In this article, we will go over everything you need to know about PCB stencils.
Approximately 7% of the world's gold can be found inside discarded electronic devices, in form of PCB Gold Fingers. While a tonne of Gold Ore produces just 5 grams of pure gold on average, a tonne of electronic scrap can house 300 grams of gold inside it. Here we gloss over the significance of gold fingers in the present day electronics industry and all kinds of gold fingers specifications you need to know.
The PCB manufacture process is a complex procedure that requires copious crucial steps, beginning from the design stage to packaging and delivery. Computer-guided tools and automated machines are employed in the PCB fabrication process to ensure accuracy and efficiency, with many quality checks to guarantee high-performing standard PCBs. This article journeys through the requisite steps in the PCB manufacturing process, detailing the procedures involved in each.
If the PCB is exposed to external contaminants, it will lead to overheating or corrosion to degrade the performance.
A unique new approach of printing functional materials with unparallel precision and repeatability. Technology called Ultra-Precise Deposition (UPD) is a nanodispensing method capable to print high density and high viscous materials with the resolution down to 1 µm in feature size and with high ratio of width to height after single pass. For this method material extrusion is controlled by a pressure, which means it is not supported with high electric field. Thanks to this there are no limitation if the substrate is conductive or dielectric.
Nano-Ops is commercialising an automated wafer-based process and fab-in-a-box based on the directed assembly technology which can 'print' features down to 20nm. Here, In the first step a pattern is first etched into a template wafer.
As wearable electronic devices continue to be more prevalent, it becomes an ever-greater challenge for companies that manufacture them to keep their competitive edge. It is vitally important for manufacturers that each device is effective, cost-efficient and reflects the highest quality available.
Circuit card assemblies (CCA) give birth to a complete printed circuit board (PCB) after assembling every component. A printed circuit board has no electrical components and needs to go through a manufacturing process called circuit card assemblies which are the complete board assembly. This article covers all the essential information you need to know about circuit card assembly, including its types and steps, as well as the fundamental electronic components required for the circuit card assembly.
Carnegie Mellon University collaborators pioneer the CMU Array—a customizable, 3D nano-printed, ultra-high-density microelectrode array platform for next-generation brain-computer interfaces. This technology can transform the way doctors are able to treat neurological disorders.
Printed batteries offer thinness and flexibility, enabling new applications, but their production is deceivingly complex. Gunter Hübner from Stuttgart Media University offered some insights at the e-Swiss conference last week.
Experimenting in the world of Flexible Hybrid Electronics (FHE) comes with a variety of hurdles. Printing technologies are vastly different in terms of materials compatibility and have pros and cons that make them suitable for particular applications. Choosing materials that match the printing technology you intend to use is the most important decision you’re going to make. But what if one could print, digitally, using any paste and ink on any substrate? Read more
IC (integrated circuit) packaging types are varieties of protective cases that insulate semiconductor components from the effects of physical impact and corrosion. There are different types of integrated circuit packages, grouped into different classifications, discussed in this article.
Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.