This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Article #1 of Connectivity and Sensing in Harsh Environments Series: Electrical components that enable the transfer of control and power are improving to fulfill the requirements of cutting-edge industrial applications.
Multifunctional shape-morphing material with reversible
and rapid polymorphic reconfigurability implemented into a soft robotic morphing drone that autonomously transforms from ground to air vehicle and an underwater morphing machine.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Article #1 of Connectivity and Sensing in Harsh Environments Series: Electrical components that enable the transfer of control and power are improving to fulfill the requirements of cutting-edge industrial applications.
Multifunctional shape-morphing material with reversible
and rapid polymorphic reconfigurability implemented into a soft robotic morphing drone that autonomously transforms from ground to air vehicle and an underwater morphing machine.
The Industrial IoT (IIoT) is the foundation of Industry 4.0. By sending sensor data to the cloud and using it to feed machine learning algorithms, manufacturers can detect process problems immediately, rather than at later stages when rework and field failures are much more expensive.
An oligomeric [8]annulene-based material has been shown to be suitable for creating single-molecule components including logic elements, switches, and gates — and could be one of the ways Moore's Law is kept marching in the semiconductor industry.
High-fidelity touch has the potential to significantly expand the scope of what we expect from computing devices, making new remote sensory experiences possible.
Introducing the Connectivity and Sensing in Harsh Environments Series: Advancements in aerospace, defense, construction, power systems, automobiles, nuclear reactors, and various other fields have made it necessary for systems engineers to ensure reliable performance in the harshest environments.
Designed around a novel DNA aptamer, this flexible sensor array can pick up your cortisol — and therefore stress — levels by sampling your sweat, and transmit readings to a nearby smartphone or other device for long-term tracking.
Demonstrated at a small scale in the lab, this free-positioning wireless power transfer system offers a highly robust connection to moving receivers over a wide area using a "counter-intuitive" approach.
Tapis Magique is a pressure-sensitive, knitted electronic textile carpet that generates 3D sensor data based on body gestures and drives an immersive sonic environment in real time.
Designed to address the exploding computational demands of deep neural networks, physical neural networks (PNNs) branch out from electronics into optics and even mechanics to boost performance and efficiency.
Taking its cues from the haunting electronic instrument, the MoCapaci project sews a theremin into a blazer to feed a deep-learning system with data for accurate gesture sensing and activity recognition.
In this episode, we talk about how embedding information about products can change consumer insight regarding their purchases and the best way to make high quality, affordable, and flexible OLED screens