Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
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Semiconductors
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Full Adder Circuit: Theory, Design and Practical Implementation
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TAGGED WITH flexible electronics
This guide explains how potentiometer pins interact with mechanical rotation, resistive tracks, and load conditions across various circuit configurations. It provides clarity for both low-power electronic designs and high-precision embedded systems.
This technical article explains the theory behind potentiometer schematics. It shows how to implement mechanical and digital potentiometers in practical circuits, tailored for engineers, and students.
Engineering teams can achieve AI-ready design data with five-level maturity model by Keysight. The unified, traceable data accelerates design cycles, boosts IP reuse, and reduces costly re-spins.
Altium Agile Team transforms hardware development with real-time collaboration, connected workflows, and built-in visibility — helping electronics teams innovate faster and stay aligned.
TAGGED WITH pcb
Source transformation is the method of converting a voltage source with series resistance into an equivalent current source with parallel resistance (and vice versa). This guide explains the theory, math, circuit examples, and practical applications for modern digital and hardware engineers.
Resistors are the quiet regulators of electronic circuits. They shape current, set voltages, bias transistors, protect components, and stabilize signals. This article breaks down the physics of resistance, explores modern resistor technologies, and offers practical guidance.
Many beginners may be confused about the Solder Mask Layer and Paste Mask Layer because they share some similarities. In this article, we will introduce the differences between solder masks and paste masks, enabling beginners to gain a better understanding.
Ground is the reference point that makes voltage meaningful and the return path that allows current to flow. This article explains what is ground in a circuit, discusses different types of grounds, and shows how to implement effective grounding strategies
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Master HBM memory technology with our comprehensive engineering guide covering 3D stacking architecture, bandwidth calculations, and design optimization techniques. Discover implementation strategies for AI and HPC applications!
How today's semiconductors are powering the current and future landscape of autonomous driving
Researchers at ETH Zurich and Empa have developed a new image sensor made of perovskite. This semiconductor material enables better colour reproduction and fewer image artefacts with less light. Perovskite sensors are also particularly well suited for machine vision.
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Plasma Science and Fusion Center researchers created a superconducting circuit that could one day replace semiconductor components in quantum and high-performance computing systems.
Discover how Dry Phase Patterning (DPP) showcased a 99 percent reduction both in carbon footprint and electricity used compared to conventional wet etching.
This technical guide explores the various types, material properties, manufacturing processes, and key design considerations associated with blank PCB technology!
By performing deep learning at the speed of light, this chip could give edge devices new capabilities for real-time data analysis.
Ball Grid Array (BGA) is a high-density packaging technology using solder balls for connections. This guide covers BGA design principles, performance advantages, modern applications (2000+ pins in 45mm), and cutting-edge implementation techniques for engineers.
Michigan Engineers are leading hardware efforts to enable the AI required for full autonomy.
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Embedded Multimedia Card (eMMC) is a non-volatile flash memory mainly used in mobile devices and embedded systems. It has a single package design featuring a NAND flash memory integrated with a memory controller.
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Parylene coatings present unique challenges when it comes to rework and removal. They often outperform other conformal coatings. Parylene has better barrier properties, uniform coverage, and performance in thinner layers.
How xDS Turns Static Deep Learning Deployments into Resilient, Dynamic Systems
Flat flexible cables and flexible printed circuit solutions enable high-density, high-speed connections across a wide range of modern electronic applications. While Molex delivers the interconnect technology, Sager supports engineers with design guidance, prototyping, and supply chain execution.
Memory safety, a key concept in software development, addresses how an application handles memory operations, such as reading, writing, allocation, and deallocation.
Physicists at ETH Zurich have developed a lens with magic properties. Ultra-thin, it can transform infrared light into visible light by halving the wavelength of incident light.
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