Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
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Semiconductors
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The system uses reconfigurable electromechanical building blocks to create structural electronics.
V-One, a PCB printer developed by Voltera, a Canadian company that makes rapid prototyping platforms for printed electronics.
A countersink in PCB design is a conical recess that allows flat-head screws to sit flush with the board surface. This article explores countersinks vs. counterbores, when to use them, IPC standards, manufacturing considerations, and best practices to ensure reliable, cost-effective PCB designs.
Nanomaterials are integrated into the 3D printing process to enhance the performance of printed electronics.
PCBs are integral to the functionality of consumer electronics, providing the necessary infrastructure for complex circuitry in a compact form.
A step-by-step guide on designing and fabricating modern printed circuit boards (PCBs) for professional and academic applications.
New electronics printing technologies enable the production of miniature, high-performance 3D electronic devices, with nanomaterials being key to the process
This article provides an in-depth overview of the various PCB components that make up electronic circuits – from passive elements like resistors and capacitors to active semiconductors and electromechanical devices.
OSAT (Outsourced Semiconductor Assembly and Test) firms package, assemble, and test chips for fabless companies and foundries. As chip complexity rises, they boost efficiency, lower costs, and speed market entry for AI, IoT, and HPC. This article reviews OSAT fundamentals, players, and trends.
Flexible hybrid electronics (FHE) enable bendable, stretchable devices for healthcare, consumer tech, and automotive. Explore how electronics manufacturers are leveraging FHE to meet new requirements across industries.
4 minutes read
Advanced PCBs use features like microvias and fine-line traces to achieve ultra-high wiring density that leads to miniaturization and improved device performance
Nanoinks and nanopastes are composed of nanoparticles suspended in a solution or paste. These materials can be printed or applied to surfaces with extreme precision, making them ideal for electronic manufacturing.
High-Bandwidth Memory (HBM) is a 3D-stacked DRAM designed for ultra-high bandwidth and efficiency. Used in GPUs, AI, and HPC, it tackles memory bottlenecks by stacking dies vertically near processors. This article explores its evolution, architecture, and impact on modern computing.
Discover how NOVA’s Smart Dispenser module unlocks consistent and high-precision trace printing for a range of ink viscosities.
Researchers developed a scalable, low-cost device that can generate high-power terahertz waves on a chip, without bulky silicon lenses.
