Research and Development product leaders like you and me drive innovation. We turn ideas and problems into safe and manufacturable products by exploring new technologies, materials, and processes to meet technical needs and customer expectations.
Research and Development product leaders like you and me drive innovation. We turn ideas and problems into safe and manufacturable products by exploring new technologies, materials, and processes to meet technical needs and customer expectations.
In this context, dynamic constraint checking includes software runtime checks (assertions that make checks over the correct behavior of the system) and hardware checks provided by some microprocessors, for example, memory protection provided by a Memory Management Unit (MMU).
New smart textiles developed by researchers at ETH Zurich use acoustic waves and glass fibres to help make precise measurements. They are light, breathable and inexpensive, and offer great potential for medicine, sports and everyday life.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
A PCB design can be electrically correct, pass every design rule check and perform exactly as expected on an engineer's screen - and still cause significant problems when it reaches manufacturing.
A semiconductor is a material whose electrical conductivity falls between that of a conductor and an insulator and can be controlled by temperature, light, and impurities. This article covers semiconductor materials, doping, diodes, transistors, and integrated circuits.
Research and Development product leaders like you and me drive innovation. We turn ideas and problems into safe and manufacturable products by exploring new technologies, materials, and processes to meet technical needs and customer expectations.
In this context, dynamic constraint checking includes software runtime checks (assertions that make checks over the correct behavior of the system) and hardware checks provided by some microprocessors, for example, memory protection provided by a Memory Management Unit (MMU).
New smart textiles developed by researchers at ETH Zurich use acoustic waves and glass fibres to help make precise measurements. They are light, breathable and inexpensive, and offer great potential for medicine, sports and everyday life.
Manufacturing semiconductors is made simpler and more cost-effective with the use of cutting-edge microdispensing technologies that can print on a range of substrates.
Nexperia NEVB-MTR1-KIT1 is a motor driver evaluation kit that can be set up in under two minutes, supports USB-C Power Delivery, allows microcontroller and component swapping, and offers open-source firmware for fast customization and real-world motor control development.
This in-depth technical guide explains what is galvanic corrosion, covering the electrochemical mechanisms, influencing factors, consequences in electronics, and mitigation strategies in electronics, hardware, and industrial systems.
An edible robot made by EPFL scientists leverages a combination of biodegradable fuel and surface tension to zip around the water's surface, creating a safe - and nutritious - alternative to environmental monitoring devices made from artificial polymers and electronics.
Join MVTec to explore how advanced machine vision software is revolutionizing semiconductor wafer inspection with live demos, not slides—boosting precision, quality, and efficiency.
LGA uses flat pads for connections, while BGA relies on solder balls for permanent mounting. This guide compares their thermal performance, electrical traits, reliability, and assembly pros and cons to help you choose the best IC package for your needs.
Functional inks are the backbone of printed electronics, transforming ordinary substrates like plastic, paper, or textiles into smart, interactive devices.
Reliability is a top priority in defense and aerospace electronics in harsh, unforgiving environments. The MIL-I-C standard is a guideline for conformal coating materials that helps keep PCBAs safe from military environments, ensuring dependable performance.
This article explores the principles, methods, and real-world applications of the solderability test, offering insights into how it enhances quality assurance across modern electronics manufacturing processes!