Semiconductors

Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.

What is a Semiconductor? A Comprehensive Guide to Engineering Principles and Applications

You finish a design and feel good about it. Then, in the next review, you find that a key requirement changed last week.This is one of the most frustrating parts of electronics development—and it happens everywhere. It’s not due to a lack of skill or discipline. It’s that critical information often lives outside the design environment, scattered across spreadsheets, PDFs, or buried in shared folders. By the time the update reaches everyone, it’s already too late.And the later those errors are discovered, the more expensive they become. According to a study by <a href="https://ntrs.nasa.gov/api/citations/20100036670/downloads/20100036670.pdf">NASA Johnson Space Center</a>, the cost of fixing a requirements-related mistake grows exponentially over the course of development—from a few hours early in the design phase to weeks or even months once hardware is built.<h3>The Spreadsheet Trap</h3>Spreadsheets work—until they don’t. As projects scale, version conflicts multiply, ownership blurs, and small errors turn into costly rework.According to Altium’s <a href="https://resources.altium.com/p/requirements-management-guide">Requirements Management for Electronics Teams</a>, more than 50% of electronics engineers still use spreadsheets and documents to manage and share requirements, even when their companies have an enterprise “system of record.” It’s familiar, but fragile. It slows everyone down and creates quality, performance, and compliance risks.This is why projects slip. Not because engineers make bad decisions, but because they make good ones based on outdated information.<h3>Disconnected Decisions</h3>Even teams with formal requirements systems, like DOORS, Jama, Polarion, or Teamcenter, still struggle. These platforms are treated as repositories, not workspaces. Requirements live there, but engineering design happens somewhere else. To move faster, teams export data into spreadsheets—where traceability disappears.Designers start working from old specs. Managers lose sight of what’s verified or at risk. Verification engineers spend hours chasing evidence right before an audit. Each group does its best, but the bigger picture stays fragmented.<h3>Traceability as Visibility</h3>Traceability means visibility. It means knowing exactly how a requirement was implemented in a design, how it was tested, built, and shipped. .When that visibility exists, there’s no guessing. Teams see what’s complete, how their work connects to the larger system, and what is affected when a requirement inevitably changes.For systems engineers, that means requirements flow clearly downstream.For project managers, it means live awareness of progress without chasing updates.And for engineers, it means fewer surprises and faster, more confident decisions.Instead of experts managing requirements in a separate and siloed enterprise system, team-members work with requirements obviously displayed in context, directly in their design environment — no extra integrations and tools to maintain, no swapping screens or jumping between apps.<h3>Bringing Requirements Where Design Happens</h3>Altium Develop brings <a href="https://www.altium.com/capabilities/requirements">requirements </a>into electronics designs. The creators who develop electronics interact with requirements in the same space where they design, review, and verify.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1760433188758-1st+image.png" style="width:100%px" class="fr-fic fr-dib" />View requirements alongside schematics and PCB layouts to make more confident design decisions.Teams can import requirements from existing documents and view them alongside schematics and layouts. Each requirement can be linked directly to a design feature, component, or layout element—so every specification has a clear, traceable connection to the hardware.When some part of the system, specification, or hardware design changes, the team sees it in real time. Verification stays in sync automatically, and documentation follows without extra effort. For engineering teams focused on requirements-driven development, requirements transform from static checklists to essential tools that orchestrate the whole design process. <h3>From Verification to Confidence</h3><a href="https://www.altium.com/capabilities/requirements/verification-validation">Verification </a>used to mean late-stage documentation and manual traceability reports. With Altium Develop, it happens as a natural byproduct of the development process.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1760433214521-2nd+image.png" style="width:100%px" class="fr-fic fr-dib" />Generate compliance documentation from live data in minutes to smoothen project handoffs and audits.Audit-ready traceability matrices and verification reports are generated directly from live data. Version histories record every change to the design or the requirements. Nothing gets lost, and no one has to rebuild evidence from scratch, as a separate, time-consuming work effort.In regulated industries like medical, aerospace, and automotive—where traceability isn’t optional—this kind of workflow doesn’t just save time. It strengthens confidence that what was designed and manufactured is exactly what was intended to save lives, blast off into space, or safely transport passengers to their destinations. <h3>A Simpler, Smarter Way Forward</h3>Requirements traceability shouldn’t be complex or expensive. It just needs to exist where engineers actually work.Altium Develop gives teams that native capability—bringing requirements, design, and verification into one connected workspace. The result is complete confidence in fewer errors, less rework, and faster delivery.Discover how Altium Develop connects requirements, design, and verification at<a href="https://www.altium.com/develop"> altium.com/develop</a>.

The Hidden Cost of Missed Requirements

Requirements That Work: Why Traceability Matters More Than Ever

An insight into applying color codes for electrical applications. This guide enlightens engineers and designers about standard color codes for resistors, inductors, capacitors, network cabling and power wiring to help improve accuracy, safety and maintainability in design projects.

Circuit Color Chart: A Comprehensive Guide for Engineers

When designing a printed circuit board (PCB), one of the most critical aspects to consider is the spacing between conductive elements, such as traces and pads. Trace-to-pad clearance, often referred to as the distance between a trace and a pad, plays a vital role in ensuring the reliability, safety, and performance of your PCB. In this comprehensive guide, we’ll dive deep into the essentials of trace-to-pad clearance, including minimum spacing guidelines, industry standards like IPC 2221, and practical tips for optimizing your PCB layout. Whether you’re a beginner or a seasoned engineer, this blog will equip you with the knowledge to design better PCBs.At its core, trace-to-pad clearance is the minimum distance required between a conductive trace and a pad to prevent electrical issues like short circuits, arcing, or signal interference. This spacing depends on factors such as voltage levels, environmental conditions, and manufacturing capabilities. By adhering to proper guidelines, like those outlined in IPC 2221 standards, you can ensure your design is safe and functional. Let’s explore this topic in detail to help you master PCB clearance trace to pad requirements.<h2>What Is Trace-to-Pad Clearance in PCB Design?</h2>Trace-to-pad clearance refers to the physical distance between a conductive trace (a pathway for electrical signals on a PCB) and a pad (the metal area where components are soldered). This spacing is crucial because it prevents unintended electrical connections, reduces the risk of arcing in high-voltage designs, and minimizes crosstalk in high-speed circuits. Without proper clearance, your PCB could suffer from short circuits, reduced signal integrity, or even complete failure.In practical terms, the trace-to-pad distance is influenced by the voltage difference between the trace and pad, the operating environment (like humidity or altitude), and the PCB’s intended application. For example, a low-voltage consumer device might require a clearance of just 0.2 mm, while a high-voltage industrial system could demand 2.5 mm or more to prevent arcing. Understanding and applying the correct minimum trace-to-pad spacing is a fundamental skill for any PCB designer.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1760006396657-6388543029299352063207493.png" style="width:100%px" class="fr-fic fr-dib" /><h2>Why Is Trace-to-Pad Clearance Important?</h2>The importance of maintaining proper trace-to-pad spacing cannot be overstated. Here are the key reasons why this aspect of PCB design matters:<ul><li>Safety: In high-voltage designs, inadequate clearance can lead to electrical arcing, which poses a fire hazard or risk of component damage. Proper spacing ensures safety by preventing such issues.</li><li>Signal Integrity: For high-speed digital circuits, close traces and pads can cause crosstalk, where signals interfere with each other, leading to data errors. Adequate clearance minimizes this interference.</li><li>Manufacturability: <a href="https://www.allpcb.com/">PCB manufacturers</a> have specific tolerances for spacing. If your trace-to-pad distance is too small, it may be difficult or impossible to fabricate, leading to production delays or defects.</li><li>Reliability: Over time, environmental factors like dust, moisture, or thermal expansion can degrade a PCB. Proper clearance reduces the likelihood of short circuits or breakdowns under these conditions.</li></ul>By prioritizing trace-to-pad clearance, you ensure that your PCB performs reliably throughout its lifespan, whether it’s powering a simple gadget or a complex industrial system.<h2>Understanding IPC 2221 Trace Spacing Standards</h2>One of the most widely recognized standards for <a href="https://www.allpcb.com/blog/pcb-knowledge/4-layer-pcb.html">PCB design</a> is IPC 2221, which provides guidelines for trace spacing and clearance based on voltage levels and environmental conditions. IPC 2221, titled "Generic Standard on Printed Board Design," offers a framework for determining safe distances between conductive elements, including trace-to-pad clearance, to prevent electrical breakdown.According to IPC 2221, clearance requirements vary based on whether the conductors are on the same layer (external) or between layers (internal), and whether they are coated or uncoated. Here are some general guidelines from the standard for external conductors at sea level:<ul><li>For voltages up to 15V, a minimum clearance of 0.05 mm (2 mils) is recommended.</li><li>For voltages between 15V and 30V, the clearance increases to 0.1 mm (4 mils).</li><li>For voltages between 30V and 50V, a clearance of 0.6 mm (24 mils) is advised.</li><li>For higher voltages, such as 100V to 150V, the clearance can go up to 1.5 mm (59 mils) or more, depending on the specific conditions.</li></ul>These values are starting points and may need adjustment based on factors like altitude (air pressure affects arcing distance) or the presence of protective coatings. IPC 2221 also distinguishes between clearance (air gap) and creepage (surface distance along the board), both of which are critical for trace-to-pad spacing in high-voltage designs.It’s worth noting that not all designs must strictly adhere to IPC 2221. Depending on your project’s requirements, you might need tighter or looser spacing. However, following these standards is a best practice for ensuring safety and reliability, especially for commercial or industrial applications.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1760006421047-6388543026516541483672283.png" style="width:100%px" class="fr-fic fr-dib" /><h2>Factors Affecting Minimum Trace-to-Pad Spacing</h2>Several factors influence the minimum trace-to-pad spacing in a PCB design. Understanding these variables will help you determine the right clearance for your specific application.<h3>1. Voltage Levels</h3>The voltage difference between a trace and a pad is the primary factor in determining clearance. Higher voltages increase the risk of arcing, so larger distances are required. For instance, a design operating at 500V may need a clearance of 6 mm or more, while a 5V circuit might only require 0.2 mm.<h3>2. Environmental Conditions</h3>Humidity, temperature, and altitude can affect the dielectric strength of air and the PCB material. At high altitudes, where air pressure is lower, arcing occurs more easily, necessitating larger clearances. Similarly, high humidity can lead to condensation, increasing the risk of short circuits if spacing is too tight.<h3>3. Signal Frequency and Speed</h3>In high-speed designs, such as those with signal frequencies above 100 MHz, <a href="https://www.allpcb.com/blog/pcb-design/emi-or-emc-testing.html">EMI compliance testing</a> and crosstalk become significant concerns. Maintaining sufficient trace-to-pad distance helps reduce these effects, preserving signal integrity. For example, a high-speed USB signal might require a clearance of at least 0.3 mm to avoid interference with nearby pads.<h3>4. Manufacturing Constraints</h3>PCB fabrication processes have limits on how close traces and pads can be placed. Most standard manufacturing services can achieve clearances as low as 0.15 mm (6 mils), but tighter spacing may require advanced techniques or higher costs. Always consult your manufacturer’s design rules to ensure your trace-to-pad distance is achievable.<h3>5. Board Material and Coating</h3>The type of PCB material (e.g., FR-4) and any protective coatings or solder masks can influence clearance requirements. A coated board might allow for slightly reduced spacing since the coating adds an extra layer of insulation, but uncoated boards typically require more conservative distances.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1760006438709-6388543017957181167923367.png" style="width:100%px" class="fr-fic fr-dib" /><h2>How to Determine the Right Trace-to-Pad Distance</h2>Calculating the optimal trace-to-pad distance for your PCB involves balancing safety, performance, and manufacturability. Here’s a step-by-step approach to ensure you get it right:<ol><li>Identify Voltage Levels: Determine the maximum voltage difference between the trace and pad. Use this value to reference IPC 2221 clearance guidelines or other relevant standards.</li><li>Assess Environmental Factors: Consider the operating environment of your PCB. If it will be used in a humid or high-altitude setting, increase the clearance beyond the baseline recommendations.</li><li>Check Signal Requirements: For high-speed or high-frequency signals, ensure the clearance is sufficient to prevent crosstalk or EMI. Simulation tools can help model these effects if needed.</li><li>Review Manufacturer Guidelines: Confirm the minimum trace-to-pad spacing supported by your PCB manufacturer. Adjust your design if necessary to meet their capabilities.</li><li>Use Design Software Rules: Most <a href="https://www.allpcb.com/blog/pcb-design/top-10-pcb-design-software-tools.html">PCB design software</a> allows you to set clearance rules based on net classes or specific components. Configure these rules to enforce the desired trace-to-pad distance during layout.</li></ol>By following these steps, you can ensure that your design adheres to best practices for PCB clearance trace to pad requirements while meeting the unique needs of your project. <h2>Common Mistakes in Trace-to-Pad Clearance Design</h2>Even experienced designers can make errors when it comes to trace-to-pad spacing. Here are some common pitfalls to avoid:<ul><li>Ignoring Voltage Ratings: Underestimating the voltage difference between a trace and pad can lead to insufficient clearance, increasing the risk of arcing or short circuits.</li><li>Overlooking Creepage: Clearance (air gap) is important, but creepage (surface distance) is equally critical, especially in humid environments where surface contamination can cause shorts.</li><li>Neglecting High-Speed Effects: Failing to account for crosstalk in high-speed designs can degrade signal quality, even if voltage-based clearance is adequate.</li><li>Exceeding Manufacturing Limits: Designing with clearances smaller than what your manufacturer can produce often results in costly redesigns or production issues.</li></ul>Avoiding these mistakes will save you time and resources while ensuring your PCB performs as intended.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1760006457959-6388543014438139184139140.jpg" style="width:100%px" class="fr-fic fr-dib" /><h2>Practical Tips for Optimizing Trace-to-Pad Clearance</h2>Designing a PCB with proper trace-to-pad spacing doesn’t have to be complicated. Here are some actionable tips to help you optimize your layout:<ul><li>Use Design Rule Checks (DRC): Leverage the DRC features in your PCB design software to automatically flag clearance violations during the layout process.</li><li>Group Similar Nets: Place traces and pads with similar voltage levels or signal types closer together to minimize the need for large clearances across the board.</li><li>Prioritize High-Voltage Areas: Identify and isolate high-voltage sections of your PCB early in the design process, ensuring they have ample clearance from low-voltage areas.</li><li>Consider Multi-Layer Boards: If space is tight on a single-layer PCB, use multiple layers to separate high-voltage or high-speed traces and pads, reducing clearance concerns.</li><li>Test and Validate: After completing your design, simulate or prototype the PCB to verify that the trace-to-pad distance performs as expected under real-world conditions.</li></ul>These strategies will help you create a robust PCB layout that balances clearance requirements with design efficiency.<h2>Conclusion: Mastering Trace-to-Pad Clearance for Better PCBs</h2>Trace-to-pad clearance is a fundamental aspect of PCB design that directly impacts safety, performance, and manufacturability. By understanding the importance of trace-to-pad distance, adhering to industry standards like IPC 2221 trace spacing guidelines, and considering factors such as voltage, environment, and signal speed, you can create reliable and efficient PCB layouts. Avoiding common mistakes and applying practical optimization tips further ensures that your design meets the highest standards of quality.Whether you’re working on a low-voltage consumer device or a high-voltage industrial system, mastering minimum trace-to-pad spacing is essential for success. With the insights and strategies shared in this guide, you’re well-equipped to tackle PCB clearance challenges and deliver designs that stand the test of time. Keep these principles in mind during your next project, and you’ll see the difference that proper spacing can make.

When designing a printed circuit board (PCB), one of the most critical aspects to consider is the spacing between conductive elements, such as traces and pads.

The Ultimate Guide to Trace-to-Pad Clearance in PCB Design

Cornell researchers have built a programmable optical chip that can change the color of light by merging photons, without requiring a new chip for new colors.This form of nonlinear photonics could potentially be used for classical and quantum communications networks, all-optical signal processing and computation, spectroscopy and sensing.“Previously, for each combination of colors you wanted to produce, you needed to fabricate a new device with a different design,” said <a href="https://www.engineering.cornell.edu/people/peter-mcmahon/">Peter McMahon</a>, associate professor of applied and engineering physics in Cornell Engineering, who led the project. “We now have a sort of universal device that lets you do any conversions you want, reprogrammably.”The <a href="https://www.nature.com/articles/s41586-025-09620-9">findings</a> were published Oct. 8 in Nature. The paper’s first author is Ryotatsu Yanagimoto, a former postdoctoral researcher in <a href="https://mcmahon.aep.cornell.edu/index.html">the McMahon Lab</a> and visiting scientist from NTT Research.In the regime of linear optics, the frequency – which is to say, the color – of the photons do not change, and the photons tend to ignore each other. Most optics that people encounter in daily life, from eyewear to cell-phone screens, fall into this category. But in nonlinear optics, the photons interact with each other and can change frequency. Constrained by the laws of energy conservation, one higher-energy photon can be converted into two photons at half the energy. Conversely, two lower-energy photons in a nonlinear optical medium can be combined into one higher-energy photon. McMahon’s team performed various demonstrations of the latter with their chip.To accomplish this, they combined two concepts. The first was to apply a large electric field over the chip via high-voltage probes, enabling frequency conversions in a material that normally wouldn’t allow them. The second idea came from a completely different scientific field 20 years ago, when researchers built a device that could manipulate biological cells using a patterned light field to program the device’s electric-field distribution. Co-author Logan Wright, another former postdoctoral researcher in McMahon’s group, had realized the same approach could be adapted to make programmable photonic devices.“By combining these two techniques, we were able to control a material to make it nonlinear in some regions and not nonlinear in other regions,” McMahon said. “And it turns out from the theory of nonlinear optics that if you want to control what colors you get out, you need to be able to do this sort of control of the crystal’s nonlinearity as a function of space.”The core of the device is a planar-shaped slab of crystal in which light can only travel side-to-side, and not up or down. The researchers sent laser light into this so-called slab waveguide and were able to control how different-colored photons could be combined to produce light with different colors emerging from the chip.The team made the device at the <a href="https://www.cnf.cornell.edu/">Cornell NanoScale Science and Technology Facility</a> (CNF) in Duffield Hall, with second author Benjamin Ash ’26 playing a prominent role in designing the fabrication process, building devices and testing them.While the device remains a proof-of-principle demonstration, McMahon said, if the conversion efficiencies were pushed high enough, it could open up a range of opportunities in programmable nonlinear optics, from making new light sources to optical networking.“Now, in optical networks, people often use different colors of light inside the same piece of fiber to communicate information between computers. Our type of device would be a nice building block to have, on either end of the fiber, letting you reprogrammably change the light’s wavelengths,” McMahon said. “There’s also a strong argument for it in quantum networks, where we really would like to be able to interface quantum bits that naturally emit photons having different colors. We want to be able to convert that light into the telecom band, as well as back to the natural wavelength of a different quantum bit. Having a device where this is all possible in one package feels like it would be a useful tool.” Co-authors also include doctoral students Mandar Sohoni and Yiqi Zhao; Martin Stein, Ph.D. ’24 and Federico Presutti, Ph.D. ’24; former postdoctoral researcher Tatsuhiro Onodera; and Marc Jankowski of NTT.

Cornell researchers have built a programmable optical chip that can change the color of light by merging photons, without requiring a new chip for new colors.

Programmable optical chip merges photons to change color

<a href="https://www.wevolver.com/article/electronics-development-is-broken-its-time-for-a-reset" target="_blank" rel="noopener noreferrer">In our last article</a>, we argued that electronics development is broken. Siloed teams, disconnected tools, and late-stage surprises create an environment where complexity overwhelms capacity to innovate. The industry needs a reset. But what does that reset actually look like?For decades, “collaboration” has been the default answer. Teams meet weekly to compare progress. Files move back and forth over email. Procurement checks in once designs are nearly complete. Manufacturing raises concerns late in the process. Compliance steps in at the finish line. This kind of collaboration helps teams coordinate, but it rarely prevents issues before they grow costly.And that’s the problem: collaboration, as we’ve practiced it, is reactive. It connects disciplines but doesn’t unify them. It informs, but it doesn’t transform. What has changed isn’t that products require multiple disciplines—they always have. The difference today is the growing complexity of how those disciplines come together: distributed teams working across time zones, fragile global supply chains, and compliance pressures that can derail launches. Traditional collaboration methods—emails, meetings, late reviews—simply can’t keep up with this level of interdependence.What’s needed is co-creation—a model where disciplines don’t just work alongside each other. Rather, they actively shape products together, in real time, within the same environment. Instead of handing off tasks outwards across silos, the correct approach brings team members in to share context, data, and purpose from the very beginning.<h3>Altium Develop: A New Model for Product Creation</h3>This is the vision behind<a href="https://www.altium.com/develop"> Altium Develop</a>. It includes both the trusted PCB design tool Altium Designer and Altium 365, the secure cloud collaboration platform. Altium Develop creates a single environment for multidisciplinary product creation. Unlike heavyweight enterprise systems designed for global corporations, Altium Develop is out-of-the-box and accessible—tailored for small and mid-sized organizations that need to move quickly without the overhead of a complex infrastructure that they must maintain themselves.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759908500298-shutterstock_1699780642.jpeg" style="width:100%px" class="fr-fic fr-dib" />What makes it different is how it translates the principles of the reset—continuous insight, true co-creation, and a peer-powered network—into practical capabilities that support every stage of product development:<ul><li>Design – Break down silos by enabling PCB and hardware designers to co-create with systems engineers, procurement, and manufacturing in one environment.</li><li>Project Management – Track project status, BOM costs, and cross-functional issues in real time, keeping everyone aligned without chasing updates.</li><li>Requirements – Import, trace, and manage requirements from concept through verification, ensuring nothing gets lost between intent and execution.</li><li>Supply Chain – Access real-time part pricing, availability, and risk data during design—not after it’s too late.</li><li>Manufacturing – Engage early with production teams, resolve DFM issues before they escalate, streamline prototype builds and the design-to-build handoff.</li></ul>By embedding these capabilities into one environment, Altium Develop turns fragmented collaboration into true co-creation. Reviews, sourcing decisions, and compliance checks are no longer interruptions—they happen naturally, as part of the flow of development. As this work happens within Altium Develop, all of the team’s data is captured in a shared space, and unlimited data sharing erase cross-functional blind spots and improves decisions.<h3>Who It’s For</h3>Altium Develop is designed to empower every role involved in product creation:<ul><li>Engineers and Designers who want to spend less time reworking and more time innovating. </li><li>Project Managers who need real-time clarity without chasing updates. </li><li>Procurement and Supply Chain Teams who must stay ahead of component risks, pricing, and availability. </li><li>Manufacturing and Compliance Teams who need to engage earlier to prevent costly surprises downstream.</li></ul>By uniting these groups in one shared environment, Altium Develop transforms scattered efforts into a coordinated process that builds momentum instead of friction.<h3>Working as One</h3>The shift from collaboration to co-creation is driven above all by the need for speed. Market windows are short, and delays from misalignment, rework, or late discoveries can cost companies both revenue and relevance. At the same time, challenges like limited component supplies, shortages of specialized engineers, and distributed teams add new layers of risk that slow development even further.Co-creation tackles these pressures head-on. By working together in real time, teams cut through silos, reduce delays, and maintain momentum. And while faster delivery is the clearest outcome, the benefits don’t stop there—co-creation also builds resilience, confidence, and creativity into the process.Altium Develop provides the environment where that becomes possible. It’s not just a new product; it’s a new way of working—one that enables teams to move from working together to working as one.Discover how Altium Develop is redefining electronics co-creation at<a href="https://www.altium.com/develop"> altium.com/develop</a>.

Why Collaboration Is No Longer Enough for Electronics Development

From Collaboration to Co-Creation: Introducing Altium Develop

<h2 id="isPasted">Introduction</h2>The growing complexity of electronic systems is reshaping how engineers ensure reliability and compliance. Faster switching speeds and denser integration have made electromagnetic compatibility (EMC) one of the most critical design concerns, as noise issues discovered late in development often force costly redesigns. In addition, system-level demands, such as energy efficiency and accurate prediction of thermal behavior, are linked to EMC performance. To address these interrelated challenges, ROHM has established an end-to-end validation ecosystem. By combining accredited EMC measurement chambers, advanced motor bench systems, and web-based simulation tools, ROHM enables customers worldwide to implement effective countermeasures early, achieving greater design confidence, compliance, and efficiency.<h2>EMC Validation with In-House Anechoic Chambers</h2>Electromagnetic noise is one of the most pervasive risks in modern electronics. When left unchecked, it can lead to malfunction, system instability, and even regulatory non-compliance. For IC designers and system engineers, tackling noise at an early stage is critical.To support this, ROHM operates its own accredited EMC measurement facilities. Located at the Yokohama Technology Center, Japan, these facilities include:<ul><li>3-meter anechoic chamber for precision emissions measurements.</li><li>Automotive EMC chamber, which replicates real vehicle wiring harnesses and mounting conditions to test immunity and emissions in application-relevant environments.</li></ul><iframe width="640" height="360" src="https://www.youtube.com/embed/AoAEFJefN3s?&amp;wmode=opaque&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0">      </iframe>This in-house capability works strongly to the customer’s  advantage. With ROHM’s process, EMC countermeasures are designed during the IC development stage, allowing the customer to proceed with their designs with greater confidence. This significantly reduces the risk of late-stage redesigns and is one of the key advantages of ROHM’s robust EMC validation ecosystem.Table 1: Key EMC tests at ROHM<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759849924697-image7.png" style="width:100%px" class="fr-fic fr-dib" alt="emc-test-rohm" />A notable example is the development of <a href="https://www.rohm.com/emarmour" target="_blank">ROHM’s EMARMOUR™</a> operational amplifiers, which achieved industry-leading immunity to electromagnetic interference (EMI). This success came from iterative testing in the anechoic chambers, where circuit proposals were measured, refined, and validated until breakthrough performance was achieved.<h2>Motor Bench Evaluation for Efficiency Testing</h2>While EMC focuses on noise and compliance, efficiency must also be evaluated for a reliable system design. In electric vehicles (EVs) and industrial drives, energy savings translate directly into reduced operating costs, longer range, and higher overall performance. Yet validating efficiency is complex because it requires testing not just individual devices, but entire drive systems.ROHM addresses this challenge with its motor bench evaluation environment, which reproduces real-world conditions for motors, gate drivers, and power devices. The setup includes a test motor and load motor configuration, regenerative converters, precision current and voltage sensors, and a dedicated control PC. This allows engineers to monitor efficiency and potential behavior under real operating conditions across a wide range of varying torque and rotational speed sequences.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759850934678-image6.jpg" style="width:100%px" class="fr-fic fr-dib" alt="rohm-motor-efficiency-test" />Fig. 1: ROHM Motor Test Configuration DiagramIn comparative tests under <a href="https://en.wikipedia.org/wiki/Worldwide_Harmonised_Light_Vehicles_Test_Procedure" target="_blank">Worldwide Harmonized Light Vehicle Test Cycle (WLTC) Class 3b conditions</a>, inverters equipped with <a href="https://www.rohm.com/products/sic-power-devices/sic-mosfet#supportInfo" target="_blank">ROHM’s 4th Generation SiC MOSFETs</a> achieved up to 10% lower electricity consumption compared to those using conventional IGBTs. This confirms that high-efficiency operation can be achieved while  ensuring performance gains do not introduce excessive noise.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759849963549-image2.jpg" style="width:100%px" class="fr-fic fr-dib" alt="rohm-motor-evaluation-test" />Fig. 2: ROHM Motor Evaluation Test Facilities<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759849955110-image1.jpg" style="width:100%px" class="fr-fic fr-dib" alt="rohm-motor-bench-inverter-efficiency-comparision" />Fig. 3: ROHM’s motor bench demonstrates up to 10% higher efficiency with 4th Gen SiC MOSFETs versus IGBTs.By enabling these detailed system-level measurements, customers gain early insight into energy savings, and overall reliability before moving to costly prototyping or large-scale production.<h2>Simulation Tools for Virtual Validation</h2>Even with advanced EMC facilities and motor bench testing, designers often need to validate performance much earlier in the development cycle. Prototyping is expensive, and datasheets alone cannot capture the complex thermal and electrical interactions that occur in real-world systems. To help with this, ROHM offers the <a href="https://www.rohm.com/solution-simulator" target="_blank">ROHM Solution Simulator</a>, a free, web-based tool that enables engineers to evaluate devices and circuits under realistic application conditions. This tool is unique in the way it allows not only ICs but also entire circuits including discrete components such as transistors, diodes, resistors, and LEDs, and it also supports thermal design.Another key feature is its electrical-thermal coupled analysis. What once required a full day of modelling and computation can now be completed in under ten minutes, making it approximately 100 times faster than conventional methods. Designers can quickly examine junction temperatures, pin-level heating, and thermal interference between components, gaining insights before hardware is even built.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759850012454-image4.png" style="width:100%px" class="fr-fic fr-dib" alt="rohm-solution-simulator-thermal-analysis" />Fig. 4: ROHM Solution Simulator reduces thermal validation time from a day to minutes.The simulator also fits seamlessly into existing workflows. Engineers can select a solution circuit, choose specific ROHM devices, run simulations, and even order samples directly. For more advanced system-level validation, results can be exported into the <a href="https://eda.sw.siemens.com/en-US/pcb/partquest/" target="_blank">Siemens EDA PartQuest</a> environment.<h2>Strengthening Competitiveness Through Validation</h2>When viewed together, ROHM’s validation facilities form a comprehensive ecosystem. Each contributes to a different but equally critical dimension of design reliability:<ul><li>State-of-the-art anechoic chambers ensure compliance with global EMC standards and protect against system malfunctions caused by noise.</li><li>Motor bench testing validates real-world efficiency and performance of drive systems in automotive and industrial applications.</li><li>Simulation tools accelerate development of the entire electrical circuit by identifying thermal, electrical, and heat-related issues before hardware prototyping.</li></ul>For customers, the combined benefits are clear: development cycles become shorter, reducing time-to-market. Risk is lowered because potential issues are identified earlier, preventing costly redesigns. Compliance confidence is strengthened across international markets, ensuring smoother certification processes. And system-level performance is optimized, translating into energy savings, safety, and reliability.Comprehensive design measures significantly enhance product reliability and safety while meeting customer expectations. This approach delivers exceptional value through both technical expertise and support systems, strengthening competitiveness in the global market.<h2>ROHM’s Application and Technical Solution Center in Europe</h2>While the tools and facilities discussed in this article are based at ROHM’s R&amp;D center in Japan, customers in Europe also benefit from local expertise through the European Application and Technical Solution Center (ATSC) in Willich, Germany. To support users in their development efforts, the EU support team offers services that contribute to the quality of the customer's end product. The facilities in Germany are not only meant for low-voltage IC products: Through a modern lab ROHM also provides support for power devices (IGBTs, SiC MOSFETs) with voltage classes up to 2 kV since 2018.     <img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759850018173-image3.jpg" style="width:100%px" class="fr-fic fr-dib" alt="rohm-atsc-europe-engineers" />Fig. 5: At ROHM’s ATSC in Europe, engineers collaborate directly with customers on circuit evaluation and design-in support.The ATSC focuses on supporting engineers during their design-in phase, providing application boards, reference designs, and hands-on technical collaboration. By working closely with local development teams, the ATSC ensures that European customers receive support for integrating ROHM’s analog ICs, power devices, and system solutions. This way, ROHM combines cutting-edge R&amp;D infrastructure with regional engineering support, delivering a balanced approach that strengthens customer competitiveness worldwide.<h2>Conclusion</h2>EMI, energy efficiency, and thermal management are often invisible yet decisive for reliable, compliant electronics. If overlooked, they can cause redesigns, certification delays, and performance losses. ROHM’s R&amp;D facilities employ anechoic chambers, motor bench evaluation, and simulation tools as part of a preventive validation ecosystem that helps customers detect issues early, apply effective countermeasures, and deliver designs that are globally compliant, efficient, safe, and reliable.Explore further: <a href="https://www.rohm.com/company/about/stories-of-manufacturing/emc" target="_blank">Endless Struggle Against Invisible Noise | ROHM</a>

ROHM's R&D facilities integrate EMC testing, motor bench evaluation, and advanced simulation to tackle electromagnetic noise, efficiency, and thermal challenges. Together, they create a preventive validation ecosystem that accelerates development and ensures reliable, compliant electronic systems.

Ensuring EMC Through A Validation Ecosystem: Anechoic Chambers, Motor Bench, and Advanced Simulation

High Bandwidth Memory (HBM) Semiconductor

This technical article explains, what is HBM, detailing its 3D-stacked architecture, the critical role of advanced packaging, and its application in modern GPUs, AI accelerators, and embedded systems.

What is HBM (High Bandwidth Memory)? Deep Dive into Architecture, Packaging, and Applications

Master inverting vs non inverting op amp with a rigorous, engineer-friendly guide covering gain, bandwidth, noise, stability, and layout. Learn closed-loop design and verification used by TI/ADI application engineers. Build quieter, faster, stable amplifiers. Start designing confidently today.

Inverting vs Non Inverting Op Amp: Complete Design Guide & Best Practices 2025

Modern electronics and renewable energy systems depend on DC to AC inverters that convert a DC source into a clean sinusoidal AC output. This technical article explains the theory behind inverter circuits, their types,  architectures, and practical design tips.

DC to AC Inverter Circuits – Theory, Design and Practical Implementation

Scientists from ITMO have developed a new method for creating colorful structured semiconductor perovskite films without the risk of defects or contamination. A special nanopattern that imbues perovskites with optical properties is applied with a laser not onto the perovskite film itself but onto a titanium dioxide substrate. The resulting films can be used to change the direction of luminescence. With such nanostructured semiconductors, it’s possible to develop a new type of solar cells and diodes with improved electrophysical characteristics. The study is described in a paper published in <a href="https://www.light-am.com/en/article/doi/10.37188/lam.2025.062">Light: Advanced Manufacturing</a>.In recent years, semiconductor perovskites have been increasingly studied as an alternative to silicon in solar cells, photodiodes, and light-emitting diodes. The reason is that they absorb light in the optical range more effectively. Moreover, such semiconductors are easier to produce: they are obtained by solution chemistry methods – a faster and more economical approach suitable for mass production. At the same time, the quality of the raw materials (i.e. the reagents used to synthesize the semiconductors) is less critical for producing efficient device components, as they are less prone to defects.An important step in producing nanoelectronic devices is often the nanostructuring of semiconductor films. It can, for instance, improve the semiconductor properties of materials or their photoabsorption. One of the most common methods for nanostructuring perovskites is ion beam etching, which involves removing material using an ion beam with electron microscopy equipment. With this method, it’s possible to achieve the desired optical properties in the material. In most cases, a laser interacts directly with the perovskite. However, this usually leads to its ablation – removal from the surface – and charring, which hinders the creation of modern multilayer devices such as solar cells and light-emitting diodes.Physicists at ITMO have suggested a method that involves “etching” the nanopattern onto perovskites without directly impacting them with a laser. With the laser-induced periodic surface structures (LIPSSs) method, it’s possible to form the nanopattern not on the film itself, but on a titanium dioxide film subjected to a pulse laser in a specific mode. The laser’s light is absorbed by the film, which causes a surface plasmon resonance – this is when the frequency of incident light matches the frequency of synchronous oscillations of electrons on the film’s surface. This causes the film to locally melt and then instantly set again, forming grooves of various shapes and sizes in the surface of titanium dioxide. After that, the titanium dioxide film is applied onto the perovskite film, which acquires its properties.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759417495830-1452502.jpg" style="width:100%px" class="fr-fic fr-dib" />Titanium dioxide films created at ITMO with the laser-induced periodic surface structures (LIPSSs) method. Photo by Dmitry Grigoryev / ITMO NEWSThe resulting nanopattern resembles ripples on the surface of the sea or sand dunes – it repeats with a certain periodicity. This period determines the diffraction properties of the perovskite film, that is, the colors we see on its surface: shades ranging from green to blue. Originally, the perovskite is brown in color, but when light localizes in the “grooves” of the nanopattern, it refracts at a different angle and takes on a different color. This optical effect precisely replicates the natural mechanism of color formation on butterfly wings: their small scales localize and refract light at specific angles, resulting in a color change.<blockquote>“We discovered that the nanopattern also determines the photoluminescent properties of perovskite films, in particular the photoluminescence directionality diagram – the so-called cold radiation. In other words, we can “direct” the light into the necessary field. As we rotate the film at different angles, the luminescence will increase or decrease, meaning that we’ll get a brighter or dimmer lighting source without changing any other properties of the material. This proves the anisotropy of light, which is the key result of our study,” says the paper’s first author Dr. Alexandra Furasova, a senior researcher at the Laboratory of Hybrid Nanophotonics and Optoelectronics of ITMO’s Faculty of Physics.</blockquote>Another advantage of the new method is the high “writing” speed of the nanopattern onto the film. In just a minute, it’s possible to create up to 1 cm2 of a nanopattern on titanium dioxide. And as physicists work with nanoscale objects, the time will be even shorter. Moreover, titanium dioxide films can be reused: the perovskite films can be washed off and replaced with new ones. The films’ size is also variable. Thanks to these properties, such semiconductors have scaling potential.<blockquote>“Importantly, in our work we used cutting-edge laser technologies for fast, high-quality writing of coloring nanostructures. Together with our colleagues from ITMO’s Institute of Laser Technologies, we were able to optimize the process to the point that we were able to use industrial laser systems for precision tasks – when the modified titanium dioxide film is 1,000 times thinner than a human hair,” adds Prof. Sergey Makarov, the chief research associate and head of the Laboratory of Hybrid Nanophotonics and Optoelectronics of ITMO’s Faculty of Physics.</blockquote>In the future, the developed perovskite films can be used to create a new type of high-efficiency solar cells, diodes, and photodetectors. The team is already working on the next step of their project: testing the films in real-world devices.This study was supported by a Russian Science Foundation grant and the national program Priority 2030.

Titanium dioxide films created at ITMO with the laser-induced periodic surface structures (LIPSSs) method. Photo by Dmitry Grigoryev / ITMO NEWS

Scientists from ITMO have developed a new method for creating colorful structured semiconductor perovskite films without the risk of defects or contamination.

Butterfly Effect: Researchers Create Colorful Perovskite Films for Optoelectronics

Electronics are everywhere. From electric vehicles to medical devices and consumer tech, our world increasingly depends on them. Yet, the way we create these systems hasn’t kept pace with their complexity and demands to bring products to market more quickly. While the products themselves demand multidisciplinary team collaboration, the methods used to develop them remain largely stuck in outdated information silos and reliant on manual communication.<a href="https://group.atradius.com/knowledge-and-research/reports/electronics-ict-industry-trends-june-2024-?utm_source=chatgpt.com">“Global electronics/ICT output is expected to grow by 5.3 % in 2024 and 6.3 % in 2025—making it one of the fastest‑growing sectors worldwide.” (Atradius)</a>. But rapid industry transformation comes with mounting pressure. Rising complexity, fractured collaboration, and relentless time-to-market demands are stretching traditional development processes and tools beyond their breaking points.<h2>The Growing Complexity Problem</h2>Electronics products have always required a blend of disciplines — electrical, mechanical, software, supply chain, and requirements management. What has changed is the scale and distribution of that complexity. Today’s teams are often global, supply chains are volatile, and every decision is interdependent with sourcing, manufacturing, and regulatory pressures. It’s not the complexity of the products alone that strains organizations, but the growing complexity of the development process itself. Each new dependency — whether it’s a distributed team or a fragile supplier — introduces risk and potential delay.Consider the semiconductor shortage that began in 2020: analyses by Goldman Sachs estimated it <a href="https://researchbriefings.files.parliament.uk/documents/POST-PN-0721/POST-PN-0721.pdf?" id="isPasted">disrupted at least 169 industries worldwide and even reduced global GDP by nearly 1% in 2021</a>. McKinsey further reported that the <a href="https://www.mckinsey.com/industries/automotive-and-assembly/our-insights/coping-with-the-auto-semiconductor-shortage-strategies-for-success?">shortage halted automotive assembly lines and forced manufacturers to rethink sourcing</a> and resilience strategies across the value chain. This wasn’t just a supply chain hiccup—it exposed how, when one part of the ecosystem falters, electronics development systems can suddenly become fragile and fragmented.<h2 id="isPasted">Why the Old Way No Longer Works</h2>Most engineering teams still rely on meetings, long email threads, and disconnected tools to keep projects moving. While that can work for small projects, it creates enormous inefficiencies at scale.A Forrester study found that engineers lose on average 159 hours per year to inefficient project management tasks—nearly a full month of productivity lost per person (<a href="https://www.altium.com/altium-365/forrester/impact-study">Forrester/Altium study</a>). That’s time not spent on design, innovation, or problem-solving.<h2>The Human Cost of Collaboration Silos</h2>Beyond lost time and dollars, collaboration silos take a human toll. When engineers work in isolation, they gradually lose sight of how their contributions fit into the bigger picture. Procurement may not understand the intent behind a design decision. Manufacturing is left to discover problems once they’re already expensive—and sometimes impossible—to fix.The outcome is more than just project delays. This dynamic leads to a steady accumulation of frustration and disengagement. Engineers feel they are constantly reworking issues that could have been prevented. Procurement teams scramble to source parts under pressure, rather than partnering proactively. Compliance officers become “gatekeepers” instead of partners, which can create tension rather than teamwork. And when manufacturing is forced to raise red flags late in the process, it fuels a cycle of blame.For electronics companies, these dynamics have tangible consequences. A missed compliance step can trigger a costly product recall. A late sourcing problem can stall an entire launch. A failure to align manufacturing and design can lead to yield losses or expensive redesigns. In a competitive industry where speed and quality are everything, these aren’t just inefficiencies—they are existential risks.<h2>Why Electronics Development Needs a Reset</h2>The industry doesn’t just need more tools—it needs a reset in how teams work together. At the heart of that reset are three principles that shift the paradigm for how electronics development teams work together.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759395622735-stock+image+2.jpeg" style="width:100%px" class="fr-fic fr-dib" />The first is continuous insight: visibility that flows as work happens, not just during scheduled reviews. Instead of waiting for the next meeting to uncover issues, teams stay aligned in real time, with context available to everyone making decisions or taking action.The second is true co-creation: disciplines working together to solve problems more effectively, rather than passing files across silos and counting on someone else to deal with it. This means electrical engineers, mechanical designers, software developers, and procurement specialists contributing in the same environment, seeing the same data, and making decisions as a unified team.The third is a networked model of collaboration: the ability to bring in the right expertise at the right moment without being blocked by rigid hand-offs. Input from system engineers, manufacturing, or sourcing no longer arrives as an interruption—it becomes an organic and enriching part of the development process.This reset isn’t just about moving faster. It’s about creating smarter, faster ways of working. These new ways can keep pace with the complexity of modern electronics while also unlocking the creativity of the people creating them.<h2> </h2><h2 id="isPasted">A New Way Forward</h2>Electronics development has outgrown the old functional silos, email chains, and after-the-fact reviews. What’s needed now is a reset—one that puts continuous insight, shared context, and true co-creation at the center of how teams work.This shift is already underway. With solutions like <a href="https://www.altium.com/develop">Altium Develop</a>, multidisciplinary teams can begin working in new ways—bringing design, supply chain, compliance, and manufacturing together on a shared platform built for co-creation. For now, one thing is clear: organizations that embrace this reset will be the ones shaping the future of electronics.

Electronics are booming, but outdated methods can't keep up. Read more to discover the three principles transforming how development teams collaborate.

Electronics Development Is Broken. It's Time for a Reset.

In this whitepaper, we demonstrate how Voltera’s V-One platform enables the fabrication of a fully functional decimal counter circuit using silver conductive ink printed directly onto FR-1 board substrates. Through this hands-on example, you’ll see how additive PCB prototyping bridges theory and practice, from circuit design and component integration to real-world operation, and learn practical tips for overcoming fabrication challenges.<div><iframe src="https://www.youtube.com/embed/xaPmLgafT38?&amp;wmode=opaque&amp;rel=0&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" style="width:640px;height:460px">                           </iframe></div>The goal of this project was to demonstrate PCB development through key concepts: <ul><li>Linear and switching regulators</li><li>Variable resistors</li><li>Seven-segment displays</li><li>Prototyping techniques<ul><li>Conductive trace printing</li><li>Component placement</li><li>Solder reflow</li></ul></li></ul><h3>Design</h3>The original PCB layouts were provided by <a href="http://itiz.co.kr/vone/">ITIZ</a>, Voltera’s authorized reseller in Korea. We modified the design to create an integrated circuit system, which was comprised of three interconnected PCBs:<ol><li>Voltage regulator board</li><li>Pulse generator board</li><li>Decimal counter board</li></ol><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759304976546-67b6101ea243ef8c4ab6136d_printing-decimal-counter-circuit-itiz-design.webp" style="width:100%px" class="fr-fic fr-dib" />ITIZ design of the boards<h3 id="isPasted">Desired outcome</h3>When connected to a 7V–12V DC source, the system should function as follows: <ul><li>The voltage regulator board converts the input to a steady 5V output.</li><li>The pulse generator board uses this 5V supply to create adjustable pulse signals.</li><li>The decimal counter board drives two seven-segment displays to count from 00 to 99 at a speed controlled by the pulse generator.</li></ul><h3>Functionality</h3>When powered by a 9V battery, the circuit successfully counted from 0 to 99 at an adjustable speed. A reset button allowed restarting the sequence, and the integration of both a linear regulator (78M05) and switching regulator (LM2575) on the same board provided a practical way to compare their efficiency, thermal behavior, and noise generation.<h2>Printing the boards on V-One</h2><h3>Voltage regulator board</h3>This board converts a 9V input into a steady 5V output. It includes the following components:<table><tbody><tr><td>Part </td><td>Part Name </td><td>Specification </td><td>Quantity </td></tr><tr><td>U1</td><td>SMD regulator</td><td>78M05 (linear)</td><td>1</td></tr><tr><td>U2</td><td>SMD regulator</td><td>LM2575 (switching)</td><td>1</td></tr><tr><td>D1, D3</td><td>SMD LED</td><td>3528 (3.5 mm × 2.8 mm), green</td><td>2</td></tr><tr><td>R1, R2</td><td>SMD resistor</td><td>5025 (5 mm × 2.5 mm), 330 Ω</td><td>2</td></tr><tr><td>C2</td><td>SMD capacitor</td><td>3216 (3.2 mm × 1.6 mm), 0.1 µF</td><td>2</td></tr><tr><td>C1, C3, C5</td><td>SMD electrolytic capacitor</td><td>10 mm × 10 mm, 100 µF</td><td>3</td></tr><tr><td>C6</td><td>SMD electrolytic capacitor</td><td>8 mm × 10 mm, 330 µF</td><td>1</td></tr><tr><td>D2</td><td>SMD diode</td><td>DO214AC</td><td>1</td></tr><tr><td>L1</td><td>SMD inductor</td><td>330 µH (12.5 mm × 12.5 mm)</td><td>1</td></tr></tbody></table><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305019224-67b610584f957b9b534ee9cc_printing-decimal-counter-voltage-regulator-design.webp" style="width:100%px" class="fr-fic fr-dib" />Voltage regulator board design<a href="https://en.wikipedia.org/wiki/Voltage_regulator">Voltage regulators</a> maintain a stable output voltage regardless of fluctuations in input voltage or load conditions. They play a critical role in circuit stability by preventing voltage spikes or drops that could damage components. In this circuit, we included two different types of regulators for ease of comparison. The 78M05 linear regulator (U1) dissipates excess energy as heat, providing a stable 5V output at lower efficiency. In contrast, the LM2575 switching regulator (U2) achieves higher efficiency by rapidly switching an internal transistor to store energy in an inductor (L1) and capacitor (C6), though this can introduce noise into the circuit due to rapid switching. <table><tbody><tr><td>Ink</td><td>Voltera Conductor 3 silver ink</td></tr><tr><td>Substrate</td><td>3” × 4” FR1 board</td></tr><tr><td>Nozzle type</td><td>Voltera disposable nozzle</td></tr><tr><td>Probe pitch</td><td>5 mm</td></tr><tr><td>Probe time</td><td>7 minutes 58 seconds</td></tr><tr><td>Print time</td><td>10 minutes 52 seconds</td></tr><tr><td>Cure Time and Temperature</td><td>90°C for 5 minutes, and then 170°C for 15 minutes</td></tr></tbody></table><h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305139206-67867fbb7f95f638bd6cf8b3_line-following-robot-vone-dispensing-settings.webp" style="width:100%px" class="fr-fic fr-dib" />V-One print settings for all three boards</h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305175492-67b610e6abedd8d32b146ba0_printing-decimal-counter-voltage-regulator-board.webp" style="width:100%px" class="fr-fic fr-dib" />V-One probing the voltage regulator board<h2>Pulse generator board</h2>This board uses a 555 timer IC (NE555) to generate adjustable pulse signals that drive the decimal counter board. It includes the following components:<table><tbody><tr><td>Part </td><td>Part Name </td><td>Specification </td><td>Quantity </td></tr><tr><td>U1</td><td>IC</td><td>NE555 (SOIC package)</td><td>1</td></tr><tr><td>D1</td><td>LED</td><td>3528 (3.5 mm × 2.8 mm), green</td><td>1</td></tr><tr><td>R1</td><td>SMD resistor</td><td>5025 (5 mm × 2.5 mm), 100 KΩ</td><td>1</td></tr><tr><td>R2</td><td>SMD resistor</td><td>5025 (5 mm × 2.5 mm), 47 KΩ</td><td>1</td></tr><tr><td>R4</td><td>SMD resistor</td><td>5025 (5 mm × 2.5 mm), 330 Ω</td><td>1</td></tr><tr><td>C2</td><td>SMD capacitor</td><td>3216 (3.2 mm × 1.6 mm), 0.1 µF</td><td>1</td></tr><tr><td>C1</td><td>SMD electrolytic capacitor</td><td>4 mm × 5 mm, 1 µF</td><td>1</td></tr><tr><td>R3</td><td>Variable resistor</td><td>SMD PVG3 1 MΩ</td><td>1</td></tr></tbody></table><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305400102-67b6110d15406924eb522d31_printing-decimal-counter-pulse-generator-design.webp" style="width:100%px" class="fr-fic fr-dib" />Puse generator board design.The <a href="https://en.wikipedia.org/wiki/555_timer_IC">NE555 timer</a> (U1) is a versatile and widely-used integrated circuit (IC) that can generate stable time delays or oscillations, depending on the external components configured around it. On this board, it operates in <a href="https://ae-iitr.vlabs.ac.in/exp/astable-monostable-multivibrator/theory.html">astable mode</a> to generate continuous pulse signals.The variable resistor (R3) functions as a <a href="https://fr.farnell.com/exploring-the-potential-of-variable-resistors-trc-ar#:~:text=Variable%20resistors%20are%20electronic%20components,resistance%20offered%20to%20the%20current.">potentiometer</a> in this circuit, altering the charging and discharging time of capacitor C1. This adjusts the pulse frequency, which controls the counting speed of the seven-segment displays on the decimal counter board.The green LED (D1) blinks in sync with the output pulses.<table><tbody><tr><td>Ink</td><td>Voltera Conductor 3 silver ink</td></tr><tr><td>Substrate</td><td>3” × 4” FR1 board</td></tr><tr><td>Nozzle type</td><td>Voltera disposable nozzle</td></tr><tr><td>Probe pitch</td><td>5 mm</td></tr><tr><td>Probe time</td><td>5 minutes 12 seconds</td></tr><tr><td>Print time</td><td>7 minutes 5 seconds</td></tr><tr><td>Cure Time and Temperature</td><td>90°C for 5 minutes, and then 170°C for 15 minutes</td></tr></tbody></table><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305432505-67b6115c1511cdff281b3827_printing-decimal-counter-pulse-generator-board.webp" style="width:100%px" class="fr-fic fr-dib" />V-One dispensing silver ink on pulse generator board<h3>Decimal counter board</h3>This board drives two seven-segment displays to count from 00 to 99, with adjustable speed (by the pulse generator board) and a reset function. It includes the following components:<table><tbody><tr><td>Part </td><td>Part Name </td><td>Specification </td><td>Quantity </td></tr><tr><td>U5</td><td>IC</td><td>SMD 74LS08 (AND gate)</td><td>1</td></tr><tr><td>U3, U4</td><td>IC</td><td>SMD 74LS47 (BCD-to-7-segment decoder)</td><td>2</td></tr><tr><td>U1,U2</td><td>IC</td><td>SMD 74LS93 (4-bit binary counter)</td><td>2</td></tr><tr><td>SW1</td><td>Push switch</td><td>SMD 7 mm × 7 mm</td><td>1</td></tr><tr><td>D1, D2</td><td>SMD diode</td><td>DO214AC</td><td>2</td></tr><tr><td>R15</td><td>SMD resistor</td><td>5025 (5 mm × 2.5 mm), 100 Ω</td><td>1</td></tr><tr><td>R1-14</td><td>SMD resistor</td><td>5025 (5 mm × 2.5 mm), 150 Ω</td><td>14</td></tr><tr><td>FND1, FND2</td><td>7-segment display</td><td>WL-S7DS (common anode)</td><td>2</td></tr><tr><td>JUMPER</td><td>SMD jumper</td><td>5025 (5 mm × 2.5 mm), 0 Ω resistor</td><td>3</td></tr></tbody></table><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305772648-67b61183a14f57e5a291c028_printing-decimal-counter-circuit-board-design.webp" style="width:100%px" class="fr-fic fr-dib" />Decimal counter board designA <a href="https://en.wikipedia.org/wiki/Seven-segment_display">seven-segment display</a> consists of seven individual LEDs arranged to form the shape of the number 8. By turning specific segments on or off, the display can represent any numeral between 0 and 9. In this circuit, the 74LS93 counters (U1, U2) process incoming pulses into <a href="https://en.wikipedia.org/wiki/Binary-coded_decimal">binary-coded decimal</a> (BCD) outputs. The 74LS47 decoders (U3, U4) convert BCD signals into segment activation patterns for the seven-segment displays (FND1, FND2). A manual reset button (SW1) allows restarting the count.<table><tbody><tr><td>Ink</td><td>Voltera Conductor 3 silver ink</td></tr><tr><td>Substrate</td><td>3” × 4” FR1 board</td></tr><tr><td>Nozzle type</td><td>Voltera disposable nozzle</td></tr><tr><td>Probe pitch</td><td>5 mm</td></tr><tr><td>Probe time</td><td>9 minutes 43 seconds</td></tr><tr><td>Print time</td><td>12 minutes 19 seconds</td></tr><tr><td>Cure Time and Temperature</td><td>90°C for 5 minutes, and then 170°C for 15 minutes</td></tr></tbody></table><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305804736-67b611b9350f70772bf8b9bb_printing-decimal-counter-v-one-conductive.webp" style="width:100%px" class="fr-fic fr-dib" />V-One dispensing silver ink on decimal counter board<h2>Post-processing</h2><h3>Populating and reflow</h3>After all three circuits were cured, we dispensed solder paste using V-One and carefully populated the components using a pair of tweezers. The solder paste was then reflowed on V-One’s heated bed.<table><tbody><tr><td>Parameters </td><td>Voltage regulator board </td><td>Pulse generator board </td><td>Decimal counter board </td></tr><tr><td>Paste</td><td>Voltera T4 solder paste</td><td>Voltera T4 solder paste</td><td>Voltera T4 solder paste</td></tr><tr><td>Substrate</td><td>3” × 4” FR1 board</td><td>3” × 4” FR1 board</td><td>3” × 4” FR1 board</td></tr><tr><td>Nozzle type</td><td>Voltera disposable nozzle</td><td>Voltera disposable nozzle</td><td>Voltera disposable nozzle</td></tr><tr><td>Probe time</td><td>2 minutes 13 seconds</td><td>1 minute 19 seconds</td><td>2 minutes 41 seconds</td></tr><tr><td>Print time</td><td>7 minutes 45 seconds</td><td>4 minutes 4 seconds</td><td>7 minutes 14 seconds</td></tr><tr><td>Reflow time and temperature</td><td>140°C for 45 seconds, and then 190°C for 30 seconds</td><td>140°C for 45 seconds, and then 190°C for 30 seconds</td><td>140°C for 45 seconds, and then 190°C for 30 seconds</td></tr></tbody></table><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305872809-67b611e261b0bec88d8c19f8_printing-decimal-counter-solder-paste-settings.webp" style="width:100%px" class="fr-fic fr-dib" />V-One dispense settings for solder paste<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305891591-67b611fbfe442789178d1bf0_printing-decimal-counter-dispensing-solder-paste.webp" style="width:100%px" class="fr-fic fr-dib" />V-One dispensing solder paste on decimal counter board<h3>Connecting the boards</h3>The three boards were linked using JST-SM connectors and wires. We connected the voltage regulator board to a battery and the pulse generator. We then connected the pulse generator outputs to the decimal counter’s clock input pins.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305911112-67b6121db8bc92cddce00d9b_printing-decimal-counter-three-boards-connected.webp" style="width:100%px" class="fr-fic fr-dib" />The connected boards<h3>Printing enclosures</h3>To protect the circuits from any impact during handling, we designed and 3D printed three enclosures using PLA filament. <img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759305952072-67b6123517e8883f762c20bf_printing-decimal-counter-3d-printed-enclosures.webp" style="width:100%px" class="fr-fic fr-dib" />3D printed enclosures for the boards<h2>Challenges and advice </h2><h3>Troubleshooting interconnected circuits</h3>Errors in interconnected systems could originate from any board, which made troubleshooting a bit more complex than a single board. To streamline the process, we recommend checking component polarity and orientation before populating the components, and reference their datasheets when necessary. Additionally, it’s helpful to check for continuity with a multimeter, or with an oscilloscope to calculate and view the frequency of the pulses.<h2>Conclusion</h2>This project highlights the potential of additive PCB prototyping in electronics education. By combining theory and practice, students can explore how digital counting systems function, understand the role of BCD-to-seven-segment conversion, and observe how timing signals interact with display components. Direct ink writing platforms like V-One empower the next generation of engineers to innovate beyond breadboards and rapidly iterate on electronics designs. If you are interested in exploring other PCB prototyping projects we have completed, take a look at:<ul><li><a href="https://www.voltera.io/use-cases/white-papers/printing-control-board-line-following-robot-silver-ink-fr1">Printing a Control Board for a Line Following Robot with Silver Ink on FR1</a></li><li><a href="https://www.voltera.io/use-cases/white-papers/printing-flexible-pcb-silver-ink-pet">Printing a Flexible PCB with Silver Ink on PET</a></li><li><a href="https://www.voltera.io/use-cases/white-papers/dispensing-solder-paste-factory-fabricated-pcbs">Dispensing Solder Paste on Factory Fabricated PCBs</a></li></ul>Want to be notified when we post new white papers? <a href="https://share.hsforms.com/1DG3jeG6BRDOZ6o0OGyVv-g34u2a?__hstc=13863464.b371495642f74614d42925881b9be34d.1755072974205.1758183301691.1759304787796.4&amp;__hssc=13863464.1.1759304787796&amp;__hsfp=875581106">Sign up for our newsletter</a>.

A decimal counter is a digital circuit that cycles through zero to nine using logic components. It is essential in clocks and timers. Making a decimal counter using seven-segment displays offers great opportunities for students to learn sequential logic, clock signals, and circuit integration.

Printing a Decimal Counter Circuit with Silver Conductive Ink on FR1

A technical deep dive into the NMOS symbol, working, and device behavior, contribution in analog design and advanced NMOS technologies in the modern age.

NMOS Symbol: Comprehensive Guide to N Channel MOSFET Symbols, Operation and Applications

<h1 id="isPasted">Introduction</h1>The industrial robotics landscape is experiencing remarkable growth and transforming manufacturing operations worldwide. The market is expected to expand dramatically, with projections growing from $17.78 billion USD in 2024 to $84.36 billion USD by 2034. This expansion is driven by labor shortages, accelerating automation demands, and the paradigm of Industry 5.0. Complementing this growth, the collaborative robot market is rapidly expanding at 31.6% CAGR, and expected to reach $11.64 billion USD by 2030.  While companies navigate this market growth, connectivity has emerged as the backbone of industrial robotics. Modern automation systems demand far more than conventional electrical connections. They require advanced connector solutions that can endure continuous motion, resist harsh environments, and maintain the high signal integrity demanded by modern robotic applications. These trends underline the important role of advanced connector systems as enablers of reliable automation. Without them, the next generation of robotics can’t be fully realized.<h1 id="isPasted">The Connectivity Challenge in Industrial Robotics</h1>Industrial robotics have unique connectivity challenges that differ from traditional automation applications. The continuous motion inherent in robotic systems means that cables and connectors are subject to constant forces that would quickly break down conventional solutions. Six-axis industrial robots are the standard in modern manufacturing, and pose a particularly complex challenge for cable management because traditional connections can’t accommodate the full range of motion required.Environmental protection is another important challenge. Industrial robots operate in harsh conditions where exposure to chemical, dust, and temperature extremes is expected. In industrial environments, multiple robotic applications require a minimum protection of IP65 to protect against water ingress, dust intrusion, and chemical exposure that could compromise system integrity.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759403171134-connec+1.jpg" style="width:813px" class="fr-fic fr-dib" />Connectors on modern industrial robots must withstand harsh environments and constant movement | Source: TE ConnectivitySignal integrity and power delivery are another layer of complexity. Modern industrial robots require simultaneous transmission of power, digital control signals, analog feedback, and increasingly high-speed communication protocols. Connector systems must simultaneously maintain signal quality, withstand the stress of continuous motion, and meet the space constraints of compact robotic designs.Connectivity failures can come at a huge expense to production. According to industry research, cable issues are the number one cause of downtime in robotic work cells. Connectivity failure can cause cascading effects through an integrated production line, potentially costing thousands of dollars per hour in lost productivity, meaning that reliable connectivity is a business imperative.The complexity of cable management in multi-axis robots has led to the adoption of segmented approaches, where cable routing is divided into sections corresponding to robot joints. However, this approach requires connector solutions that can handle frequent mating and demating while maintaining environmental and signal requirements. Traditional connector systems with bulky size and shape and complex multi-step mating often become maintenance bottlenecks.Ultimately, the ability of a connector system to balance durability, compactness, and signal integrity determines whether a robot operates as a productive asset or becomes a costly maintenance liability. These demands explain why connectivity has become one of the most decisive factors in modern robot design.<h3>TE Connectivity's HDC H3A-TIC-LOQ Solution</h3>TE Connectivity has addressed these challenges in connectivity with their innovative HDC H3A-TIC-LOQ connector system, which is specifically engineered to meet the demands of modern robotic applications. This system is a significant advancement in connector technology, as it combines compact design with user-friendly features and directly addresses the biggest challenges in industrial environments.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759403224846-conec+2.jpg" style="width:100%px" class="fr-fic fr-dib" />TE Connectivity’s H3A-TIC-LOQ connector | Source: TE ConnectivityThe HDC H3A-TIC-LOQ system has a high-density design with 32 contacts in a compact form factor. The contact density saves a significant amount of space in applications where every cubic centimeter is critical. This is particularly important in collaborative robotic environments, where compact designs are required for closer human-robot interaction. The system has a modular architecture and is compatible with standard HDC HQ inserts, making it flexible for system integration while maintaining the benefits of advanced TIC-LOQ housing technology.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1759403316427-conec+3.jpg" style="width:100%px" class="fr-fic fr-dib" />H3A TIC-LOQ is a one-step locking solution, unlike traditional systems | Source: TE ConnectivityThe housing itself incorporates the innovative TIC-LOQ (Twist, Insert, Connect - Lock On Quickly) automatic locking system. Unlike traditional heavy-duty connectors that require more complex two-step mating procedures, involving careful alignment and separate locking actions, the HDC H3A-TIC-LOQ system allows technicians to complete the connection in just two seconds through a single, intuitive motion. This reduction in mating time and complexity has been shown to directly reduce maintenance and downtime, resulting in improved production activity for robotic installations.TE Connectivity’s system also achieves environmental protection, with an IP65 rating when mated. This provides robust protection against dust ingress and water jets common during industrial cleaning operations. The connector system has an operating temperature range of -40°C to 125°C,  making it reliable across extreme temperature variations in industrial environments, from cold storage facilities to high-temperature manufacturing.Electrical specifications of the HDC H3A-TIC-LOQ system are also tailored for industrial robot applications. The system maintains its compact form factor while providing a current rating of 2.2A per contact and voltage rating of 32V to effectively handle the power and signal requirements of modern robots. Its 0.8kV impulse voltage rating provides additional protection against electrical transients common in industrial environments with heavy machinery and variable frequency drives.Connector materials also reflect the demanding mechanical requirements of industrial robots. The die-cast zinc alloy housing provides durability and EMC shielding, while the polymer insert keeps the electrical insulation and contact retention reliable. This combination of materials maintains connector stability that is essential for reliable electrical performance.The system’s compatibility with standard HDC HQ connectors is also a big advantage for system integrators and end users. Existing cable assemblies and termination procedures can often be retained when integrating the HDC H3A-TIC-LOQ system. By reducing mating complexity, maximizing space efficiency, and ensuring environmental resilience, the H3A-TIC-LOQ bridges the gap between laboratory design and factory-floor reliability. For engineers, it is a system that simplifies integration and sustains long-term performance.<h1>Real-World Applications and Benefits</h1>The versatility of advanced connector systems like HDC H3A-TIC-LOQ is demonstrated through diverse applications across multiple industries. For example, in automotive manufacturing, these connectors have allowed engineers to develop sophisticated robotic assembly lines. Modern automotive robots equipped with advanced connectivity solutions can perform precision welding, painting, and assembly with repeatability around ±0.01 mm. Compact, reliable connectors facilitate the integration of multiple robotic systems in coordinated cells and support flexible manufacturing that can produce multiple models on the same line.In electronics assembly, miniaturization challenges exceed human capabilities, requiring robots that accurately place components as small as 0.1mm. Advanced connectors enable high-speed data communication for real-time machine sensing and support continuous operation in cleanroom environments. This level of precision reduces defect rates from over 3% using manual processes to under 1% with robotic assembly. Collaborative robots (cobots) also benefit from compact connector designs that maintain workflow and safety. The HDC H3A-TIC-LOQ’s compact form and easy mating suit cobot applications that require frequent reconfiguration and maintenance access. Cobots can boost productivity while reducing injuries by automating repetitive and physically demanding tasks.Predictive maintenance enabled by advanced connectors cuts downtime by 25-30%. IoT sensors monitor connector integrity and cable condition. In doing so, they provide early warnings and enable planned repairs, preventing costly emergency shutdowns and maintenance.Additionally, Industry 5.0 integration focuses on human-robot collaboration and mass customization. Advanced connector systems support rapid reconfiguration in flexible manufacturing, enabling robotic cells to produce different products. Early adopters report significantly reduced cycle time due to reduced maintenance, improved reliability, and faster changeover.These use cases illustrate how robust connectors move beyond a supporting role and become central to robotic innovation. From precision assembly to predictive maintenance, the choice of connector can directly shape throughput, safety, and the economics of production.<h1>Future Trends and Technological Evolution</h1>AI-driven automation is also placing new demands on connectivity. Robots must adapt to material, process, and product variations in real-time, requiring high-bandwidth links for transmitting large sensor data and complex commands with low latency. Future connectors must support current and emerging protocols, and provide bandwidth for increasing complex AI algorithms. Mobile manipulators, which combine autonomous mobility and precise robotic arms, also require robust connectors that can accommodate vibration, acceleration, and environmental changes due to movement. Unlike fixed robots, mobile manipulators have unique connectivity challenges that demand innovative and flexible solutions.5G and edge computing are reshaping robotic architectures. These technologies offload complex computations to edge servers while maintaining low latency for precise control. Connectors must support high-speed data transmission with industrial reliability. Additionally, 5G allows engineers to develop new applications like remote robot operation and collaborative AI systems across industrial installations.Components are increasingly miniaturized as sensors and AI increase connectivity density demands in smaller packages. Advanced manufacturing means that engineers can design contact pitches below 1mm without sacrificing robustness. This is essential for space-constrained applications.Sustainability is an important factor in connector design and materials. Manufacturers aim to reduce their environmental impact by using recycled materials, implementing energy-efficient manufacturing processes, and extending product life. New materials, like bio-based plastics and nano-structured contacts, are the future of performance balanced with sustainability.Predictive maintenance is another factor toward improved sustainability. When combined with embedded IoT sensors, predictive maintenance detects wear, changes in electrical resistance, and environmental intrusion early. Advanced connectors enable real-time feedback for reduced downtime and continuous improvement.As robotics evolve alongside AI, 5G, and sustainability initiatives, connector systems will continue to define the limits of what machines can achieve. The next generation of automation will rely on these components to deliver both performance and adaptability in equal measure.<h1>Conclusion: Enabling the Next Generation of Industrial Robotics</h1>Advanced connector systems have become key enablers of robotic innovation amid a booming industrial robotics market projected to reach $60 billion by 2034. TE Connectivity’s HDC H3A-TIC-LOQ solution addresses modern connectivity challenges with high-density design, quick mating, environmental protection, and modular flexibility. As Industry 5.0, AI, mobile manipulation, and 5G converge, engineers must prioritize advanced connectivity to meet evolving demands. For engineers embarking on robotic automation projects, choosing robust connector solutions like the HDC H3A-TIC-LOQ is critical to minimizing downtime and maximizing performance. In this way, advanced connectors are not just hardware. Rather, they are strategic enablers of industrial resilience and progress.<a href="https://www.mouser.com/new/te-connectivity/te-hdc-h3a-tic-loq-connectors">Discover more here.</a>

In the rapidly growing field of industrial robotics, reliable connectivity is essential for maintaining high signal integrity, especially in environments characterized by continuous motion and harsh conditions.

Advanced Connector Systems for Industrial Robotics

The automotive industry is shifting from driver assistance to higher levels of autonomy. The global autonomous vehicle market size is estimated at USD 273.75 billion in 2025 and is forecasted to reach around USD 4,450.34 billion by 2034, growing at a compound annual growth rate (CAGR) of 36.3% from 2025 to 2034. 1This transition depends not only on advanced software but also on precision-engineered electronic components that enable vehicles to sense their environment, process information, and respond in real time. Reliable sensing, high-speed communication, and efficient power electronics are central to autonomous driving systems.This article discusses the role of advanced electronic components in enabling autonomous driving and highlights how <a href="https://www.murata.com/en-us/">Murata</a>, 2 a global leader in advanced electronic components, supports this transformation with reliable, high-performance solutions tailored for automotive applications.<h1 id="isPasted">Integrated Solutions Across the Autonomous Stack</h1>Autonomous driving systems rely on an ecosystem of tightly integrated electronics that enable perception, decision-making, and connectivity in real time. Murata supports this ecosystem through a broad portfolio of sensors, passive components, and communication modules designed for automotive use. The strength of Murata’s approach lies in the performance of individual components and in their ability to function together across the full autonomous driving stack.<h2>Central Compute ECU Trends</h2>A key trend for autonomous platforms is the consolidation of multiple electronic control units (ECUs) into central compute architectures. Instead of dozens of distributed ECUs, automakers are moving toward fewer, more powerful central compute units capable of handling complex perception, planning, and control functions. These architectures demand high-performance SoCs with significant processing and power requirements. Murata contributes in this regard by providing components such as high-reliability silicon capacitors, inductors, and communication modules that ensure stable operation, signal integrity, and efficient power delivery within these high-power compute domains.<h2>Sensors for Perception and Control</h2>Murata offers a range of sensors that feed critical data into autonomous platforms, supporting the performance of central SoCs. These include accelerometers, gyroscopes, pressure sensors, and inertial measurement units (IMUs) optimized for stability and precision under demanding automotive conditions. IMUs are particularly important for high-precision vehicle localization, complementing GPS and enabling accurate navigation even in tunnels, urban canyons, or environments with weak satellite signals. Murata’s IMU solutions enhance the reliability of autonomous driving functions by providing precise motion and orientation data, and contribute to seamless sensor fusion with radar, LiDAR, and camera inputs.<h2>Passive Components for Signal Integrity and Power Stability</h2>Passive components play a less visible but equally crucial role in the performance of autonomous systems. Murata’s <a href="https://www.murata.com/en-us/products/capacitor/siliconcapacitors/overview/lineup/atsc">ATSC</a> silicon capacitor series combines compact footprints with stable operation in harsh environments. The series offers capacitance values ranging from 390 picofarads to 1 microfarad in package sizes as small as 0.63 × 0.63 mm, supporting space-constrained automotive electronics. These capacitors operate reliably across a temperature range of –55 °C to +200 °C, with negligible ageing effects of less than 0.001% per 1,000 hours, making them suitable for ADAS circuits exposed to continuous thermal cycling. 3, 4The ATSC capacitors provide secure operation in automotive power domains with a rated voltage of 16 VDC and a breakdown voltage of 30 VDC. Their capacitance variation is limited to about 0.1% per volt, and insulation resistance reaches up to 50 GΩ at 10 V and 25 °C, ensuring minimal leakage and consistent decoupling performance. This high reliability is reflected in a reported failure rate below 0.017 FIT (failures in 10⁹ device hours), supporting the stringent lifetime expectations of safety-critical automotive platforms. 3, 4 Similarly, the <a href="https://www.murata.com/en-us/products/capacitor/siliconcapacitors/overview/lineup/wasc">WASC series</a> supports wide operating voltage ranges with stable performance, making them suitable for the power management and high-frequency filtering demands of autonomous platforms. These passive components enable consistent system responses even under rapidly changing conditions on the road. 5<h2>Communication Modules for Connectivity</h2>Murata’s wireless communication modules cover Wi-Fi, Bluetooth, and cellular interfaces that are widely adopted in telematics and infotainment units. For in-vehicle networking, Murata provides modules that support Ethernet and CAN-based architectures, aligning with OEM shifts toward zonal and central compute platforms. These modules are designed to meet automotive-grade standards for temperature tolerance, vibration resistance, and long lifecycle performance.<h2>Integration and Reliability Across the Stack</h2>Murata enables system designers to reduce complexity, minimize footprint, and maintain the high reliability required for safety-critical applications by offering components that are optimized to work together. Automotive-grade compliance across product families ensures that these solutions can withstand the operational stresses of real-world driving and support the scalability needed for higher levels of autonomy.<h1>Powering Automotive LiDAR: The Role of Silicon Capacitors</h1>LiDAR systems are critical for autonomous vehicles to perceive their surroundings by emitting laser pulses and detecting their reflections to create high-resolution 3D maps. This application requires capacitors capable of supporting high-output, short-pulse light emissions, which translate into precise distance and object detection.Murata’s silicon capacitors and integrated passive devices (IPDs) are specially developed to meet these LiDAR requirements. Their low equivalent series inductance (ESL) characteristics enhance detection range and resolution. Due to their small size and low profile, these capacitors are placed very close to laser diodes and connected via wire bonding, reducing parasitic inductance and enabling emission of narrow pulses approximately 1.5 nanoseconds wide at power levels of 100 watts or higher. Silicon IPDs further enhance this capability by integrating capacitors and wiring within a silicon interposer, achieving even shorter pulses of about 0.9 nanoseconds at 120 watts or more. These technological advantages allow LiDAR systems to deliver high output safely within eye-safe standards (IEC 60825), supporting advanced autonomous driving functionalities in compact device footprints. 6<h1>Ultrasonic Sensing for Near-Field Object Detection </h1>Just like technologies like LiDAR are used for long-range perception, autonomous vehicles rely on ultrasonic sensors for close-range object detection, which is critical for parking assistance, low-speed maneuvers, and near-field safety. Murata’s latest drip-proof ultrasonic sensor, the <a href="https://www.murata.com/en-us/news/sensor/ultrasonic/2023/0626">MA48CF15-7N</a>, demonstrates the company’s innovation in this space. It is housed in a hermetically sealed package to prevent liquid ingress and remain functional in wet conditions such as rain or surface spray. The sensor operates by emitting ultrasonic waves and measuring their reflections for both object presence detection and distance measurement applications. 7It operates over a wide detection range from 15 cm to 550 cm and covers a beam angle of 120° by 60°, enabling accurate and wide-area obstacle detection. Such a range and coverage allow vehicles to identify obstacles in complex environments like parking lots or urban traffic scenarios. 7Its capacitance of 1100pF±10% at 1kHz is tightly controlled, removing the need for transformer adjustments. The sensor also achieves a resonant frequency of 48.2±1.0kHz and a Q value of 35±10, with tolerances reduced by half compared to previous versions. These refinements result in more consistent detection characteristics across individual units and improved performance over varying temperatures. 7In the context of ADAS and Level 2+ autonomous functions, ultrasonic sensors like the MA48CF15-7N complement other perception technologies such as radar and cameras. 7<h1>Design and Reliability Considerations for Automotive-Grade Electronics</h1>Automotive environments subject electronic components to demanding conditions. In this regard, compactness is a fundamental requirement, since modern vehicles integrate a number of sensors, communication modules, and control units in limited spaces. Therefore, maintaining a small footprint ensures that they fit within dense electronic control systems.Heat resistance is also very important as power electronics, sensor modules, and communication systems are often located near engines or high-current pathways, where ambient temperatures fluctuate widely and may remain elevated for extended periods. Components used in such settings must retain stable electrical characteristics across these conditions to avoid degradation over time.Vehicles also expose electronics to constant mechanical stress. Vibration from engines, road conditions, and chassis movement can loosen poorly designed parts or cause internal micro-cracks that shorten service life. Hence, manufacturers emphasize vibration-tolerant designs that can withstand the mechanical fatigue inherent in automotive use. Moreover, automotive-grade components are expected to function reliably over a long lifecycle. Murata incorporates these design considerations into its product development and testing processes. The company designs its inductors and other passive components with materials and structures that balance miniaturization, thermal stability, and mechanical resilience. Murata subjects its products to stringent reliability assessments, including high-temperature storage, thermal shock, humidity resistance, and vibration testing to qualify for automotive deployment. These evaluations align with the Automotive Electronics Council’s AEC-Q200 standard, which sets the industry benchmark for passive component qualification. Compliance with AEC-Q200 assures automakers that Murata’s components meet established reliability criteria, making them suitable for safety-related systems and long-term use in harsh operating environments. 8<h1>Future Outlook: Preparing for Higher-Level Autonomy</h1>The trajectory of autonomous driving points toward higher levels of automation, from today’s Level 2+ driver assistance to Level 4 and eventually Level 5 autonomy. Achieving this progression requires continuous improvements in sensor precision, electronic integration, and component miniaturization.Central compute architectures are expected to become the standard, consolidating perception, planning, and control functions into fewer but more powerful platforms. These architectures depend heavily on reliable sensors, capacitors, inductors, and communication modules.As vehicles rely more on over-the-air updates and software-defined features, the role of robust and adaptable hardware components will be critical. Murata’s future readiness and ongoing investment in silicon capacitors, ultrasonic sensors, and wireless modules ensure that it can continue to support OEMs as they move toward higher-level autonomy.For more information, explore <a href="https://www.murata.com/en-us/">Murata’s</a> full lineup of automotive-grade solutions and learn how these technologies can support your next design.<h1>References</h1><ol><li>Zoting S. (2025) Autonomous Vehicle Market Size and Forecast 2025 to 2034 [Online] Precedence Research. Available at: <a href="https://www.precedenceresearch.com/autonomous-vehicle-market">https://www.precedenceresearch.com/autonomous-vehicle-market</a> (Accessed on August 20, 2025)</li><li>Murata [Online]. Available at: <a href="https://www.murata.com/en-us/">https://www.murata.com/en-us/</a>  (Accessed on August 20, 2025)</li><li>Silicon Capacitors ATSC Series [Online] Murata. Available at: <a href="https://www.murata.com/en-us/products/capacitor/siliconcapacitors/overview/lineup/atsc">https://www.murata.com/en-us/products/capacitor/siliconcapacitors/overview/lineup/atsc</a> (Accessed on August 20, 2025)</li><li>ATSC [Online] Mouser. Available at: <a href="https://www.mouser.com/datasheet/2/281/Commercial_leafletATSCV17Murata-1660588.pdf?srsltid=AfmBOor6jDnXYkQS1CW53WGJR33ihcU4MyKsnXrAywNZBsTlZQAJ1ArA">https://www.mouser.com/datasheet/2/281/Commercial_leafletATSCV17Murata-1660588.pdf?srsltid=AfmBOor6jDnXYkQS1CW53WGJR33ihcU4MyKsnXrAywNZBsTlZQAJ1ArA</a> (Accessed on August 20, 2025)</li><li>Silicon Capacitors WASC Series [Online] Murata. Available at: <a href="https://www.murata.com/en-us/products/capacitor/siliconcapacitors/overview/lineup/wasc">https://www.murata.com/en-us/products/capacitor/siliconcapacitors/overview/lineup/wasc</a> (Accessed on August 20, 2025)</li><li>Silicon capacitor/IPD that realizes high-output, short-pulse light for automotive LiDAR [Online] Murata. Available at: <a href="https://www.murata.com/en-us/products/capacitor/siliconcapacitors/overview/automotive">https://www.murata.com/en-us/products/capacitor/siliconcapacitors/overview/automotive</a></li><li>Murata Addresses Emerging Autonomous Driving Functions with Latest Drip-Proof Ultrasonic Sensor [Online] Murata. Available at: <a href="https://www.murata.com/en-us/news/sensor/ultrasonic/2023/0626">https://www.murata.com/en-us/news/sensor/ultrasonic/2023/0626</a> (Accessed on August 20, 2025)</li><li>AEC-Q200-compliant inductors optimised for in-vehicle PoC systems [Online] Murata. Available at: <a href="https://www.murata.com/en-us/news/inductor/power/2021/0422">https://www.murata.com/en-us/news/inductor/power/2021/0422</a> (Accessed on August 20, 2025)</li></ol>

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