3ODUyODQ0Mzg3LTE2ODc4NTI4NDQzODcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/634751_85c56031946043f1971e0c4602c1abfe~mv2.jpg/v1/fill/w_1280,h_1280,al_c,q_85/634751_85c56031946043f1971e0c4602c1abfe~mv2.jpg" class="fr-fic fr-dii"><span class="fr-inner" data-dl-input-translation="true">Image Caption</span></span></span></div></a><div data-hook="rcv-block32" type="image"><br></div><div data-hook="rcv-block33" type="empty-line"><br></div><div data-hook="rcv-block-last" type="last"><br></div></div></div></article></div><div data-hook="post-main-actions-desktop"><br></div>

In wearables, the design on paper often does not work in practice. In this world, your idea may only go as far as your chosen contract manufacturer can take you. It is the key role of the contract manufacturers to help you make the vital adjustment to make your product a success.

How far can we flex?

<div data-hook="post-title" id="isPasted" tabindex="-1"><p data-hook="post-title">As part of our series, TechBlick has invited <a href="http://linkedin.com/in/sandra-lepak-kuc-5a333b75" rel="noopener noreferrer" target="_blank">Sandra Lepak-Kuc</a> from Warsaw University to discuss the trends towards sustainable materials in additive electronics and to share their insights on the development of printable graphene pastes for printing on paper to produce disposable electronics. This article originally appeared<a href="https://www.techblick.com/post/sustainable-printed-electronics-warsaw-university" rel="noopener noreferrer" target="_blank">&nbsp;here&nbsp;</a></p></div><div data-hook="post-description"><article><div data-rce-version="9.11.0"><div data-id="rich-content-viewer" dir="ltr"><p><strong>Print Intelligence: &nbsp;<em>Print innovative, print smart, print sustainable, print green</em></strong></p><p><em>Why?&nbsp;</em>In recent years, sustainable printed electronics have gained tremendous interest in both science and industry. Novel electronics focus on enhancing environmental friendliness while maintaining functionality. Researchers are exploring materials and manufacturing techniques that enable the production of biodegradable or recyclable electronic components, reducing electronic waste and its impact on the environment.&nbsp;</p><div data-hook="rcv-block10" type="empty-line"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1687851950656-1687851950656.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_6eebe4e223cc408ab873f4d2f2d64d01~mv2.jpg/v1/fill/w_1046,h_545,al_c,q_85/090711_6eebe4e223cc408ab873f4d2f2d64d01~mv2.jpg" class="fr-fic fr-dii"></div><div data-hook="rcv-block11" type="image"><br></div><div data-hook="rcv-block12" type="empty-line"><span class="fr-img-caption fr-fic fr-dib" style="width: 739px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1687852203719-Warsaw+University+%28BERLIN-Oct-2023%2950+%281%29.jpg" style="width: 737px;" class="fr-fic fr-dib"><span class="fr-inner" data-dl-input-translation="true">We will be exhibiting together with 77 other exhibitors in Berlin (17-18 OCT 2023). &nbsp;Lets RESHAPE Electronics Together, making it Additive, Sustainable, and Wearable. Explore the programme and plan your visit now. Learn more&nbsp;<a href="https://www.techblick.com/electronicsreshaped" id="isPasted" rel="noopener noreferrer" target="_blank">https://www.techblick.com/electronicsreshaped</a></span></span></span></div><p><em>Where particularly?</em> Some of the most dominant subjects involved in this trend are those related to materials and methods in <strong>biomedical applications</strong>. Rapid advances in medical technology have historically contributed to significant improvements in patient healthcare. The challenge is to develop modern or improved methods of preventive care. It will also allow to reduce the cost of instrumentation, as well as its deterioration and maintenance expenses.</p><p>Very often, disposable products are desired in biomedical applications. Their main advantages are that they do not require disinfection and reduce the risk of spreading pathogens[1]. The COVID pandemic has further escalated the emphasis on single-use products, both due to the increased awareness of pathogen risk and simultaneously by spreading and improving telemedicine, which has become a permanent part of private and public healthcare[2,3].</p><p><em>Why there?&nbsp;</em>In addition to several&nbsp;advantages of disposable appliance components, their disadvantages are increasingly being highlighted. The environmental aspect is recognized as one of the biggest. In the case of ECG electrodes, for example, the solutions currently proposed on the medical market, both traditional and modern disposable ones, are based on substrates made of materials such as PET or PE and sensors or conductive pathways made of Ag/AgCl. These materials are not environmentally&nbsp;friendly. They are not biodegradable, and their combustion produces harmful gases[4].</p><p>In the stream of pro-environmental actions mentioned above, an attempt to replace precisely these materials with environmentally friendly, biodegradable, and biocompatible ones would seem the right course[5,6].</p><p><em>What do we need?</em> Challenges are not only directed toward obtaining an electrically conductive layer from recyclable materials. Many more factors are required. It is essential to ensure printability, preferably by methods allowing large-scale printing. Ensuring recyclability of both the print and the substrate. Ensuring proper adhesion of the print to the substrate. Ensuring functionality under complex conditions - as in the above-given example of ECG, the need to work in contact with the human body, sometimes under various external conditions - temperature, exposure to UV light, or humidity (sweat). Moreover, in the case of electronics dedicated to medical applications, it is also necessary to meet the relevant specific standards.</p><p><em>HOW?</em> Alternative materials are being explored that, in between being suitable for printing techniques and having their functionalities, are being made sustainable and less harmful to the environment. This includes using biodegradable substrates, such as cellulose-based materials, instead of traditional non-biodegradable substrates, such as plastic. However, it is a key issue to produce sustainable printing pastes alongside substrates. These are being challenged with increasing demands, the fulfillment of which is often a complex matter, requiring unconventional approaches and innovative ideas.</p><p>In our research, we go beyond the usual patterns and use materials not previously associated with electronics. These are often unsuccessful attempts, often time-consuming, necessitating unusual methodological solutions. Nevertheless, <strong>we have successfully printed graphene pastes based on sodium alginate and glycerine on paper. Subjecting them to cytotoxicity tests showed a total lack of toxic effect of the obtained structures on living cells.&nbsp;</strong></p><p><strong>Pastes based on glycerine and various reagents such as gelatine, modified starch or xanthan gum. A huge difficulty we encountered was that such materials often did not allow us to achieve the right rheology for screen printing and thus the relevant printability in this method.</strong></p><div data-hook="rcv-block33" type="paragraph"><br></div><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1687851951289-1687851951289.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_735b363209e64a2a85b587a82072a90b~mv2.jpg/v1/fill/w_1000,h_515,al_c,q_85/090711_735b363209e64a2a85b587a82072a90b~mv2.jpg" class="fr-fic fr-dii"></div><div data-hook="rcv-block36" type="image"><br></div><p><em>Fig. 1. Digital microscope photographs of prints on paper (b-f) photos of conductive paths in selected positions as marked in (a);</em></p><div data-hook="imageViewer" tabindex="0"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1687851950444-1687851950444.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_0d19d168448d4e61aae8ba88543f2076~mv2.jpg/v1/fill/w_1000,h_452,al_c,q_85/090711_0d19d168448d4e61aae8ba88543f2076~mv2.jpg" class="fr-fic fr-dii"></div><div data-hook="rcv-block39" type="image"><br></div><p><em>&nbsp;Fig. 2. Metabolic activity of L929 cells treated with sodium alginate, glycerol and graphene layer extract on a paper substrate compared to a negative control (paper). XY plot (GraphPad Prism 9.5.0)</em></p><div data-hook="rcv-block41" type="paragraph"><br></div><p><em>The goal?</em> Our research aims to develop a range of available solutions that will make the greatest possible contribution to protecting the environment and saving the climate.</p><div data-hook="rcv-block44" type="paragraph"><span class="fr-img-caption fr-fic fr-dii" style="width: 758px;"><span class="fr-img-wrap"><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1687851951373-1687851951373.png" alt="" data-pin-media="https://static.wixstatic.com/media/090711_f1cc269175174493904c6873569e3f82~mv2.png/v1/fill/w_1197,h_673,al_c,q_90/090711_f1cc269175174493904c6873569e3f82~mv2.png" class="fr-fic fr-dii"><span class="fr-inner" data-dl-input-translation="true"><span contenteditable="true" data-dl-input-translation="true" id="isPasted">We will be exhibiting together with 77 other exhibitors in Berlin (17-18 OCT 2023). &nbsp;Lets RESHAPE Electronics Together, making it Additive, Sustainable, and Wearable. Explore the programme and plan your visit now. Learn more&nbsp;<a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank">https://www.techblick.com/electronicsreshaped</a></span></span></span></span></div><p>Ultimately, we aim to obtain electrodes (e.g., for ECG) and other electronic structures that are <strong>environmentally friendly</strong>, <strong>recyclable,</strong> or even <strong>compostable</strong>. Ones that could be rinsed under the tap or thrown into the fireplace and burned. The road may be long and complicated, but it is an effort worth taking.</p><p>[1] C. Bloe, Br J Nurs 30 (2021) 628&ndash;633.</p><p>[2] G.B. Colbert, A.V. Venegas-Vera, E.V. Lerma, Rev Cardiovasc Med 21 (2020) 583&ndash;587.</p><p>[3] J. Portnoy, M. Waller, T. Elliott, J Allergy Clin Immunol Pract 8 (2020) 1489&ndash;1491.</p><p>[4] K. Sovov&aacute;, M. Ferus, I. Matulkov&aacute;, P. &Scaron;paněl, K. Dryahina, O. Dvoř&aacute;k, S. Civi&scaron;, Molecular Physics 106 (2008) 1205&ndash;1214.</p><p>[5] Z. Fang, H. Zhang, S. Qiu, Y. Kuang, J. Zhou, Y. Lan, C. Sun, G. Li, S. Gong, Z. Ma, Advanced Materials Technologies 6 (2021) 2000928.</p><p>[6] C. Zhang, R. Cha, P. Zhang, H. Luo, X. Jiang, Chemical Engineering Journal 430 (2022) 132562.</p></div></div></article></div>

Additive electronics is intrinsically more sustainable than subtractive processes. Yet the current materials are often based on metallic inks and plastic substrates. This is a particular issue in medical wearables with disposable devices. Hence the need to develop sustainable material options

Sustainable Printed Electronics: Green Materials for Wearable Applications

Printed Circuit Boards (PCBs) are the backbone of electronic devices, providing a platform for connecting and supporting various electronic components. They are found in a wide range of applications, from simple gadgets to complex systems such as computers and communication devices. This article explores the components of a PCB, delving into the materials used, the various electronic components, design considerations, manufacturing processes, and testing and quality control methods. 

Components of a PCB: A Comprehensive Guide

<p id="isPasted">Mass manufacturing electronic textiles and in doing so combining textile fibers/garments as well as textile based wiring and sensors with PCB electronics is no easy task. A critical manufacturing challenge here has always been the creation of a reliable high-quality connection between textile wiring/sensors and PCBs/rigid components using a mass manufacturing machine. ZSK has innovated to solve this issue for embroidered electronic textiles. &nbsp;This article originally appeared <a href="https://www.techblick.com/post/embrioded-electronic-textiles-solving-the-textile-to-pcb-and-ecosystem-challenges" rel="noopener noreferrer" target="_blank">here.</a></p><p>ZSK will be exhibiting in Berlin at TechBlick&#39;s event on RESHAPING ELECTRONICS. &nbsp;Please join us and the entire global community on 17-18 OCT 2023. Lear more here <a data-hook="linkViewer" href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><u>https://www.techblick.com/electronicsreshaped</u></a>&nbsp;</p><div data-hook="rcv-block3" type="paragraph"><br></div><p><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"></a></p><div data-hook="imageViewer" tabindex="0"><a href="https://www.techblick.com/electronicsreshaped" rel="noopener noreferrer" target="_blank"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjg2MTI2MjU3ODA0LTE2ODYxMjYyNTc4MDQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" data-pin-media="https://static.wixstatic.com/media/634751_9cf1c10eb91548198a7b527d61b55af7~mv2.jpg/v1/fill/w_1135,h_281,al_c,lg_1,q_80/634751_9cf1c10eb91548198a7b527d61b55af7~mv2.jpg" class="fr-fic fr-dii"></a></div><p><br></p><div data-hook="rcv-block6" type="image"><br></div><p><strong>Solving the textile-to-PCB connection issue</strong></p><p>As you can see in slide [1], typically PCBs do not lend themselves well to embroidery of electronics. This is because one often has loose connections, because the high thickness and the sharp edges act as failure points and because the large holes allow movement which loosens the connections. This means that it is not easy to achieve automatic manufacturing with standard PCBs in a reliable way.</p><p>This is why - as shown in slide [2] - ZSK developed the ZSK E-Tex-Board, which addresses the above mentioned issues, optimizing the board geometry (hole size, smooth edges, thickness, outer line design, etc) for mass embroidered e-textiles combining textiles wiring/sensors with PCBs.&nbsp;</p><p>As shown in slide [3], these special boards are also compatible with automatic placement machines, enabling a fully automatic manufacturing of e-textiles. This is an important step towards the realization of mass embroidered electronic textiles.&nbsp;</p><p>These PCBs - together with the ZSK&rsquo;s F-head for their embroidery machine - enable interesting opportunities. In the F-head, one can embroider the conductive threads with textile/garment to create wiring in the textiles. Using this head, one can also embroider insulating areas as needed, creating cross-overs which vastly improve wiring possibilities in tight spaces.&nbsp;</p><p>An example of a full system with embroidered conductive threads [wires] as well as crossovers and a stitched PCBs are shown in slide [3], showing how these innovations bring the entire system together, from conductive yarns to insulating to textile garments to PCBs and electronic components like LEDs etc</p><div data-hook="rcv-block18" type="paragraph"><br></div><p><strong>Solving the ecosystem issue</strong></p><p>ZSK has multiple other embroidery heads for different purposes [K-head for ECG and other sensors based on the moss embroidery and W-head for laying down tubes, fibers etc]. What is however of importance in our view is that they also offer business model innovation</p><p>They have correctly realized that the e-textile ecosystem is still immature and full of players each offering only a small part of the full system, which makes it very difficult for a potential end user to develop projects.&nbsp;</p><p>To this end, they have launched 3E Smart Solutions - an in-house engineering team - to help companies develop their ideas, prototype them, find manufacturing partners, etc. This fills an important void and we expect will accelerate the development of this industry &nbsp;</p><div data-hook="rcv-block28" type="empty-line"><br></div><div data-hook="galleryViewer"><div data-key="pro-gallery-inner-container" tabindex="-1"><div data-hook="item-link-wrapper" data-id="6cf29513-5f7f-4179-8b8a-06517f1e9ccb_0" data-idx="0" tabindex="-1"><div data-hash="6cf29513-5f7f-4179-8b8a-06517f1e9ccb_0" data-hook="item-container" data-id="6cf29513-5f7f-4179-8b8a-06517f1e9ccb_0" 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Mass manufacturing electronic textiles and in doing so combining textile based wiring and sensors with PCB electronics is no easy task. In this article, you will learn about an innovative approach to enable embriodery of PCBs and conductive wiring/sensors in mass produced e-textiles 

Embrioded Electronic Textiles: Solving the textile-to-PCB and ecosystem challenges

Die attach, also known as die bonding or die mount, is a process used in the semiconductor industry to attach a silicon chip to the die pad of a semiconductor package's support structure, such as a leadframe or metal can header. This article explores the fundamentals of die attach, its importance, materials, and methods used in die attach, its parameters, quality, and reliability techniques.

Die Attach: A Comprehensive Guide

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