This article provides a detailed understanding of microprocessor vs integrated circuit, their basics, key differences, future trends, challenges, and how they synergize to form the backbone of our digital systems.

Microprocessor vs Integrated Circuit: Unveiling the Core of Modern Technology

The new hardware reimagines AI chips for modern workloads and can run powerful AI systems using much less energy than today’s most advanced semiconductors, according to&nbsp;<a href="https://ece.princeton.edu/people/naveen-verma" target="_blank">Naveen Verma</a>, professor of electrical and computer engineering. Verma, who will lead the project, said the advances break through key barriers that have stymied chips for AI, including size, efficiency and scalability.Chips that require less energy can be deployed to run AI in more dynamic environments, from laptops and phones to hospitals and highways to low-Earth orbit and beyond. The kinds of chips that power today’s most advanced models are too bulky and inefficient to run on small devices, and are primarily constrained to server racks and large data centers.Now, the Defense Advanced Research Projects Agency, or DARPA, has <a href="https://www.linkedin.com/feed/update/urn:li:activity:7162915986004762624/" target="_blank" rel="noopener">announced</a> it will support Verma’s work, based on a suite of key inventions from his lab, with an $18.6 million grant. The DARPA funding will drive an exploration into how fast, compact and power-efficient the new chip can get.“There’s a pretty important limitation with the best AI available just being in the data center,” Verma said. “You unlock it from that and the ways in which we can get value from AI, I think, explode.”The announcement came as part of a broader effort by DARPA to fund “revolutionary advances in science, devices and systems” for the next generation of AI computing. The program, called OPTIMA, includes projects across multiple universities and companies. The program’s call for proposals estimated total funding at $78 million, although DARPA has not disclosed the full list of institutions or the total amount of funding the program has awarded to date.In the Princeton-led project, researchers will collaborate with Verma’s startup,&nbsp;<a href="https://www.enchargeai.com/" target="_blank" rel="noopener">EnCharge AI</a>. Based in Santa Clara, Calif., EnCharge AI is commercializing technologies based on discoveries from Verma’s lab, including several key papers he co-wrote with electrical engineering graduate students going back as far as 2016.Encharge AI “brings leadership in the development and execution of robust and scalable mixed-signal computing architectures,” according to the project proposal. Verma&nbsp;<a href="https://engineering.princeton.edu/news/2023/01/27/encharge-ai-reimagines-computing-meet-needs-cutting-edge-ai" target="_blank">co-founded the company</a> in 2022 with Kailash Gopalakrishnan, a former IBM Fellow, and Echere Iroaga, a leader in semiconductor systems design.Gopalakrishnan said that innovation within existing computing architectures, as well as improvements in silicon technology, began slowing at exactly the time when AI began creating massive new demands for computation power and efficiency. Not even the best graphics processing unit (GPU), used to run today’s AI systems, can mitigate the bottlenecks in memory and computing energy facing the industry.“While GPUs are the best available tool today,” he said, “we concluded that a new type of chip will be needed to unlock the potential of AI.”<h3>The needs are real</h3>Between 2012 and 2022, the amount of computing power required by AI models grew by about 1 million percent, according to Verma, who is also director of the&nbsp;<a href="https://kellercenter.princeton.edu/" target="_blank">Keller Center for Innovation in Engineering Education</a> at Princeton University. To meet demand, the latest chips pack in tens of billions of transistors, each separated by the width of a small virus. And yet the chips still are not dense enough in their computing power for modern needs.Today’s leading models, which combine large language models with computer vision and other approaches to machine learning, were developed using more than&nbsp;<a href="https://cmte.ieee.org/futuredirections/2023/11/14/llms-hitting-2-trillions-parameters/" target="_blank">a trillion variables</a> each. The Nvidia-designed GPUs that have fueled the AI boom have become so valuable, major companies reportedly transport them via armored car. The backlogs to buy or lease these chips stretch to the vanishing point.When Nvidia became only the third company ever to reach a $2 trillion valuation, the Wall Street Journal&nbsp;<a href="https://www.wsj.com/tech/ai/how-a-shifting-ai-chip-market-will-shape-nvidias-future-f0c256b1" target="_blank">reported</a> that a rapidly increasing share of the company’s rising revenue came not through the development of the models, called training, but in chips that enable the use of AI systems once they are already trained. Technologists refer to this deployment stage as inference. And inference is where Verma says his research will have the most impact in the near-to-medium term.“This is all about decentralizing AI, unleashing it from the data center,” he said. “It’s got to move out of the data center into places where we and the processes that matter to us can access computing the most, and that’s phones, laptops, factories, those kinds of things.”<h3>Freeing AI from the cloud</h3>To create chips that can handle modern AI workloads in compact or energy-constrained environments, the researchers had to completely reimagine the physics of computing while designing and packaging hardware that can be manufactured with existing fabrication techniques and that can work well with existing computing technologies, such as a central processing unit.“AI models have exploded in their size,” Verma said, “and that means two things.” AI chips need to become much more efficient at doing math and much more efficient at managing and moving data.Their approach has three key parts.The core architecture of virtually every digital computer has followed a deceptively simple pattern first developed in the 1940s: store data in one place, do computation in another. That means shuttling information between memory cells and the processor. Over the past decade, Verma has pioneered research into an updated approach where the computation is done directly in memory cells, called in-memory computing. That’s part one. The promise is that in-memory computing will reduce the time and energy it costs to move and process large amounts of data.But so far, digital approaches to in-memory computing have been highly limited. Verma and his team turned to an alternate approach: analog computation. That’s part two.“In the special case of in-memory computing, you not only need to do compute efficiently,” Verma said, “you also need to do it with very high density because now it needs to fit inside these very tiny memory cells.” Rather than encoding information in a series of 0s and 1s, and processing that information using traditional logic circuits, analog computers leverage the richer physics of the devices. The curvature of a gear. The ability of a wire to hold electrical charge.Digital signals began replacing analog signals in the 1940s primarily because binary code scaled better with the exponential growth of computing. But digital signals don’t tap deeply into the physics of devices, and as a result they can require more data storage and management. They are less efficient in that way. Analog gets its efficiency from processing finer signals using the intrinsic physics of the devices. But that can come with a tradeoff in precision.“The key is in finding the right physics for the job in a device that can be controlled exceedingly well and manufactured at scale,” Verma said.His team found a way to do highly accurate computation using the analog signal generated by capacitors specially designed to switch on and off with exacting precision. That’s part three. Unlike semiconductor devices such as transistors, the electrical energy moving through capacitors doesn’t depend on variable conditions like temperature and electron mobility in a material.“They only depend on geometry,” Verma said. “They depend on the space between one metal wire and the other metal wire.” And geometry is one thing that today’s most advanced semiconductor manufacturing techniques can control extremely well.

Princeton researchers have totally reimagined the physics of computing to build a chip for modern AI workloads, and with new U.S. government backing they will see how fast, compact and power-efficient this chip can get. An early prototype is pictured above. Photo by Photo by Hongyang Jia/Princeton University

The Defense Department’s largest research organization has partnered with a Princeton-led effort to develop advanced microchips for artificial intelligence.

Built for AI, this chip moves beyond transistors for huge computational gains

The OKdo Nano C100 Developer Kit presents an innovative approach to medical diagnostics, particularly in leveraging AI for leukemia detection. Its affordability and compatibility with the NVIDIA ecosystem democratizes access to AI technologies. The kit is powered by the NVIDIA® Jetson Nano Module, equipping it to handle complex AI workloads efficiently. This makes it an excellent choice for processing-intensive tasks, especially in medical AI applications.1In this article, we will explore the technical specifications of the OKdo Nano C100 Developer Kit and its potential in medical AI applications, focusing on leukemia classification. We will highlight how its cost-effectiveness and robust processing capabilities make it a game-changer in medical diagnostics, offering a power-efficient solution for advanced healthcare technology.<h2 dir="ltr">The OKdo Nano C100 Developer Kit: An Overview</h2>The NVIDIA® Jetson Nano module powers the OKdo Nano C100 Developer Kit. This module is central to the kit's capabilities, featuring a 128-core NVIDIA® Maxwell GPU and a Quad-core ARM A57 CPU, supported by 4 GB of 64-bit LPDDR4 memory. These components deliver robust processing power, crucial for handling sophisticated AI algorithms and workloads.The OKdo Nano C100 boasts extensive input/output capabilities regarding connectivity and integration. It includes a range of ports and connectors, such as USB 3.0 Type A, USB 2.0 Micro-B, HDMI/DisplayPort, M.2 Key E, Gigabit Ethernet, GPIOs, I2C, I2S, SPI, UART, 2x MIPI-CSI camera connector, a Micro SD card slot, and a fan connector. This array of I/O options significantly enhances its versatility, allowing for the integration of various sensors and devices, which is essential in diverse AI applications, including medical imaging and diagnostics.3Another standout feature of the OKdo Nano C100 is its power efficiency. The kit can be powered by a micro-USB 5V 2A or a DC power adapter 5V 4A, consuming as little as 5 watts. This efficient power usage is particularly beneficial for sustained operations in data-intensive tasks.Furthermore, the Developer Kit is supported by NVIDIA® JetPack, a comprehensive suite with a board support package (BSP), Linux OS, and essential software libraries like NVIDIA® CUDA, cuDNN, and TensorRT. These libraries are integral for deep learning, computer vision, GPU computing, and multimedia processing. The support provided by NVIDIA® JetPack simplifies the development process, reducing complexity and enhancing the kit's capability to handle advanced AI workloads, such as those required for leukemia classification.4For more detailed information about the technical specifications and capabilities of the OKdo Nano C100 Developer Kit, please visit their official <a href="https://www.okdo.com/p/okdo-nano-c100-developer-kit-powered-by-nvidia-jetson-nano-module/" target="_blank">website</a>.&lt;image&gt;<h2 dir="ltr" id="isPasted">Building a Leukemia Classification System with the OKdo Nano C100</h2>Building a leukemia classification system using the OKdo Nano C100 Developer Kit involves several key steps, focusing on integrating AI frameworks and models specific to medical imaging.&nbsp;We will discuss how to start with the OKdo Nano C100 developer kit and integrate it with AI frameworks to build a system. Here's a step-by-step guide:<ol><li dir="ltr">Initial Setup: Begin by unboxing the OKdo C100 Nano Developer Kit. Connect it to an HDMI monitor, a USB keyboard, and a mouse. An Ethernet connection is required for OS updates. Optionally, you can fit an M.2 E key wireless module for WiFi support. Connect a quality 5V/4A power supply, but do not power on.5</li><li dir="ltr">Camera Integration: The Nano C100 has two MIPI-CSI camera ports, supporting cameras based on imx219 and imx477 sensors. For the leukemia classification project, attach one or two compatible camera modules, such as the Raspberry Pi V2 camera, by sliding the ribbon cable into the connector with the blue marking facing away from the heat sink.5</li><li dir="ltr">Software Installation: The NVIDIA Jetson Nano module in the C100 comes with 16GB onboard eMMC storage. For development, it’s recommended to flash the system image to a microSD card (32GB or larger, Speed Class 10, A1 rated) and boot from there. Use BalenaEtcher to flash the official OKdo Nano C100 Developer Kit OS image, available on the OKdo Software &amp; Downloads hub.5</li><li dir="ltr">4.&nbsp;First Boot and Configuration: You'll follow a setup sequence, including accepting the NVIDIA end-user license agreement (EULA) upon initial boot. Set up the system language, keyboard layout, time zone, username, password, and computer name. Choose the maximum software partition size and configure the module in MAX power mode.5</li><li dir="ltr">Leveraging NVIDIA JetPack: The kit is supported by NVIDIA JetPack, which includes a board support package (BSP), Linux OS, NVIDIA CUDA, cuDNN, and TensorRT software libraries. This suite is vital for deep learning, computer vision, GPU computing, multimedia processing, and more. It simplifies the development process for AI applications.</li><li dir="ltr">AI Framework Integration: Integrate AI frameworks and models suitable for medical imaging. Leverage NVIDIA JetPack’s support for CUDA and deep learning libraries to build and train models for image classification, object detection, and segmentation.</li><li dir="ltr">Utilize Dual MIPI-CSI Camera Connectors: The dual MIPI-CSI camera connectors and the kit's support for AI video processing are crucial for medical imaging applications. They allow for integrating high-quality imaging sensors essential for accurate leukemia classification.</li></ol>The OKdo Nano C100's support for AI video processing is critical to the leukemia classification problem. This feature enables the Developer Kit to handle real-time video data, a capability essential for medical applications where dynamic imaging (like blood flow or cell movement) may be involved. The system can identify and analyze moving leukemia cells by processing video data, providing a more comprehensive understanding of the disease. This real-time processing capability, combined with the high-performance GPU and CPU of the OKdo Nano C100, makes it a powerful tool for advanced medical imaging and analysis tasks.3<h2 dir="ltr">Educational Implications: A Tool for University Students</h2>The OKdo Nano C100 Developer Kit is well-suited for educational purposes, especially for university students studying AI, machine learning, and medical imaging. With its NVIDIA Jetson Nano module, this kit offers an accessible yet powerful platform for developing and testing AI applications. It supports full desktop Linux and is compatible with peripherals that support 4K, including Ethernet, USB, and HDMI, making it a versatile tool for learning and experimentation.The kit's 128-core NVIDIA Maxwell GPU allows students to engage in various AI applications such as image classification, object detection, segmentation, and speech processing. This feature-rich environment is ideal for hands-on learning in AI and machine learning courses. It also uses NVIDIA’s Deepstream SDK, offering a comprehensive toolkit for AI-based video and image understanding, which is crucial for advanced studies in these fields.In terms of ease of use, the OKdo Nano C100 is designed for simplicity and accessibility. Its platform is built for easy use, running on as little as 5 watts, which is advantageous in an educational setting where resources and technical support might be limited. The Jetson developer kits are primarily intended for developing and testing software in a pre-production environment. They are suitable for educational projects emphasizing real-world applications and practical learning.Overall, the OKdo Nano C100 Developer Kit is a practical, accessible, and powerful tool that can significantly enhance the learning experience of university students in AI and related fields.<h2 dir="ltr">Future Outlook in Healthcare AI with OKdo Nano C100</h2>With its advanced AI capabilities, the OKdo Nano C100 Developer Kit is poised to impact future medical AI developments significantly. Its robust features, including a 128-core NVIDIA Maxwell GPU, Quad-core ARM A57 CPU, and extensive I/O capabilities, make it an ideal tool for complex AI workloads.In healthcare, the potential impact of the OKdo Nano C100 on quality and diagnostics is substantial. Its ability to run multiple neural networks in parallel for applications like image classification, object detection, segmentation, and speech processing can revolutionize medical imaging and diagnostics. For instance, its capability to process and analyze complex medical images in leukemia classification can lead to more accurate and faster diagnoses, improving patient outcomes. Additionally, its suitability for various AI applications means it can adapt to various healthcare needs, from drug discovery to patient monitoring, enhancing overall healthcare quality and efficiency.<h2 dir="ltr">Conclusion</h2>The OKdo Nano C100 Developer Kit is a significant technological advancement, particularly in on-premise AI systems. Its high computing capabilities, efficient power usage, and comprehensive software support make it an ideal platform for developing sophisticated AI models. This is especially relevant in medical diagnostics, where its application in leukemia classification demonstrates its potential to transform healthcare practices.&nbsp;By enabling more accurate and quicker diagnoses, the OKdo Nano C100 advances the technology behind healthcare AI and directly contributes to improved patient care and outcomes. As AI continues to evolve, tools like the OKdo Nano C100 will undoubtedly play a pivotal role in shaping the future of healthcare and medical diagnostics.<h2 dir="ltr">References</h2><ol><li dir="ltr"><a href="https://www.okdo.com/p/okdo-nano-c100-developer-kit-powered-by-nvidia-jetson-nano-module/" target="_blank">https://www.okdo.com/p/okdo-nano-c100-developer-kit-powered-by-nvidia-jetson-nano-module/</a></li><li dir="ltr"><a href="https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10365109/" target="_blank">https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10365109/</a></li><li dir="ltr"><a href="https://www.okdo.com/p/okdo-nano-c100-developer-kit/" target="_blank">OKdo Nano C100 Developer Kit - OKdo</a></li><li dir="ltr"><a href="https://www.siliconhighwaydirect.com/OKdo-Nano-C100-Developer-Kit-2520055-p/2520055.htm" target="_blank">OKdo Nano C100 Developer Kit - 2520055 - Silicon Highway Direct</a></li><li dir="ltr"><a href="https://www.okdo.com/getting-started/get-started-with-the-c100-nano-csi-cameras/" target="_blank">https://www.okdo.com/getting-started/get-started-with-the-c100-nano-csi-cameras/</a></li></ol>

Optimizing Medical AI: Revolutionizing Diagnostics with the OKdo Nano C100 Developer Kit

Harnessing the OKdo Nano C100 Developer Kit for Leukemia Classification

<h1 dir="ltr" id="isPasted">Introduction</h1>The dawn of 5G has ushered in a new era in telecommunications, a transformative wave that goes beyond mere speed enhancements. Unlike its predecessor, 4G, 5G is not just an upgrade; it's a complete reinvention of the network fabric. It promises gigabit speeds, ultra-low latency, and a level of network reliability we've never seen before. This seismic shift is poised to make a significant impact on various sectors, such as mobile broadband, autonomous vehicles, and remote healthcare, fueling our increasingly hyperconnected digital world.&nbsp;In this article, we delve into the heart of the 5G revolution: the advanced chipsets that are the backbone of this technological leap. Through this article, we aim to unfold the layers of 5G technology, particularly focusing on the role and optimization of chipsets that enable this new era of connectivity.&nbsp;The discussion will also extend to the diverse applications these chipsets enable, casting light on their impact on industries and consumer experiences alike. Additionally, we will explore the role of Synopsys in this evolution, highlighting how their contributions in design, verification, software security, and IP are shaping the future of 5G.<h1 dir="ltr">The Heart of 5G: Advanced Chipset Design</h1>5G chip design is a critical area of development in modern telecommunications, playing a vital role in enabling the advanced capabilities of 5G networks. Tracing the evolution of chipset technology reveals a remarkable journey that mirrors the progression of telecommunications. From the rudimentary designs of the 1G era, focused merely on voice communication, to the 2G chipsets that introduced digital signals and SMS, each step has been pivotal.<div dir="ltr" align="left"><table><tbody><tr><td>Generation</td><td>Key Feature</td><td>Speed</td><td>Latency</td><td>Primary Technology</td><td>Launch Year</td><td>Use Case</td></tr><tr><td>1G</td><td>Analog Voice</td><td>Up to 2.4 Kbps</td><td>High (Not measured)</td><td>Analog Cellular</td><td>1980s</td><td>Voice Calls</td></tr><tr><td>2G</td><td>Digital Voice and SMS</td><td>Up to 64 Kbps</td><td>High (Not measured)</td><td>Digital Cellular, GSM</td><td>Early 1990s</td><td>Voice, SMS</td></tr><tr><td>3G</td><td>Mobile Data and Internet</td><td>Up to 2 Mbps</td><td>~100ms</td><td>UMTS, CDMA2000</td><td>Early 2000s</td><td>Internet, Video Calling</td></tr><tr><td>4G</td><td>High-Speed Internet Access</td><td>Up to 1 Gbps</td><td>~30-50ms</td><td>LTE, WiMAX</td><td>Late 2000s</td><td>HD Video, High-Speed Internet</td></tr><tr><td>5G</td><td>Enhanced Speed and Connectivity</td><td>Up to 20 Gbps</td><td>As low as 1ms</td><td>mmWave, Massive MIMO</td><td>2019</td><td>IoT, Autonomous Vehicles, AR/VR</td></tr></tbody></table></div>Table 1: Overview of the progression from 1G to 5G, highlighting key features, speed, latency, primary technologies, launch years, and typical use cases. (The exact values can vary based on the specific technologies and implementations in different regions.)The advent of 3G brought chipsets capable of supporting internet data and video calling, while 4G chipsets revolutionized mobile internet with unprecedented speeds and connectivity. Today, as we stand on the brink of realizing the full promise of 5G technology, the role of chipsets has evolved beyond measure. These modern chipsets, with their unparalleled processing power and efficiency, are not just incremental upgrades but a fundamental reimagining.Here are some key trends influencing 5G chip design:<ul id="isPasted"><li dir="ltr">Carrier Aggregation and Massive MIMO (Multiple Input, Multiple Output):&nbsp;Carrier aggregation combines multiple frequency bands into a single connection. It's essential for 5G as it allows for more efficient use of available spectrum, leading to higher data rates and better network coverage. Massive MIMO involves using numerous antennas at the transmitter and receiver to improve communication performance. In 5G, massive MIMO significantly increases capacity and spectral efficiency, enabling more users to be served simultaneously.</li><li dir="ltr">Utilization of mmWave Spectrum:&nbsp;The mmWave (millimeter-wave) spectrum refers to frequency bands above 24 GHz. Its utilization in 5G opens opportunities for incredibly high data rates and capacity. But despite its advantages, mmWave frequencies have limitations like shorter range and higher susceptibility to physical obstructions. This necessitates advanced technologies in chip design for signal processing and beamforming to ensure reliable connectivity.</li><li dir="ltr">Managing Increased Data Throughput and Energy:&nbsp;With the higher data rates of 5G, chipsets must efficiently handle increased data throughput. As data throughput increases, maintaining energy efficiency becomes challenging. 5G chips must be designed to optimize power consumption to extend device battery life, especially in mobile devices.</li><li dir="ltr">Performance Optimization:&nbsp;Optimizing the performance of 5G chipsets involves enhancing data transmission speeds while ensuring that the bandwidth and processing capabilities meet the rigorous demands of 5G networks. This includes adaptive technologies that can adjust performance based on network conditions.</li><li dir="ltr">Integration and Versatility:&nbsp;5G chips must integrate various technologies like beamforming, advanced modulation schemes, and error correction algorithms. At the same time, they should be versatile enough to operate across different 5G network deployments, standards, and frequencies, adapting to varied requirements globally.</li><li dir="ltr">Advanced Manufacturing and Materials:&nbsp;Utilizing advanced semiconductor materials and manufacturing techniques is crucial to create chips that are not only powerful but also compact, efficient, and capable of high-speed data processing. The use of advanced materials like Gallium Nitride (GaN) and Silicon Carbide (SiC) is becoming more common in 5G chips. These materials can handle higher power densities and operate efficiently at higher frequencies.[1]</li><li dir="ltr">Security and Reliability:&nbsp;Enhanced security features in 5G chips are essential, given their use in critical applications. Reliable performance is vital in scenarios like autonomous vehicles and internet of things (IoT), where consistent connectivity is crucial.</li></ul>Suggested reading: <a href="https://www.wevolver.com/article/silicon-level-security-a-deep-dive-into-secure-interfaces" target="_blank">Silicon-Level Security: A Deep Dive into Secure Interfaces</a><h1 dir="ltr">Expanding the 5G Landscape</h1>The applications of 5G technology span across various landscapes, offering transformative possibilities due to its higher speeds, lower latency, and greater capacity compared to previous generations of mobile networks. Here's a look at some of these applications across different sectors:<ul><li dir="ltr">Telecommunications: The most direct application of 5G is in enhancing mobile broadband. Users experience faster download speeds, more reliable internet connections on smartphones, and other mobile devices, significantly improving streaming of video and music, and facilitating more efficient web browsing and data download.</li><li dir="ltr">IoT:&nbsp;5G is a game-changer for IoT. Its ability to support a vast number of connected devices simultaneously allows for the rapid expansion of IoT ecosystems. This includes smart homes, where appliances can communicate seamlessly with each other, and smart cities, where IoT can help manage everything from traffic control to energy use.</li><li dir="ltr">Healthcare:&nbsp;5G technology can revolutionize healthcare by enabling telemedicine, remote monitoring, and consultations, which are especially crucial in rural or underserved areas. It also enhances the capabilities of wearable health devices and supports real-time data transmission, vital for patient monitoring and management.</li><li dir="ltr">Automotive Industry:&nbsp;In the automotive sector, 5G facilitates the development and use of autonomous vehicles. With its low latency and high-speed communication, it allows for faster data transfer, essential for the real-time decision-making required in autonomous driving systems.</li></ul>Suggested Reading:&nbsp;<a href="https://www.wevolver.com/article/ramping-up-automotive-soc-performance-through-silicon-lifecycle-management" target="_blank">Ramping up Automotive SoC Performance Through Silicon Lifecycle Management</a><ul><li dir="ltr">Manufacturing:&nbsp;5G can significantly improve industrial automation. With its high reliability and low latency, it supports machine-to-machine communications, enhancing operational efficiency in factories. It also enables real-time monitoring and control of industrial processes.</li><li dir="ltr">Agriculture:&nbsp;5G can transform agriculture through precision farming techniques. It enables real-time data collection from various sensors, drones, and satellites, allowing for more efficient use of resources like water and fertilizers and better crop management.</li><li dir="ltr">Entertainment and Media:&nbsp;In the entertainment sector, 5G unlocks new possibilities for virtual reality (VR) and augmented reality (AR), offering more immersive experiences with higher resolution and less latency. It also transforms the way we stream and consume media, supporting ultra-high-definition and 360-degree video streaming.</li><li dir="ltr">Retail:&nbsp;In retail, 5G enhances customer experiences through AR and VR, allowing customers to try products virtually. It also improves the efficiency of supply chains and logistics through better tracking and management systems.</li><li dir="ltr">Education:&nbsp;5G can impact education by enabling interactive and immersive learning experiences through AR and VR. It also supports the proliferation of online learning, providing high-quality, real-time video streaming and interactive online classrooms.</li><li dir="ltr">Emergency Services:&nbsp;For emergency services, 5G's reliability and speed improve communication during critical situations. It supports better coordination among emergency responders and enables the use of drones for surveillance and assessment in disaster-hit areas.</li><li dir="ltr">Smart Grids:&nbsp;5G supports the development of smart grids in the energy sector, enabling better demand response, grid management, and integration of renewable energy sources.</li><li dir="ltr">Smart Cities:&nbsp;Beyond enhancing basic urban services, 5G enables comprehensive, real-time urban management. This involves integrating IoT across various city functions, from traffic and public transport systems to energy grids and waste management. 5G's high bandwidth and low latency support the deployment of smart city solutions like intelligent traffic lights, which adapt to traffic flow in real time, reducing congestion and pollution. It also facilitates advanced public safety measures, such as real-time surveillance with high-definition video feeds, helping in quicker response to incidents. Additionally, 5G aids in the development of smart buildings, which optimize energy use and improve living conditions, creating a more sustainable and efficient urban environment.</li></ul><h1 dir="ltr">Powering the 5G Revolution with Synopsys</h1><a href="https://www.synopsys.com/" target="_blank" id="isPasted">Synopsys</a> stands as a key player in the 5G revolution, primarily through its advanced design and verification tools, software security solutions, and semiconductor intellectual properties (IPs). These contributions are crucial for the development of advanced chipsets as well as telecommunication and network infrastructure that support 5G speed, bandwidth, and data throughput demands. Here’s a closer look at how Synopsys is helping designers safe and seamless mobile experiences.&nbsp;<h2 dir="ltr"><iframe width="640" height="360" src="https://www.youtube.com/embed/fGacvKMkA3c?&amp;ab_channel=Synopsys&amp;wmode=opaque&amp;enablejsapi=1&amp;origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true"></iframe></h2><h2 dir="ltr" id="isPasted">Synopsys’ Electronic Design Automation (EDA) Tools</h2><a href="https://www.synopsys.com/silicon-design.html" target="_blank">Synopsys’ EDA tools</a>, which are available on the cloud, are vital in the design and development of semiconductor chips used in 5G technology. These tools enable engineers to create complex designs required for the high-speed, high-efficiency demands of 5G. By providing a platform for simulation, verification, and analysis, Synopsys helps in addressing the challenges of designing 5G-related hardware, ensuring that the chips meet the required performance, power, and area (PPA) metrics. Their portfolio includes a comprehensive front-to-back flow for radio frequency (RF) ICs that shortens turnaround times, enabling designers to deliver reliable RF designs with high levels of RF performance. What’s more, as a pioneer in AI-driven EDA, Synopsys enhances productivity and silicon outcomes through the semiconductor industry’s <a href="https://www.synopsys.com/ai.html#opt" target="_blank">first full-stack AI-driven EDA solution</a> and the <a href="https://www.synopsys.com/blogs/chip-design/copilot-generative-ai-chip-design.html" target="_blank">industry’s first generative AI capability for chip design</a>.&nbsp;<h2 dir="ltr">Synopsys’ Silicon-Proven IP</h2>In addition to design and verification solutions, Synopsys offers a broad portfolio of silicon-proven<a href="https://www.synopsys.com/designware-ip/ip-market-segments/5g-mobile.html" target="_blank">IP</a> for 5G mobile infrastructure and 5G mobile phones. Synopsys provides the industry’s broadest portfolio of interface IP, data converter IP, and security IP. In addition, the company also features in its portfolio processor solutions that provide the capacity and performance needed by 5G infrastructure applications and the processing efficiency, GHz channel bandwidth, high-speed chip-to-chip communications, and data security required by mobile devices. By using these pre-designed and pre-verified components, chipmakers can minimize integration risks and accelerate their development processes, reducing time-to-market for 5G devices.<h2 dir="ltr">Security and Quality</h2>Beyond hardware design, Synopsys also plays a role in ensuring software quality and security, which is critical in the 5G era. With the network's expanded bandwidth and connectivity, securing data and maintaining robust software in 5G infrastructure becomes paramount. Synopsys provides software analysis tools and services to identify vulnerabilities and ensure high software standards, contributing to the overall reliability and security of 5G networks. Their fuzz testing solution for 5G protocols helps to uncover and protect against security weaknesses in software.&nbsp;Visit&nbsp;<a href="https://www.synopsys.com/5g.html" target="_blank" id="isPasted">Synopsys 5G Design Solutions &amp; Technology</a> page to find out more about the latest advancements in 5G.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA1NDk5MTY0ODM5LTE3MDU0OTkxNjQ4MzkucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" width="720" height="91" class="fr-fic fr-dii"><h1 dir="ltr" id="isPasted">Conclusion</h1>This article outlined the critical aspects of 5G technology, emphasizing advanced chipsets and the role of companies like Synopsys in their evolution. We've covered how 5G differs from its predecessors in speed, efficiency, and application range, impacting industries from telecommunications to healthcare and automotive. The article also discussed the challenges and innovations in 5G development, particularly in terms of network deployment, spectrum utilization, and energy efficiency.As we progress, the ongoing advancement in 5G technology will continue to open new possibilities for connectivity and applications. The future of 5G lies in its ability to support more innovative and efficient communication solutions, paving the way for further advancements in network capabilities and industrial applications. This evolution marks a significant step in our journey towards an even more connected world.<h1 dir="ltr">References</h1>[1] Wolfspeed. GaN on SiC: The Optimal Solution for 5G [Internet]. 2019 Feb 26. Available from: <a href="https://www.wolfspeed.com/knowledge-center/article/gan-on-sic-the-optimal-solution-for-5g/" target="_blank">https://www.wolfspeed.com/knowledge-center/article/gan-on-sic-the-optimal-solution-for-5g/</a>[2] Rizzatti L. Developing and verifying 5G designs: A unique challenge [Internet]. EDN. 2023 May 9. Available from: <a href="https://www.edn.com/developing-and-verifying-5g-designs-a-unique-challenge/" target="_blank">https://www.edn.com/developing-and-verifying-5g-designs-a-unique-challenge/</a>[3] Synopsys. Designing Application-Specific Processors for Wireless 5G SoCs [Internet]. Available from: <a href="https://www.synopsys.com/dw/doc.php/wp/ASIP_5g_wireless_WP.pdf" target="_blank" data-lf-fd-inspected-kn9eq4roawkarlvp="true">https://www.synopsys.com/dw/doc.php/wp/ASIP_5g_wireless_WP.pdf</a>

Advanced chips are critical in unlocking unparalleled speed, connectivity, and efficiency in modern telecommunications.

How Advanced Chipsets Fuel the 5G Revolution

Transistors — the tiny on-off switches inside microchips — have gotten smaller and smaller over the years, increasing computing power and enabling smaller devices. During that time, the copper wires that connect these switches have likewise shrunk.However, smaller, thinner wires create a big problem, said Daniel Gall, professor of materials science and engineering at Rensselaer Polytechnic Institute.“The job of the wire is to conduct electrons — electricity. Imagine a wire as a crowded hallway that the electrons have to get through. The narrower the hallway, the more the electrons bump into things and scatter. We call that resistance,” Gall explained.As the wires in chips get smaller and thinner, resistance increases, and efficiency goes down.“Today, resistance is the biggest barrier to more efficient chips,” Gall said.Thanks to a new, three-year&nbsp;<a href="https://new.nsf.gov/news/nsf-partners-invest-45-million-future" target="_blank">$1.2 million grant from the National Science Foundation</a>, Gall will lead collaborators at RPI, Notre Dame University, and Cornell University on a hunt for new materials that can be made even smaller than current copper wires while offering far less electrical resistance.Discovery of such materials may one day lead to smaller, faster, more energy-efficient computer chips, Gall said.The grant will also support a workforce development initiative that will connect hundreds of students and leaders at historically Black colleges and universities, minority-serving institutions, and community colleges; semiconductor experts at research intensive universities; and microelectronics engineers from chip manufacturing companies.This component of the project will advance semiconductor curriculum, generate immersive industry-led courses, establish a seminar series and, at RPI, launch an interdisciplinary master’s degree program in semiconductors technology.“Right now, the semiconductor industry does not reflect the diversity of the U.S. population. To change that, we need to start in the classrooms of institutions that serve those underrepresented in the semiconductor workforce. We are excited to work with researchers and leaders from 21 historically Black colleges and universities and minority-serving institutions to co-design interactive teaching approaches that foster an immersive learning environment and student mentorship,” said Shayla Sawyer, professor of electrical, computer, and systems engineering, who will lead the workforce development component of the project. Sawyer directs the Mercer XLab at Rensselaer, which supports innovative learn-by-doing approaches for students.“No one person or institution alone will be able to effect the changes needed to support a thriving domestic chip industry, which is why RPI is proud to bring together researchers, educators, and students who represent the future of semiconductors in the U.S.,” said Shekhar Garde, dean of Rensselaer’s School of Engineering.<a href="https://new.nsf.gov/funding/opportunities/national-science-foundation-future-semiconductors" target="_blank">The project is funded by NSF’s Future of Semiconductors Program</a>, a public-private partnership aimed at accelerating new chip technologies and developing the U.S. chip manufacturing workforce. This program is made possible by the 2022 CHIPS and Science act.

Transistors — the tiny on-off switches inside microchips — have gotten smaller and smaller over the years, increasing computing power and enabling smaller devices. During that time, the copper wires that connect these switches have likewise shrunk.

With New Grant, RPI Works To Shrink Microchips, Expand Semiconductor Workforce

<h1 dir="ltr" id="isPasted">Introduction</h1>In an age where data is the new gold, and digital infrastructure forms the backbone of our society, the importance of data security cannot be overstated. Silicon-level security refers to the protective measures embedded at the hardware level of computing devices. It is a fundamental layer that underpins the reliability and trustworthiness of everything from consumer electronics to critical national infrastructure.As we usher in the era of ubiquitous computing, with billions of connected devices exchanging data every second, the stakes for robust security have never been higher. The concept of silicon-level security isn't new; however, the complexity and sophistication of threats it must mitigate have evolved dramatically. Gone are the days when simple perimeter defenses were sufficient. Today's security architects must assume a posture of 'defense in depth', where multiple layers of security measures are integrated into the silicon itself.This proactive approach to security is vital as the functionality and value of devices increasingly hinge on their ability to protect and process sensitive data securely. Whether it's financial transactions, personal information, or state secrets, the common denominator is the silicon that processes and stores this data. Thus, the integrity of silicon-level security mechanisms is a paramount concern, laying the foundation for trust in the digital age.In the following sections, we'll delve into the intricate world of secure interface technologies, unpack the challenges faced by modern System on Chip (SoC) designs, and explore how advancements in technology are paving the way for stronger, more resilient security measures. &nbsp;&nbsp;<h1 dir="ltr">The Backbone of Security: Root of Trust and Cryptography IP</h1>At the heart of silicon-level security is the concept of a 'Root of Trust' (RoT), a set of functions trusted implicitly by the system due to their foundational role in ensuring overall security. The RoT provides a secure starting point for system boot and cryptographic operations and is immune to software-based attacks because it is often implemented in hardware. This secure cornerstone handles critical tasks such as secure boot, secure firmware updates, and cryptographic key management, ensuring that only authenticated code and communications are running on the device.Adjacent to the Root of Trust is the role of Cryptography IP, which includes hardware-based cryptographic engines designed to perform encryption and decryption tasks. These cryptographic modules serve as the workhorses for data protection, enabling secure data storage and transmission, and are essential for functions like secure communications, digital signatures, and user authentication.Both RoT and Cryptography IP are imperative for a secure boot process, which is the first step in a secure chain of events that occur when a device is powered on. During this process, the integrity and authenticity of the software stack are verified using cryptographic checks, establishing a secure execution environment from the outset.To understand their importance, consider the analogy of a bank vault. In this analogy, RoT is the combination to the vault—highly confidential and used to validate the identity of individuals attempting to access the vault. Cryptography IP, on the other hand, is like the reinforced walls and time-locked doors—structural features that enforce security protocols and prevent unauthorized access.These technologies also enable secure end-to-end communication, ensuring that data remains confidential and unaltered during transmission. With the proliferation of the Internet of Things (IoT) and connected devices, securing data in transit has become as crucial as securing it at rest.Despite their robustness, the implementation of Root of Trust and Cryptography IP is not without challenges. Ensuring that these security measures themselves are impervious to exploitation requires meticulous design and regular updates in response to the evolving threat landscape. In the next section, we will examine the security challenges inherent in modern SoC designs and discuss how these foundational technologies can help mitigate those risks.<h1 dir="ltr">Securing the Core: Challenges in SoC Designs</h1>Modern Systems on Chip (SoCs) are marvels of integration, embedding processors, memory, I/O, and various other functionalities into a single chip. This consolidation brings vast benefits in terms of performance and power efficiency but also introduces a myriad of security challenges that must be navigated carefully.One of the primary challenges is the increased attack surface. The very features that make SoCs powerful—connectivity, configurability, and smart functionalities—also make them more vulnerable to attacks. With more lines of code, there are more potential bugs or backdoors. With more interfaces, there are more points of entry for malicious actors.Additionally, as SoCs become more complex, ensuring that every component is secure from design to decommission becomes harder. This complexity often results in a greater risk of side-channel attacks, where an attacker could infer sensitive information from power consumption, electromagnetic emissions, or even computation time.Supply chain security presents another significant challenge. SoCs are global products, with materials and components sourced from and passing through multiple vendors and countries. Each step in this chain presents an opportunity for malicious actors to introduce vulnerabilities.Moreover, the need for speed in markets means that security can sometimes be an afterthought, leading to vulnerabilities in the rush to get products to market. As a result, rigorous security testing and validation procedures are essential but can be overlooked or undervalued.In dealing with these challenges, the industry has turned to a variety of mitigation strategies. One key approach is the concept of 'security by design', where security measures are considered at every step of the SoC design and manufacturing process. This approach includes using hardware-based security features, like those provided by secure enclaves and trusted execution environments, which can isolate sensitive operations from the main processor to protect them from software attacks.Another strategy is regular security audits and updates. Even after an SoC is deployed, its security posture must be maintained and updated in response to new threats—much like how software is regularly patched.Finally, leveraging advanced fabrication techniques and materials can reduce the physical vulnerabilities of SoCs, making them harder to tamper with or reverse engineer.Navigating these challenges is a complex task, but it is one that is crucial for maintaining trust in technology. In the next section, we discuss how these strategies are put into practice, keeping SoCs secure against an ever-evolving array of threats.<h1 dir="ltr">Building Defenses: Mitigation Strategies for SoC Security</h1>To confront the security challenges in SoC designs, the semiconductor industry has developed a suite of mitigation strategies that bolster the defenses of these complex systems.<ul><li dir="ltr">Secure Architectural Design: The first line of defense is secure architectural design. This includes the incorporation of hardware-based security features such as secure boot, trusted execution environments, and secure key storage. By integrating these elements at the design phase, SoCs are better equipped to handle unauthorized access attempts and ensure that critical operations remain uncompromised.</li><li dir="ltr">Layered Security Approach: A layered security approach is critical for protecting against a wide range of potential attacks. This involves implementing multiple security layers that function together to protect the system. If one layer is breached, the subsequent layers provide an additional level of defense, making it more difficult for an attack to be successful.</li><li dir="ltr">Dynamic Security Measures:&nbsp;Dynamic security measures, such as runtime monitoring and anomaly detection, are also key. These systems can detect and respond to suspicious behavior in real-time, providing a responsive layer of security that adapts to current threats.</li><li dir="ltr">Encryption and Cryptography:&nbsp;Strong encryption and cryptography are indispensable in SoC security, safeguarding data both at rest and in transit. Advanced encryption standards and cryptographic algorithms are implemented to ensure that even if data is intercepted, it remains indecipherable without the appropriate keys.</li><li dir="ltr">Regular Security Audits and Firmware Updates:&nbsp;Ongoing security audits and regular firmware updates ensure that security measures remain up-to-date in the face of evolving threats. This strategy includes the establishment of secure update mechanisms that prevent the installation of malicious firmware.</li><li dir="ltr">Supply Chain Integrity:&nbsp;Protecting the integrity of the supply chain is another critical strategy. This involves measures such as secure manufacturing practices, tamper-evident packaging, and traceability of components to ensure that SoCs are not compromised at any point from fabrication to delivery.</li><li dir="ltr">User Education and Access Control: Lastly, user education and strict access control policies are necessary to prevent inadvertent breaches. Users need to be aware of the security features of their devices and how to use them properly, while access control ensures that only authorized individuals can make changes to the system configuration or access sensitive information.</li></ul>By implementing these strategies, SoC designers and manufacturers can create more secure systems that are resilient in the face of both current and emerging security threats. However, the fast pace of technological change means that vigilance and continuous improvement are mandatory. Security is not a one-time achievement but an ongoing process of adaptation and reinforcement.<h1 dir="ltr">Conclusion</h1>Silicon-level security stands as a critical pillar in our digital era. Through exploring secure interface technologies, such as Root of Trust and Cryptography IP, we recognize their indispensable role in safeguarding modern SoCs. As we confront security challenges—from side-channel attacks to complex interface vulnerabilities—the need for a robust, multi-layered defense strategy becomes clear.Securing silicon goes beyond a single solution—it's a continuous battle, balancing innovation with vigilance. As technology advances, so must our security strategies, integrating state-of-the-art features and adopting a culture of security-first in design and deployment.The future hinges on our collective effort to ensure the trustworthiness of our digital foundations. In fostering this trust, the commitment to silicon-level security must remain unwavering, uniting stakeholders across the industry to fortify our digital landscape.<h1 dir="ltr">Synopsys' Impact on SoC Security</h1>In the realm of SoC security, <a href="https://www.synopsys.com/" target="_blank" rel="noopener noreferrer">Synopsys</a> offers critical technologies that sharpen the defenses of silicon interfaces. Their AI and Machine Learning tools not only expedite chip design but also imbue systems with smart threat detection, essential for anticipatory security. Their cloud solutions provide secure integrations essential for IoT devices dependent on cloud data management.Their Design Technology Co-Optimization (DTCO) propels the creation of SoCs resistant to advanced threats by exploring new transistor architectures. Synopsys' emphasis on early-stage security integration through DevSecOps, alongside energy-efficient design practices, further strengthens SoCs against exploits like power analysis attacks.Synopsys also pioneers in fortifying system integrity with its Multi-Die System solutions, safeguarding sensitive operations within SoCs. Their vigilance extends to software security, ensuring open-source components and software supply chains are robust against vulnerabilities from inception.Through innovation and a strategic approach to security, Synopsys plays a pivotal role in the evolution of more secure digital infrastructures, demonstrating a comprehensive commitment to the advancement of SoC security.<h1 dir="ltr" id="isPasted">References</h1>[1] Dana Neustadter, Hezi Saar, Michael Posner, ‘How Security for SoC Interfaces Enhances Data Protection’, Synopsis, 4 Oct. 2022, [Online], Available from:&nbsp;<a href="https://www.synopsys.com/blogs/chip-design/soc-interfaces-security-enhance-data-protection.html" target="_blank">https://www.synopsys.com/blogs/chip-design/soc-interfaces-security-enhance-data-protection.html</a>[2] Marco Ciaffi, John Min, ‘Building security into an AI SoC using CPU features with extensions’, Embedded, 12 Apr. 2021, [Online], Available from:&nbsp;<a href="https://www.embedded.com/building-security-into-an-ai-soc-using-cpu-features-with-extensions/" target="_blank">https://www.embedded.com/building-security-into-an-ai-soc-using-cpu-features-with-extensions/</a>[3] Ruud Derwig, Nicole Fern, ‘Techniques for Ensuring Security in Processor-based SoCs’, Synopsis, [Online], Available from: <a href="https://www.synopsys.com/designware-ip/technical-bulletin/ensuring-security-processor-socs.html" target="_blank">https://www.synopsys.com/designware-ip/technical-bulletin/ensuring-security-processor-socs.html</a>[4] Landry J., ‘What Is Hardware Root of Trust?’, Dell, 22 July 2022, [Online], Available from: <a href="https://www.dell.com/en-us/blog/hardware-root-trust/" target="_blank" rel="noopener noreferrer">https://www.dell.com/en-us/blog/hardware-root-trust/</a>

Silicon-level security is crucial in protecting the hardware of computing devices, serving as a foundational layer for data integrity and system reliability in our increasingly digital world.


Silicon-Level Security: A Deep Dive into Secure Interfaces

Printed Circuit Board with Surface Mounted Devices

This article delves into the various types of SMD components, detailing their sizes, functions, soldering techniques, selection guidelines, and applications.

Types of SMD Components: A Comprehensive Guide

Electronic circuit board with SiP technology

This article provides a detailed guide to System in Package technology, its advantages and challenges, key components, design, and manufacturing process. 

System in Package: A Comprehensive Guide to SiP Technology

Reflow soldering furnace used on mounted PCB

This article provides a detailed overview of the solder reflow process, types of reflow ovens, temperature profiles, solder paste composition and selection, reflow process potential challenges, solutions, inspection, and quality control techniques. 

Solder Reflow: An In-Depth Guide to the Process and Techniques

Wafer dicing separates individual integrated circuits or chips from a semiconductor wafer without damaging their delicate structures and circuits. This process is crucial for the production of electronic devices and components used in various industries, and the demand for it has increased with the development of high-performance and smaller electronic devices. Different dicing techniques, such as blade dicing, laser dicing, and plasma dicing, have been developed, and new innovations continue to emerge to address the challenges of complex semiconductor devices.

The Ultimate Guide to Wafer Dicing: Techniques, Challenges, and Innovations

<section id="isPasted">The electronics industry traditionally relies on silicon chips, from computers and smartphones to automobiles and industrial equipment. However, with technological advances and changing market trends, there has been a growing movement towards alternatives like silicon carbide (SiC) and system-on-a-chip (SoC) designs.Silicon chips are stepping aside as a new wave of materials and designs takes the spotlight. With improved performance, efficiency, and power handling at the forefront, these advancements offer a boost in power handling and a decrease in power consumption.Longer battery life, higher frequencies, and better thermal performance are just a few of the benefits resulting from this shift. SiC, for instance, reaches frequencies ten times faster than silicon while reducing power consumption by 30 percent.Market forces are pushing the shift from silicon microchips to SiC and SoCs. The electric vehicle industry and the Internet of Things lead the way, requiring more efficient and dependable microchips. Aware of supply chain problems, Tesla became the first to use silicon carbide chips in their Model 3. Now more companies are moving to SiCs. In fact, the <a href="https://macrofab.com/podcasts/the-hot-list-of-tasty-chip-fabs" target="_blank">largest SiC manufacturing facility in the world</a>, owned by Wolfspeed, is in early building stages in central North Carolina.SiC and SoCs outperform traditional silicon options, offering improved performance and efficiency. Silicon carbide is a hard and durable material with strong covalent bonds, which are more thermally stable than the weaker bonds in silicon. As the <a href="https://macrofab.com/blog/pcba-design-trends-2023" target="_blank">demand for connected devices grows</a>, so does the need for low power consumption and better thermal performance, which SiC and SoCs deliver.With the SiC market expected to increase by 40 percent to $3.3 billion in 2023 and the SoC market predicted to hit $57 billion by 2025, the future is bright for SiC and SoCs. To take advantage of this booming market, companies must be proactive in their PCBA (Printed Circuit Board Assembly) design by incorporating these advanced microchips. This will ensure that they stay ahead in the industry and capitalize on the growth potential of SiC and SoCs.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjgwNTM1ODQzMzMxLTE2ODA1MzU4NDMzMzEucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="Power compound semiconductor market" class="fr-fic fr-dii"><h2>SiC as an Alternative to Silicon</h2>SiC is gaining ground and surpassing silicon as the preferred alternative for integrated circuits. With superior thermal conductivity, wider bandgap, and higher breakdown voltage, SiC outperforms silicon in high-power applications like EVs and power electronics that require high-frequency operation and exceptional power handling. The following are some of the most significant advantages of SiC:<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjgwNTM1ODQyMjEwLTE2ODA1MzU4NDIyMTAucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="Higher thermal conductivity" class="fr-fic fr-dii"><ul><li>Higher Thermal Conductivity: SiCs high thermal conductivity leaves silicon in the dust, offering superior heat dissipation and optimal thermal performance. This is especially crucial in the automotive industry, which requires components for high-temp battery management systems and engine control units</li><li>Wider Bandgap: SiCs wider bandgap opens the door to high-frequency operation, reaching speeds up to ten times faster than silicon. This leads to faster and more reliable performance, making SiC the ideal choice for high-power applications.</li><li>Higher Breakdown Voltage: SiCs high breakdown voltage also boosts its power handling capabilities, resulting in a longer lifespan and high performance.</li></ul><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjgwNTM1ODQzOTA2LTE2ODA1MzU4NDM5MDYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="High power ev charging" class="fr-fic fr-dii">The high-power EV charging world is being disrupted by SiC MOSFETs. Their efficient and high power density design surpasses traditional silicon-based devices, resulting in incredibly fast charging speeds. The latest charging stations now offer speeds of up to 350 kilowatts, enabling EVs to reach 80 percent battery capacity in just 20-30 minutes.The global SiC market is experiencing remarkable growth, with projections reaching $3.3 billion in 2023, a significant increase of almost 40 percent from the previous year. This growth is driven by the electric vehicle industry and the increasing demand for connected devices, which require improved performance and efficiency that SiC can provide, surpassing traditional silicon microchips.As a result, PCBA (Printed Circuit Board Assembly) design for the EV market will also need to adapt to incorporate SiC technology. Companies must stay ahead of the competition by designing PCBAs that can handle the high power density and efficient performance of SiC MOSFETs, allowing for faster and more efficient EV charging. This will ensure that they are at the forefront of the rapidly growing SiC market.<h2>SoCs as a Better-Designed Alternative</h2>SoCs (system-on-chip) technology has become increasingly popular among electronics designers due to their inherent flexibility and simplicity. By integrating multiple components onto a single chip, SoCs save space and reduce power consumption, making them perfect for connected devices and applications where efficiency is critical. While some SoCs use traditional silicon as a substrate material, more modern materials like silicon carbide (SiC) and gallium nitride (GaN) are also used due to their high performance.This advancement brings exciting opportunities for PCBA (Printed Circuit Board Assembly) design. SoCs are a smart choice for companies looking to stay ahead of the technology curve. SoCs enable companies to achieve higher performance and efficiency with PCBA designs, allowing them to create next-generation devices.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjgwNTM1ODQzNzQ2LTE2ODA1MzU4NDM3NDYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="Soc offerings" class="fr-fic fr-dii">SoCs offer:<ul><li>Space-Saving Success: SoCs shrink the size of electronics by combining multiple components into one chip, which is ideal for applications where space is limited.</li><li>Power Performance: With lower power consumption, SoCs provide longer battery life and lower energy costs.</li><li>Simplified design: SoCs can reduce product development time and effort because multiple components are already built on one chip.</li><li>Lower risk: By synchronizing the microprocessor, memory, I/O, and other components, the risk of design errors is reduced, improving reliability and lowering costs.</li></ul><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjgwNTM1ODQzODIzLTE2ODA1MzU4NDM4MjMucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="Iot forefront future" class="fr-fic fr-dii">At the forefront of the SoC revolution is the Internet of Things (IoT), where connected devices revolutionize our daily lives. Smart homes, wearable technology, and industrial automation are just a few examples of the countless applications powered by SoCs. These compact, power-efficient chips allow devices to perform multiple functions while consuming minimal energy, making them the perfect choice for the connected world.The IoT is just the tip of the iceberg, as the limitless potential of SoCs extends to industries ranging from healthcare to automotive and beyond. The future is about smart, connected, and efficient technology and SoCs are leading the charge.It&#39;s no wonder that the global SoC market is expected to reach $57 billion by 2025, driven by the growth of connected devices, increasing demand for efficiency, and improved thermal performance.<h2>Market Trends</h2>The electronics world is shifting gears, leaving silicon microchips behind for sleek and high-performing alternatives like SiC and SoCs. The driving forces behind this change are the growth of the electric vehicle market and the surging demand for connected devices.SiC is revving up the engine of the EV industry with its high thermal conductivity, wider bandgap, and higher breakdown voltage, making it ideal for high-power, high-frequency applications. Meanwhile, SoCs are becoming the go-to for connected devices, thanks to their compact design and power-saving efficiency.However, the road to the widespread adoption of these innovative technologies takes time and effort. SiC materials may have defects like microcracks, grain boundaries, or dislocations that can affect performance, and finding a trusted partner who can navigate these obstacles is crucial for a smooth journey toward industry growth.Driven by the booming electric vehicle market and the growing demand for connected devices, new materials and designs like SiC and SOCs are revving the future of electronics. With a projected global market of $3.3 billion for SiC and $57 billion for SoCs by 2023 and 2025, respectively, it&#39;s clear that the industry is shifting gears.<h4>Let&#39;s work together</h4><a href="https://macrofab.com/contact" target="_blank">REQUEST A QUOTE</a></section><section> </section>

Many companies are now looking at alternatives to silicon chips. 

Why the Future of Electronics is Moving Away from Silicon Microchips

<h1 id="isPasted">Six PCBA Design Trends to Watch in 2023</h1>Throughout the electronics manufacturing and assembly industry, technology advances constantly. Constant change keeps the market from standing still.Instead, devices get smaller all the time. Power requirements shift to different portions of a system. As designs become more complex, smaller form factors and higher component counts challenge our previous electronics manufacturing paradigm.As a result, PCBA design innovations continue to expand to support the solutions demanded by the market. To maintain their company&rsquo;s competitive edge, engineers must continually seek out new options and keep up with market changes. Take note of these six trends within the electronics industry.<h2>How Long will Moore&rsquo;s Law Last?</h2>In 1965, Intel Corp. founder Gordon Moore wrote that with new integrated circuits, &ldquo;the cost per component is nearly inversely proportional to the number of components.&rdquo; His 1965 forecast went on to predict that the number of components fabricated on an integrated circuit would double every year until it reached 65,000 by 1975.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1673359793410-1673359793410.png" alt="moore's law" class="fr-fic fr-dii">Moore&rsquo;s prediction proved to be accurate. Moore revised that idea in 1975 in what became known as Moore&rsquo;s Law, describing the doubling of transistors every two years. In the last two decades, however, the doubling pace has fallen behind the two-year cycle due to new challenges. However, the cycle has not halted completely. New designs and lithography methods continue to shrink component size, but these methods require increasingly more expensive fabrication techniques.Meanwhile, fab plants have become less willing to invest in these costly processes. The number of next-generation manufacturing facilities in the US using state-of-the-art processes has decreased from 25 in 2002 to only three in 2020. The CHIPS Act hopes to reverse this trend.<h3>Chiplets</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1673359793948-1673359793948.png" alt="keeping signal original characteristics" class="fr-fic fr-dii">Chiplets can work together as part of a multi-chip module, or MCM, creating a single integrated circuit. This ability to collaborate overcomes Moore&rsquo;s Law&rsquo;s limitations as well as the difficulties associated with monolithic designs. A chiplet is a tiny integrated circuit (IC) with well-defined functionality that can be integrated with other chiplets to make a larger module with multiple functions.Chiplets allow a more flexible module solution to be designed with targeted functions that leverage the strength of each chip. Not only are chiplets useful for integration into a large module, but their technology can be reused in other modules that require similar functions, bringing more efficiency to the project development.In addition, fabrication technology nodes that favor certain performance can be tailored to fit their specific function. This includes memory, data processing, analog, power, and RF. This lends credence to the notion that smart technology partitioning is more flexible but requires more advanced assembly for a complete module.<h3>Connected, Before and After Manufacturing</h3>The Internet of Things (IoT) and the cloud make connected manufacturing possible, through what is known as the Industrial IoT (IIoT). These connected technologies improve the efficiency, productivity, reliability, and traceability of materials and finished goods.The four elements that manufacturers use to drive this revolution are:<ul><li>Devices &ndash; collect and sense data about the manufacturing environment and machine health.</li><li>Communication&ndash; Leverage wireless and industrial networked machines that communicate between each other and to a cloud server.</li><li>Data Storage &ndash; Data can be stored locally or on a server depending upon the required analysis and real-time requirements.</li><li>Data Analytics &ndash; algorithms intelligently process data to predict machine wear, unplanned maintenance, and manufacturing order trends over time.</li></ul><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1673359793631-1673359793631.png" alt="smart industry" class="fr-fic fr-dii">Communication systems, industrial controls, aerospace, automotive electronics, and automation across sectors benefit from embedded intelligent devices. The International Data Corporation (IDC) predicts there will be more than 41 billion connected IoT devices in the world by 2025.The confluence of these technologies enhances factory manufacturing capabilities and allows more efficient production tracking. It reduces waste and allows intentional activity instead of repairs or waiting on gaps in machine setup changes.<h3>High-Density Interconnect (HDI)</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1673359793691-1673359793691.png" alt="high density interconnect" class="fr-fic fr-dii">High-Density Interconnect (HDI) PCBs use some combination of the following assembly technologies: micro vias, blind and buried vias, built-up laminations, or highspeed signal bandwidth materials. PCB fabrication has been constantly improving and evolving with changing technology that requires accommodations for smaller and faster products. Specifically, HDI PCBs offer:<ul><li>Increased signal sharpness. Signals travel shorter distances thanks to HDI PCBs&rsquo; compact size. There is a performance increase, even if it is subtle.</li><li>Physical reliability. HDI PCBs have less likelihood of losing physical connections.</li><li>Lighter, cooler material. HDI PCBs tend to be lighter and cooler than traditional PCBs made from fiberglass, copper, and other materials. This can improve performance and heat dissipation to handle high temperatures better.</li><li>Design improvements. Compact and versatile builds are enabled by blind and buried vias.</li></ul>To accommodate the denser boards within a constrained area, HDI was developed as a means to force more electrical content into the same, or smaller area. Compared to traditional PCBs, HDI boards are more compact and have smaller vias, pads, copper traces, and spaces.HDI PCBs have more dense wiring that results in a lighter weight with a more compact, lower layer count PCB. This provides an inherently smaller and lighter system than otherwise would be possible.By working with your CM during the design stage for your project, a design for manufacturing plan (DFM) can determine if HDI PCBs are needed for your project and how to design for them.<h3>Flexible PCBs</h3>As wearables like smartwatches and IoT devices require durable, small designs, flexible PCBs have become one of the fastest-growing circuit board design trends.To leverage multiple PCB planes in a single system, flexible or rigid-flex PCB material has become increasingly more pervasive. A rigid-flex PCB has design features that allow for the typical rigid board with the option to introduce flexible portions.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1673359794052-1673359794051.png" alt="flexible pcbs" class="fr-fic fr-dii">As part of the manufacturing process, layers on flexible PCBs are etched away, allowing flexible layers to be exposed for bendable angles. Boards can be bent up 180 degrees to interface with other PCB planes, reducing system area and enhancing design options.Additionally, flexible PCBs remove the need for connectors and ribbon cables that otherwise can be unfriendly to high-speed signals by introducing electrical noise and reflections. Instead, flexible PCBs maintain signal integrity with the trace impedance required as if a signal was transmitting down a typical PCB transmission line.<h3>Direct-from-Desktop Ordering</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1673359793727-1673359793727.png" alt="altimade fulfilled by macrofab" class="fr-fic fr-dii">When you are ready to start your design project, you will want your CM partner to be involved in the process for maximum success. A design for manufacturing (DFM) plan will encompass your design, manufacturing needs, unique requirements, bill of materials, fabrication and assembly options, and quotes.Rather than having to call several times to determine fabrication, assembly, and component kitting separately, it is possible to handle all these using the Direct-from-Desktop ordering process called <a href="https://macrofab.com/blog/altimade-fuses-design-with-manufacturing/?utm_source=sales&utm_medium=email&utm_term=pcb%20assembly&utm_content=250-back-promo&utm_campaign=sales-email-sig-banner&gclid=Cj0KCQiA5NSdBhDfARIsALzs2EDLO_TwPWVSF88rPCgXKYd02irr_fcFz72i0Q2W7TnoMrfW64Zf3moaAgD8EALw_wcB" target="_blank">Altimade</a>.By connecting Altium design tools to MacroFab&rsquo;s factory lines, Altimade simplifies and streamlines the design-to-manufacturing process. With one click, customers can place orders directly from their workspace. By using this online tool, you will have all the information you need to make your project a success.<h3>Conclusion</h3>PCBA design innovations will continue to push the electronics manufacturing and assembly industry forward to keep pace with technology. Tracking the activity in the cloud through the IIoT pushes the industry forward for more efficiency. Flexible PCBs offer new design options for higher density, along with HDI connectivity. Reusable chiplet functions make smart partitioning of functional blocks a better solution for advanced modules. While Moore&rsquo;s law is no longer a hard and fast rule, the technology trends will continue in assembly and manufacturing to allow more advanced designs. Use the Direct-from-Desktop Ordering tool Altimade to get started.<h4>Build Better With MacroFab</h4><a href="https://macrofab.com/demo?utm_source=sales&utm_medium=email&utm_term=pcb%20assembly&utm_content=250-back-promo&utm_campaign=sales-email-sig-banner&gclid=Cj0KCQiA5NSdBhDfARIsALzs2EDLO_TwPWVSF88rPCgXKYd02irr_fcFz72i0Q2W7TnoMrfW64Zf3moaAgD8EALw_wcB" target="_blank">Claim Your Free Demo Now</a>

Electrical engineers must continually seek out new options and keep up with market changes. Take note of these six trends within the electronics industry.

PCBA Design Trends to Watch in 2023

A close-up of a silicon wafer during semi-conductor manufacturing

Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.

Understanding the Difference Between Wafers and Chips in Semiconductor Manufacturing

This article delves into the specifics of NPN and PNP transistors, their working principles, applications, comparisons, and factors to consider when choosing between them.

Understanding NPN vs PNP Transistors: A Comprehensive Guide

A young team with a new technology are currently creating a revolution in the world of printed electronics. In their modern, brand-new lab at the High Tech Plaza, they will be developing a device that can deposit any material on any substrate at a very rapid pace. This promising technology was initially developed by TNO (the Netherlands Organisation for applied scientific research), and it is now taking off in the core of Eindhoven.<a href="https://keirontechnologies.com/" rel="noopener" target="_blank">Keiron Printing Technologies</a>&rsquo;s CCO <a href="https://www.linkedin.com/in/marcovanhoorn?lipi=urn%3Ali%3Apage%3Ad_flagship3_search_srp_all%3ByTdY8eVeQEq9%2FeT9mNaI8g%3D%3D" rel="noopener" target="_blank">Marco van Hoorn</a> entered the start-up life when he was a 22-year-old student in International Business. Through the Venture Building Program at HighTechXL, Marco joined start-up Aircision as an intern. It was during this experience that Marco discovered what he wanted to do: to establish his own company. And so he did.Marco recalls with a smile: &ldquo;Guus Frericks (HighTechXL Founder and CGO) told me to finish my studies before coming back. But I just walked back in and stayed.&rdquo; Marco was deeply impressed by the entrepreneurial life and the amazing technologies available at HighTechXL. His enthusiasm drew <a href="https://www.linkedin.com/in/jimmy-sy-a-chin?lipi=urn%3Ali%3Apage%3Ad_flagship3_search_srp_all%3B7bDDxNZvTCG0odYEzhkE4g%3D%3D" rel="noopener" target="_blank">Jimmy Sy-A-Chin</a> (CEO) to connect with HighTechXL, and together with <a href="https://www.linkedin.com/in/stefan-van-waalwijk-van-doorn-42b563173?lipi=urn%3Ali%3Apage%3Ad_flagship3_search_srp_all%3B%2Bw2Zaan%2BRHqJ%2BDk1V6ITGw%3D%3D" rel="noopener" target="_blank">Stefan van Waalwijk van Doorn</a> (CTO) and <a href="https://www.linkedin.com/in/prakhyat?lipi=urn%3Ali%3Apage%3Ad_flagship3_search_srp_all%3BIrMg%2BgRbRdSTroV5GdcvWw%3D%3D" rel="noopener" target="_blank">Prakhyat Hejmady</a> (COO), they founded Keiron Printing Technologies in 2019.<h2>So what exactly does Keiron do?&nbsp;</h2>Keiron is a machine builder. We develop industrial equipment that enables users to deposit or lay close to any material with microscopic precision. We can deposit almost any material on any substrate, even manufacturing layers of different materials on top of each other and at different height. This means that the technology enables complex functionalities to be added to chips during the production process.&nbsp;<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1656585389456-image-png-Apr-16-2021-09-06-33-12-AM.png" style="width: 766px;" class="fr-fic fr-dib">Keiron concept&nbsp;We utilize a superior direct-write technology. Because a laser is employed,&nbsp;the process is very controlled. For example, this technology enables printing circuits so fast that it&rsquo;s just impossible to capture it with a camera. This means that in 0.07 seconds we can get a whole circuit printed, and that&rsquo;s impossible with today&rsquo;s nozzle-based technology.This technology is quite relevant for microfluidics (the science and manipulation of fluids). For example, think about adding microelectronics in chips that carry samples of blood or other body substances or printing sensitive biological materials like cells. This would only be one of the applications. Keiron is currently focused on diversifying and looking for the overlap of applications with the microfluidics such as semiconductors, semiconductors packaging and biosensors. All in all, this is a technology that provides opportunities for the mass production of flexible electronics.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1656585467425-image-png-Apr-16-2021-09-07-29-79-AM.png" style="width: 766px;" class="fr-fic fr-dib">Microfluidic chips with electrodes&nbsp;<h2>How does direct-write compare to current printing technologies?&nbsp;</h2>Current printing technologies are very slow, and direct-write technology enables a whole new world of possibilities. With a laser, printed materials keep their shape and adhere better to the surface, which is a big advantage. The speed it offers is also incredible. For example, with today&rsquo;s technology one can print a half a meter line per second, but with direct-write technology one can print 9 or 10 meters per second (20 times faster). This has a huge potential for mass production. The technology also enables reaching tiny feature sizes, -a lot smaller than the size of a human hair.&nbsp;<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1656585496027-image-png-Apr-16-2021-09-08-37-58-AM.png" style="width: 766px;" class="fr-fic fr-dib">Direct-write laser printing made by TNO Holst Centre&nbsp;<h2 id="isPasted">What&rsquo;s the ultimate goal of Keiron?&nbsp;</h2>We want to be the leader of printed electronics, just like ASML is the world&rsquo;s largest supplier of photolithography systems in the semiconductor industry. The device we&rsquo;re building will be the enabler for a great variety and number of printed electronics applications. Our first idea is to sell the machine and make profit, but once we have the capital, we&rsquo;d like to install machines at the customer&rsquo;s location in which the client pays per use. In the long term, this may be more profitable for the company.As a company, we also have a responsibility of contributing to a better and more sustainable world. We know that additive techniques in manufacturing are becoming more eco-friendly, and we want to be part of this movement! As a member of the supply chain, our machine will be able to make products that will improve our lives. For example, a chip that can make a quick health diagnosis or register the amount of CO2 in the atmosphere. We strive to make an impact and support those companies that develop technologies for the future. This means that in five or ten years Keiron will be there to supply all major companies with the right machinery.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1656585519626-image-png-Apr-16-2021-09-09-39-83-AM.png" style="width: 766px;" class="fr-fic fr-dib">Machine making chips&nbsp;<h2 id="isPasted">What&rsquo;s life like as a young entrepreneur? </h2>&ldquo;It&rsquo;s very fun!&rdquo; We learn new stuff all the time, but we&rsquo;re young and learn quick. We basically had to become experts in a short period of time but since we&rsquo;re a very young team, we also rely on the advise of our board. We are very grateful to have in our team Richard Visser (Founder of Smart Photonics), Helen Kardan (Sr. Account Manager at ASML), Eddy Allefs (CTO at HighTechXL and D&amp;E Innovation Consultant at NTS-Group) and Ton van Mol (Director Flexible and Free form electronics at TNO Holst Centre). They have tons of experience and help us making important decisions. They&rsquo;re part of the Keiron family.Sometimes age can also be a disadvantage when you&rsquo;re an entrepreneur. We engage in meetings with possible customers that are easily 20 years older than us, and it can be a challenge. They might doubt our experience or our commitment to the company. However, many times people are impressed with our achievements so far despite being so young.<h2>What have been the biggest achievements and challenges so far? </h2>Well, we already discussed our age being a challenge during meetings. Finding investors is a challenge for any start-up. A particular situation that we face is introducing a new technology to the manufacturing industry. The technologies used right now are very well known, so introducing a new concept and winning people&rsquo;s trust is a big one. We need to demonstrate that we have something reliable and viable. That&rsquo;s one of the issues when we talk to people with tons of experience, but they&rsquo;ve never heard about this technology. People are not familiar with the idea that a laser can print something, so it&rsquo;s quite a surprise for them.On the other hand, we&rsquo;re now in conversation with one of the largest manufacturers in Europe that is really excited with what we offer. It&rsquo;s just a huge validation for our team when this company says: &ldquo;I want this technology, I want this machine in my foundry. It&rsquo;ll be part of the whole manufacturing process of the chip.&rdquo; We also just got approved for two subsidies, so this is also a huge achievement and confirmation that we&rsquo;re on the right path. This means that people see what we see and believe what we believe.<h2>Keiron just opened its first office at the High Tech Plaza; why did you decide to stay here? </h2>This region is great for our company. If we&rsquo;re going to be making parts for chips, it makes sense that we stay in Eindhoven. Integrating a laser-based printing process machine that can be used in the industry is not an easy project. There are lots of implications in the process, people have a lot of questions, they face challenges in the technical point of view, etc. But this region has the expertise and entrepreneurial spirit to help us out. If Eindhoven can&rsquo;t do it, there&rsquo;s no other place else that can do it.The Eindhoven mentality is the reason why startups have grown in the region. It&rsquo;s very easy to sit down and help others just for the sake of helping. Moreover, the network is available, which is very inspiring; there are people willing to help in the thinking process and give back to the community.<h2>Lastly, do you have any advice for any new startups or people who want to start a company? </h2>The number one advice is to not be afraid to make mistakes, and the sooner you make them the better. People are really scared to not look smart. They just want to be right all the time. This hinders learning and development, which is crucial for developing a company.And it&rsquo;s also very important to have lots of courage. Don&rsquo;t let people&rsquo;s opinions bring you down because you might have discovered a new way of doing something. So, always remember that the new way of thinking can be the right way of thinking and that, at some point, everything was new.Would you like to know more about Keiron Printing Technologies? Email them at: info@keirontechnologies.com

A young team with a new technology are currently creating a revolution in the world of printed electronics. In their modern, brand-new lab at the High Tech Plaza, they will be developing a device that can deposit any material on any substrate at a very rapid pace.