Isolated capacitor, used in electronic devices

This guide explores the crucial factors in capacitor polarity, its mathematical analysis, identification, and advanced practices for improved circuit performance.

Capacitor Polarity: Ensuring Proper Orientation for Optimal Performance

This article delves into the various types of printed circuit boards, their fundamental concepts, structures, manufacturing processes, and advanced PCB technologies, highlighting their advantages, limitations, and typical applications.

Types of Printed Circuit Boards: A Comprehensive Guide

<h2 id="isPasted">Introduction&nbsp;</h2>Your design choices play a major role in ensuring the quality and reliability of your end product. The key to making good choices is building adaptability and expertise to first understand how your choices will affect the design and how it can be manufactured.This expertise as a PCBA designer will make you stand out in the competitive electronics industry.This e-Book will provide you with the design skills to develop exceptional PCBAs that not only meet but surpass their intended objectives while adhering to tight deadlines and budget constraints. Besides covering the essentials of PCBA design, this invaluable resource will also give you an insight into more advanced approaches and best practices to help even the most experienced designers achieve success. &nbsp; We will cover• Designing for Manufacturability: Discover techniques for optimizing your designs tosimplify manufacturing processes and reduce cost•&nbsp;Designing for Reliability: Understand how to create robust PCBAs that withstandchallenging environments and perform consistently over time• Designing for Testability: Learn to incorporate built-in testing methods to streamlineproduction and improve fault detection.• Designing for Compliance: Explore strategies to ensure your designs adhere to industryregulations and standards.• Designing for EMC Compliance: Uncover the principles behind electromagneticcompatibility and learn how to minimize interference in your PCBA designs.• Designing for PCBA Lifespan: Gain insights on maximizing the longevity and performance of your PCBAs through strategic design choices.Embrace the challenge and embark on this technological journey. You're only one step away from unlocking your full potential in the dynamic world of electrical engineering. Start reading today.<h2>Section One: &nbsp;Designing for Manufacturability: Design Techniques and Best Practices</h2>Design complexity is a daily reality for most PCBA designers, making their jobs increasingly difficult and challenging. This complexity extends beyond design, leading to intricate manufacturing hurdles.Selecting a contract manufacturer that aligns with your design needs is crucial, as every product is unique and quality hinges on a compatible factory. A mismatch can result in manufacturing issues that can persist long after product shipment, causing unfulfilled warranty expectations, financial strain, or even loss of market share.Design is a crucial element in the manufacturing and assembly process, and implementing effective strategies can make all the difference. While "design for manufacturability" (DFM) is a known concept, it is sometimes underappreciated or underutilized by electrical engineers.&nbsp;Design for Manufacturability (DFM) is a proactive approach to designing products that can be consistently manufactured by the designated supply chain with minimal defects. A DFM approach combines best practices with a keen awareness of supply chain limitations, and it can improve the efficiency and quality of manufacturing.By embracing DFM in the design process, electrical engineers can sidestep common problems like high production costs, low yields, extended lead times, and component shortages that tend to surface when DFM is neglected.The purpose of this section is to provide electrical engineers with a deeper understanding of PCBA design guidelines and DFM best practices.&nbsp;<h2 dir="ltr">Best Practices for PCBA Design</h2>To create high-quality, cost-effective, and easily manufactured PCBAs, it's essential to adhere to certain design guidelines that are critical for manufacturability. These include<h3 dir="ltr">Component Placement and Selection</h3>Choosing the right components for your PCBA is crucial for long-term reliability and performance. When selecting components, be sure to:<ul><li dir="ltr">Opt for standard components: Avoid unique or rare components, which may lead to higher costs, limited supplier competition, and increased supply chain disruptions. Standard components are more cost-effective, have a proven track record, and have shorter lead times for better on-time product delivery.</li><li dir="ltr">Conduct a Bill of Materials (BOM) analysis:&nbsp;A streamlined BOM can help reduce manufacturing costs. Fewer parts result in less purchasing activity, lower inventory needs, simplified inspections, and easier testing protocols. Careful creation and review of the BOM are essential to achieve this.</li><li dir="ltr">Use multi-functional parts: Choose components that serve multiple purposes, such as a cover or base plate that also functions as a heat sink.&nbsp;</li><li dir="ltr">Account for Moisture Sensitivity Level (MSL):&nbsp;Identify the MSL for all components and ensure the exposure time on the production floor is controlled. This helps prevent moisture-induced damage to sensitive components.</li></ul><h3 dir="ltr">Improve PCBA Design with Lean Processes</h3>As you tackle your PCBA design, remember to prioritize efficiency. Remove any unnecessary steps or elements that don't contribute to your product's overall quality or function. By simplifying the supply, fabrication, and assembly processes, you'll not only increase accuracy and speed but also make your PCBA easier to manufacture.&nbsp;<ul><li dir="ltr">Use consistent traces: Use consistent trace widths and avoid overly complex routing patterns to facilitate a smooth and easy manufacturing and inspection process</li><li dir="ltr">Optimize component placement:&nbsp; Choose careful component placement to minimize trace lengths and reduce the chance of signal interference</li><li dir="ltr">Collaborate with manufacturers:&nbsp; Engage in early and ongoing communication with your CM to ensure design compatibility and address potential issues to improve and enhance manufacturability.&nbsp;</li></ul><h3 dir="ltr">Optimize Trace Routing and Layout</h3>Some key aspects to consider while optimizing trace routing and layout are:<ul><li dir="ltr">Trace Widths and Spaces:&nbsp;Choose trace widths and spaces according to the guidelines provided by IPC-2221 to ensure the efficient distribution of electrical signals and reduce signal interference.</li><li dir="ltr">Layer Stackup:&nbsp;Design a balanced layer stack-up that promotes efficient signal routing and thermal management, considering factors such as signal integrity and power distribution.</li><li dir="ltr">Routing Techniques:&nbsp;Implement appropriate routing techniques, such as using differential pairs, controlled impedance traces, and avoiding 90-degree angles, to maintain signal integrity and reduce the possibility of electromagnetic interference (EMI).</li><li dir="ltr">Ground and Power Planes: Design solid ground and power planes to provide adequate electrical and thermal performance while minimizing noise and crosstalk.</li><li dir="ltr">Design for Signal Integrity: Consider factors such as trace impedance, trace length matching, and proper termination to ensure the signals maintain integrity throughout the circuit.</li></ul><h3 dir="ltr">Implement Design for Manufacturing (DFM) &amp; Design for Test (DFT)</h3>The DFM process focuses on designing products to be easily and cost-effectively manufactured. By considering factors such as materials, component placement, and fabrication techniques, DFM aims to minimize production costs, reduce the risk of manufacturing defects, and increase the overall efficiency of the manufacturing process. &nbsp;DFT on the other hand, ensures the PCBA can be tested and diagnosed efficiently. This process involves designing the board to be easily accessible for testing equipment, incorporating test points, and providing the necessary documentation for test engineers. &nbsp;Consider:&nbsp;<ul><li dir="ltr">Utilize Design Rules Check (DRC): Employ DRC to verify design compliance with industry standards, evaluating parameters like trace widths, spacing, hole sizes, and component placement to ensure successful fabrication.</li><li dir="ltr">Detect and Address Design Issues Early: Using DRC and DFT tools helps identify potential design violations or testability problems early, allowing designers to resolve them before manufacturing</li></ul>Implementing these tools can help detect potential design violations or testability issues early in the process, enabling designers to address them before the manufacturing stage, ultimately saving time and reducing costs.MacroFab's DFM Check:After an order is placed, MacroFab runs an extensive DFM check to ensure the highest quality PCBAs. This analysis includes evaluating the design's manufacturability and identifying potential issues impacting the production process. &nbsp;By utilizing MacroFab's proactive approach, customers can avoid costly rework and achieve faster time to market.&nbsp;<h2 dir="ltr">Challenges in PCBA Manufacturability</h2>The field of circuit board assembly has evolved significantly since its inception, leading to the development of advanced technologies and assembly methods that enable the creation of innovative electronic devices. However, these advancements have also brought about certain challenges when it comes to manufacturing PCBAs.So, what kind of challenges are we talking about? Let's explore some of the common issues that arise with popular PCBA design choices.Join thousands of engineers who have unlocked their full potential! Download the complete MacroFab's Engineering Essentials guide (over 70 pages) and gain the insights trusted by leading professionals in the industry.<a href="https://www.macrofab.com/documents/pcba-design-handbook-2023/" target="_blank" rel="noopener noreferrer">Download now</a>

To excel in the fast-paced electronics industry, you need not just adaptability, but a cultivated expertise to discern the far-reaching impact of your design decisions. This eBook is your key to building such expertise.

Engineering Design Essentials: The PCBA Design Handbook

Are you an EE looking for a new podcast?  Here's a list of MacroFab Circuit Break episodes to get you started. 

The Perfect Binge! Top 8 Circuit Break Episodes for New Listeners

This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.

PCB Design: A Comprehensive Guide to Printed Circuit Board Design - Part 1

As we look to the skies, we’re on the brink of a significant transformation. By 2036, the International Air Transport Association (IATA) suggests an annual flight tally of 7.8 billion passengers. As more people fly, the need for high-performance aircraft grows, and so does the challenge of creating robust avionic electronics.Avionic electronics operate in demanding conditions. They must withstand intense vibrations without any circuit board malfunctions. Traditional hydraulic and pneumatic systems in aircraft are not only weighty but also have notable reliability concerns. The intricacies of aircraft manufacturing lead to supply chain complications, extended prototype development periods, and greater waste. Additionally, there’s a rising call for predictive maintenance to reduce aircraft downtime.It’s fascinating to watch forward-thinking companies harness the latest trends in avionic electronics to overcome challenges. What sets the modern generation of aircraft apart are breakthroughs in sensor technology, such as engine vibration diagnostics, smart skins, and structural health monitoring.The utilization of virtual reality for aircraft diagnostics and advances in propulsion technology are also noteworthy. Powering onboard sensors with energy harvesting represents another transformative step.But it’s not all smooth flying. Avionics, like many established heavy industries, is often hesitant to fully adopt emerging tech trends. And they have good reasons: regulatory hurdles, compatibility concerns, the necessity of new investments, and the aim to maximize value from recently incorporated technologies—especially given the long life cycle of aircraft.Throughout this article, we’ll explore four cutting-edge trends in avionic electronics and shed light on the challenges they present.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1711029254524-1711029254524.png" alt="Sensor technologies" class="fr-fic fr-dii"><h2><ol><li>Sensor Technologies for Enhanced Aircraft Safety and Performance</li></ol></h2>Modern aircraft are equipped with thousands of sensors, serving as critical components for improved safety, efficiency, reliability, and passenger comfort. These sensors not only monitor and diagnose various aircraft systems in real-time but also set the stage for proactive interventions and optimizations.Key trends in sensor technology currently shaping the future of aviation include:<ul><li>Engine Vibration Diagnostics: Enables early detection of engine anomalies, preventing potential malfunctions. As initially reported by <a href="https://www.militaryaerospace.com/test/article/14292200/engine-vibration-jet-aircraft-passenger-safety" target="_blank">Military Aerospace Electronics</a>, officials from the U.S. Federal Aviation Administration (FAA) Airport Safety Research have embarked on a two-year project. The aim is to use jet aircraft engine vibration monitoring to track both regular and irregular engine vibration levels during development phases, certification testing, and while in airline service.</li><li>Structural Health Monitoring (SHM): Environmental stress can compromise the durability of avionic electronics. SHM plays a pivotal role in safeguarding the integrity of avionic structures. Recent trends in SHM have seen an uptick in the use of more refined and sensitive sensors. These advanced sensors excel at pinpointing fatigue damage, concealed cracks in difficult-to-access areas, disbonded joints, and a host of other structural issues common in aging aircraft.</li><li>Smart Skins: Smart skins aim to provide a sensory layer on the external surface of an aircraft to detect changes, damages, or stress, similar to how biological skin detects stimuli. With advances in <a href="https://www.macrofab.com/blog/use-rigid-flex-pcb-assembly/" target="_blank">flexible electronics</a> and smaller sensors from nanotechnology and micro-fabrication, smart skins are now more reliable. They’re increasingly used on modern aircraft to enhance safety and performance.</li><li>Cutting-Edge Trends in Powering Sensors: Using energy harvesting, aircraft capture electricity from vibrations with embedded piezoelectric transducers. Aircraft naturally vibrate due to engines, aerodynamics, and air conditions, and so energy harvesting using piezoelectric can power onboard sensors, enhancing aviation sustainability.</li></ul><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1711029254597-1711029254597.png" alt="Improved engine diagnostics" class="fr-fic fr-dii">Improved engine diagnostics, SHM, and smart skins, when paired with data analytics are optimizing maintenance in the aviation sector, significantly reducing the estimated $62 billion annual cost due to aircraft-on-ground time. These technologies enable immediate repair actions as soon as aircraft land, minimizing downtime.Highlighting this advancement, <a href="https://www.honeywell.com/us/en/press/2017/06/honeywells-connected-aircraft-maintenance-offering-to-reduce-flight-delays-and-cancellations-for-cathay-pacific" target="_blank">Honeywell and Cathay Pacific</a> have partnered to deploy Honeywell’s GoDirect Connected Aircraft maintenance system for their Airbus A330 fleet. This program, leveraging comprehensive diagnostic information, connectivity, and data analytics, has been shown to decrease system failures by up to 35 percent, reducing aircraft downtime and minimizing flight disruptions.<h2>2. Thermal Features Protecting Aircraft Electronics from Overheating</h2>Electronics produce heat, and <a href="https://www.macrofab.com/blog/improve-heat-dissipation-compact-pcba-designs/" target="_blank">managing this heat effectively</a> is vital for the reliability and longevity of aircraft systems.One of the foremost trends in cooling power electronics and semiconductor devices in aircraft is a shift from using air-cooled methods to liquid-cooled or two-phase flow solutions. These methods offer superior heat transfer density, which helps the electronics stay within safe temperature ranges and thereby reduce the risk of component failures.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1711029254631-1711029254631.png" alt="Protect overheating thermal features" class="fr-fic fr-dii">Concurrently, there’s a renewed interest in air-cooled systems, especially air-cooled heat sinks integrated with advanced materials like Annealed Pyrolytic Graphite and Aluminum Graphite. These provide lighter thermal management systems than their liquid-based counterparts.Additionally, tools such as thermoelastic stress analysis are used in identifying crack locations in fastened aircraft joints.<h2>3. Increased Aircraft Electrification</h2>Global efforts to reduce pollution have spurred the push for greener, more sustainable aviation through aircraft electrification.This shift starts with replacing hydraulic and pneumatic systems with electrical alternatives, resulting in weight savings, improved fuel efficiency, and a reduced environmental footprint.The primary objective is to transition from fossil fuel-powered propulsion to cleaner, quieter electrical propulsion systems. Yet, this change presents challenges, given the bulky motors and the low energy density typical of electric systems. To address these issues, there’s active research into cutting-edge solutions like axial flux motors and superconducting technology. These innovations aim to reduce motor weight and size.Consequently, we’re currently witnessing a rise in more electric-powered aircraft (MEA), where only the propulsion remains fuel-driven, while other subsystems are electric.Hybrid electric aircraft (HEA) are expected to follow soon, blending conventional jet engines with electrical power. At the forefront of this transformation are industry giants like <a href="https://www.airbus.com/en/newsroom/press-releases/2017-11-airbus-rolls-royce-and-siemens-team-up-for-electric-future" target="_blank">Airbus, Rolls-Royce, and Siemens</a>, who have teamed up to pioneer a flight demonstrator for commercial hybrid-electric propulsion.Ultimately, the vision is the emergence of all-electric aircraft (AEA) or full-electric aircraft (FEA), which are entirely devoid of combustion engines.<h2>4. Diagnosing Aircraft Electronics with Virtual Reality (VR)</h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1711029254707-1711029254707.png" alt="Aerospace virtual reality" class="fr-fic fr-dii">The VR Diagnostic System offers a virtual environment where technicians can navigate through a life-size, 3D representation of an aircraft’s electronic system. With immersive visuals and interactive elements, it provides a hands-on experience without ever touching the actual hardware.Technicians can view components from all angles, zoom in for detailed inspections, or even view inside components. Since this method is non-intrusive, it mitigates the risk of inflicting damage to delicate electronics or inadvertently triggering malfunctions during assessments.Additionally, it significantly saves time by eliminating the need for traditional paper manuals, enabling maintenance staff to quickly access relevant data on handheld devices.Beyond diagnostics, VR is being used as an excellent training medium. Novice technicians practice troubleshooting in the virtual environment, refining their skills without the risk of causing harm to actual aircraft components.<h2>Conclusion</h2>Modern aircraft are leveraging advanced sensor technologies for enhanced engine and structural health monitoring, as well as the implementation of smart skins. The vast array of diagnostic data gathered from these sensors is increasingly integrated with data analytics, enhancing inspection and maintenance processes.Additionally, the advent of Aircraft Maintenance Virtual Reality (AMVR) systems has revolutionized how aircraft are modeled during maintenance and inspection. VR systems also serve as invaluable training tools for novice technicians. Integrated thermal management systems and materials have also made significant strides in the avionic industry.<section><h4 id="isPasted">Visiting the Houston Area?</h4>Come Tour MacroFab’s ITAR-Compliant Facility<a href="https://www.macrofab.com/tour-macrofabs-itar-compliant-facility/" target="_blank">SCHEDULE YOUR TOUR NOW</a><section><h5> </h5></section></section>

The world is witnessing a rise in more electric aircraft (MEA) where only the propulsion remains fuel-driven and other subsystems are electric rather than hydraulic or pneumatic. Find out what this change means for EEs. 

Four Cutting-Edge Trends in Avionic Electronics You Should Know

The TechBlick Innovations Festival, happening online on April 25, 2024, is a curated event for engineers, researchers, entrepreneurs, and inventors, focusing on advancements in additive, printed, 3D, and wearable electronics, among other topics.&nbsp;It features networking opportunities and an immersive virtual exhibition. Attendees can expect talks from leading global speakers representing companies like SPGPrints, ACI Materials, and Akoneer, covering topics such as scaling printed electronics from lab to production, transformative conductive inks, and semiconductor packaging innovations. For more details, <a href="https://wevlv.co/techblick24eventdetails" target="_blank" rel="noopener noreferrer">visit the event page</a><a href="https://www.techblick.com/event/spring_innovations_festival" target="_blank" rel="noopener noreferrer"></a><a href="https://www.techblick.com/event/spring_innovations_festival" target="_blank" rel="noopener noreferrer">.</a>The last Innovation event had over 700+ participants [not registrants]! Do not miss this opportunity! There are simultaneous events throughout the day, including presentations from Neibling, NanoPrintek, TracXon, Kimoto, and more.&nbsp;The cutting-edge virtual environment enables you to meet other participants, attend events, and discover new technologies.&nbsp;<a href="https://wevlv.co/techblick_innovation_24" target="_blank" rel="noopener noreferrer" class="button-main-action">Register now!</a><h2 dir="ltr" id="isPasted">Speaker Highlights</h2>The event features a wide range of speakers covering all aspects of the additive and flexible electronics sector. Following are some of the highlights of notable speakers and their topics from Track 1 and Track 2:<h3 dir="ltr">Highlights from Track 1</h3>Innovating with TFT technology in both optoelectronic and biological ways — Partner and Co-CEO of LinkZill,Yixing Yang, will speak about TFT semiconductor technology and its applications in various fields of optoelectronics and life sciences such as large-area bio-sensing, novel display, high-throughput DNA synthesis, and in-vitro diagnostics (IVD).Scalable, customizable, multimodal electrode platform for biosensors and sensors — Healthcare Marketing Director of Linxens,&nbsp;Christelle Robellin, will speak about the latest advancements in Point-of-Care Diagnostics enabled by Linden’s innovative manufacturing process. She will cover recent developments in electrode design, surface coating, microfluidics, and connectivity, highlighting their applications in continuous monitoring of glucose, wound healing, water quality, and sports performance.Advances in wash testing of conductive inks for wearable electronics — Business Development Manager of Nagase ChemteX America Corporation (NCU),Alan Brown, will address the significant challenges faced by conductive inks when applied in wearable applications, with a particular focus on washability—the most formidable obstacle among them.&nbsp;Beyond paper: Inkjet printing is the future in drops — Manager of Sales and Services of Suss MicroTec,&nbsp;Peter de Vrieze, will discuss groundbreaking technologies aimed at advancing the field of printed electronics. De Vrieze will spotlight the latest advancements in analysis tools, ranging from cutting-edge dropwatching technologies to intelligent inspection tools.<h3 dir="ltr">Highlights from Track 2</h3>Demonstration of flexible and printed electronics production using INO PE Line A7 — representing INO Sales US,Nivas Vehar will demonstrate the production process of flexible and printed electronics through three-color screen printing, showcasing zero scrap and exceptional efficiency. After the demonstration, attendees can engage in a Q&amp;A session to explore the complexities of this cutting-edge process.Going maskless for semiconductor packaging with SSAIL — CCO of AkoneerTadas Kildusis, will introduce SSAIL technology, enabling direct copper deposition onto organic and dielectric materials. He'll discuss its applications in RDL, fanouts, and heterogeneous integration, emphasizing high adhesion for reliability in automotive and defense.Laser Patterning of sputtered coatings for high-volume production of flexible devices — Mechanical Engineer at Intellivation LLC,Matthew Kleyn, will discuss advanced roll-to-roll (R2R) solutions using vacuum coatings and laser patterning to meet the demand for high-volume flexible devices across industries. He'll emphasize optimized process controls and the importance of modularity and scalability for high-volume production.High Pressure Forming (HPF) for In-Mold Electronics (IME) processes — Director Sales &amp; Marketing at Niebling GmBH,Udo Weustenhagen, will speak about the importance of precise 3D substrate forming for In-Mold Electronics (IME). He will cover the alignment of conductor tracks, electronic components, and graphics within injection tool cavities. Weustenhagen will introduce the high-pressure forming process, highlighting its benefits over traditional methods, including lower temperatures and clever automation for series production.For the full list of speakers and presentation times, <a href="https://www.techblick.com/event/spring_innovations_festival" target="_blank">visit the event page.</a>

Engineers, researchers, entrepreneurs, inventors, and end users are invited to join TechBlick Innovations Festival, exploring additive, printed, 3D, and wearable electronics on 25 April 2024 online.

TechBlick Innovations Festival

The electronics industry has some incredibly complex manufacturing practices and supply chains. Electronic technology evolves at a rapid pace, and products often contain dozens of components sourced from all over the world. Take the Apple iPhone 15, for example. The pocket-size device has a frame made by Chinese company Foxconn, a display made by Korean tech giant Samsung, and communications chips from U.S. companies Qualcomm and Broadcom. That’s a lot of technology and a lot of logistics.But a complex supply chain is just the tip of the iceberg. Electronics manufacturers are faced with many diverse challenges such as expanding into new markets, ensuring quality products while dealing with increasing part complexity, reacting to supply chain volatility and resiliency, and dealing with rising concerns over the carbon footprint of electronics throughout their life cycle. Safety issues and smaller forms add further challenges.Current trends in electronics address some of these issues but exacerbate others. Developments in material science are resulting in advanced electronics materials that are lighter and more energy-efficient, helping reduce the carbon footprint of electronic products while heightening their performance. 2024 may even see a rise in the use of biodegradable electronics. Elsewhere, <a href="https://xometry.eu/en/additive-manufacturing-in-electronics/" target="_blank">electronics 3D printing</a> continues to show promise in terms of agile manufacturing that eases pressure on global supply chains by localising production, as well as specific applications like 3D printed flexible PCBs. Yet these new developments bring added technological complexity and create new challenges.So where does integration of artificial intelligence (AI) come into play? AI is expected to be a major electronics industry trend in 2024 — in terms of production, supply chains, and features of products themselves. As the technology continues to evolve at a rapid pace, engineers and product designers have the opportunity to harness AI for faster and more effective ideation, rapid prototyping, and shorter time-to-market, while suppliers and OEMs can deploy AI for tasks like predictive maintenance and defect detection. AI can also be deployed in procurement processes for smart supply chain management, using big data to make better forecasting and buying decisions. Finally, consumers are beginning to demand improved AI features in products. For example, the next iPhone is expected to provide a revamp of the AI capabilities of its “Siri” digital assistant.This article discusses how AI is accelerating advancements in electronics manufacturing for vendors, suppliers, distributors, and beyond. It focuses on two key areas: expedited product development and smart procurement for improved part sourcing.<h2 dir="ltr">Accelerating Product Design and Development</h2>One of the most exciting potential uses of artificial intelligence in the electronics industry is the acceleration of product design and development. Engineers and product designers can use AI tools to expedite idea generation and iteration, visualize and develop those ideas, automatically generate Design for Manufacturability (DfM) feedback, initiate and oversee rapid prototyping, and ultimately reduce the time-to-market for cutting-edge products.AI can be implemented at the earliest stages of product development. For example, during market research, companies can use AI tools like Appen and Speak to turn data into consumer insights, helping them identify market opportunities. Some of the biggest limitations on this kind of AI use is limited or noisy data, but the electronics industry — particularly consumer electronics — can potentially provide vast datasets due to the large number of end-users.&nbsp;Even greater opportunities arise during the ideation stage. Generative AI tools, including large language model (LLM) chatbots like ChatGPT and text-to-image systems like Midjourney, can assist product designers with concepts and early designs. For example, users could submit a prompt such as “five new plug-and-play USB devices targeted at senior citizens” to an LLM chatbot. Ideas can then be developed organically or with further dialogue with the chatbot.Text-to-image generation tools provide opportunities for ideation, particularly in areas of electronics where innovative or unusual design can be a major selling point. While a tool like Midjourney may be unlikely to stumble upon an iconic new design like the Sony Walkman or iPod scroll wheel, it could be prompted to ideate new designs for a product such as a pair of headphones. Generative AI tools are helpful for product designers, as they encourage outside-the-box thinking and challenge preconceptions that humans may have trouble overcoming without assistance.Generative design tools within established CAD applications like Solidworks Autodesk Fusion 360 and Siemens NX are another way to automate part design and allow engineers to define specific parameters and manufacturing requirements that would not be possible with simple text-to-image generation. This use of AI allows for the solving of specific engineering challenges — reducing the mass of a digital camera body by a set percentage, for example.Further along the product development cycle, machine learning is steadily being incorporated into design for manufacturability (DfM) analysis. DfM allows engineers to validate the manufacturability of designs before prototyping, and is typically based on manually written rules (machine envelopes, material behavior, etc.). However, AI is opening up opportunities for more efficient and automated DfM analysis. For instance, researchers have successfully used supervised machine learning during semiconductor fabrication to more accurately identify errors.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEwNzgzMDMwNjk1LXNodXR0ZXJzdG9ja18xMDU2ODAyNzYzLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib">Generative design tools can enable the design the efficient design of complex systems.&nbsp;<h2 dir="ltr">Smart Procurement for Supply Chain Management</h2>One of the most promising applications of artificial intelligence in the electronics industry is smart procurement: using AI to automate and streamline procurement processes and tackle supply chain challenges using big data. As discussed in the introduction to this article, electronics supply chains can be complex and volatile — a fact made evident by the industry-damaging global chip shortage of 2020–2023 — and buyers need all the tools at their disposal to deal with such challenges.As discussed in the Xometry white paper <a href="https://www.xometry.com/resources/ebooks/ultimate-guide-use-of-ai-for-supply-chain-optimization/" target="_blank">The Ultimate Guide to the Use of Artificial Intelligence for Supply Chain Optimization</a>, smart procurement can be defined as the use of “advanced analytics, visualization, robotic process automation (RPA), big data, and artificial intelligence” within the procurement department in order to improve performance. The scope of AI usage can include machine learning, natural language processing, and other systems.So what can AI achieve in electronics procurement? Ultimately, nobody is proposing that all part sourcing be left to computers. Rather, AI can be used to perform specific tasks, analyzing massive datasets to reduce risk, streamlining processes, and providing clearer information that leads to faster and more cost-efficient procurement. Would AI have been able to predict the pandemic-related chip shortage? Perhaps not, but datasets can include a very broad range of data points to help identify both risks and revenue opportunities such as new markets and suppliers.Specific examples of AI usage in procurement include the use of machine learning algorithms for processes like vendor matching — connecting supplier data to a vendor hierarchy — and cloud-powered <a href="https://xometry.uk/" target="_blank" rel="noopener noreferrer">instant quotations</a> based on technical drawings that significantly shorten the pricing process. While speeding up such tasks may not seem like a radical application of AI, it is precisely the kind of area of supply chain management that can benefit from additional computing power, leaving humans to focus on high-level decision making. But AI algorithms deployed in such a way can have radical results — helping detect anomalies that could be missed using traditional methods, potentially helping to detect instances of fraud, for example.While electronics procurement departments may be hesitant to overhaul their systems in favor of AI-driven smart procurement, change is certainly on the horizon. According to a <a href="https://www2.deloitte.com/us/en/insights/topics/operations/chief-procurement-officer-cpo-survey.html" target="_blank">Deloitte survey</a> of chief procurement officers, high-performing officers are “18x more likely to have fully deployed AI/cognitive capabilities” in their workflow.<h2 dir="ltr">Conclusion</h2>Artificial intelligence is changing the electronics industry in many ways. As a consumer, expect to see greater advancements in AI-powered products like IoT devices, smart home components, and smartphone apps. However, some of the most impactful changes will be taking place behind the scenes in the form of AI-assisted product development and buying strategies, allowing for even faster emergence of new and exciting technologies.

Artificial intelligence (AI) is providing an opportunity for the electronics industry to accelerate design and development and speed up part sourcing.

How AI is Accelerating Advancements in Electronics Manufacturing

Understanding circuit board components is essential. It's key to creating and fixing gadgets in our tech-filled world. In this article, we’ll explore popular circuit board components and various techniques to identify them.

Circuit Board Components Identification: A Comprehensive Guide

This episode of Circuit Break features James Lewis, the Bald Engineer, in a discussion on his ambitious Mega IIe project. Lewis dives into the technical details of constructing a functional computer around the Apple II GS's Mega II chip.<h3 data-sourcepos="5:1-5:240"><iframe width="100%" height="180" frameborder="no" scrolling="no" seamless="" src="https://share.transistor.fm/e/a2988ef3" class="fr-draggable" data-lf-form-tracking-inspected-kn9eq4roawkarlvp="true" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true" data-lf-vimeo-playback-inspected-kn9eq4roawkarlvp="true">&nbsp;&nbsp;&nbsp;</iframe> The conversation explores:</h3><ul data-sourcepos="9:1-14:0"><li data-sourcepos="9:1-9:121">Apple II Architecture and Nostalgia: Examining the open design and historical significance of the Apple II series.</li><li data-sourcepos="10:1-10:217">Mega IIe Project Breakdown: A detailed look at the project's evolution, including initial concepts, technical challenges like integrating modern microcontrollers (RP2040), and solutions for component shortages.</li><li data-sourcepos="11:1-11:264">Debugging and Design Decisions: The discussion covers debugging challenges encountered during integration and the rationale behind the project's shift from a simple breakout board to a modular backplane system and eventually a single-board computer format.</li><li data-sourcepos="12:1-12:145">Video Signal Processing: Lewis dives into the complexities of converting the Mega II chip's RGB output for modern digital video displays.</li><li data-sourcepos="13:1-14:0">Future Directions: The episode concludes with Lewis reflecting on the learnings from the project's extended development and potential future endeavors.</li></ul>This episode offers valuable insights for engineers interested in vintage computing, hardware design, and the unique challenges of integrating legacy components with modern technologies.Parker and Stephen also announce <a href="https://www.macrofab.com/events/macrofab-food-device-design-derby-challenge/" target="_blank" rel="noopener noreferrer">an exciting new contest</a> with over $5,000 in cash prizes, themed trophies, and free prototyping from MacroFab, but the deadline to submit is coming up fast! Thanks to Mouser Electronics for sponsoring the contest prizes.&nbsp;<hr><h3>About the Hosts</h3><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzEwNDIwNjE5NzgzLTE3MTA0MjA2MTk3ODMucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="Parker dillmann" class="fr-fic fr-dii">Parker Dillman from MacroFab's CircuitBreak&nbsp;<h5>&nbsp; Parker Dillmann</h5>Parker is an Electrical Engineer with backgrounds in Embedded System Design and Digital Signal Processing. He got his start in 2005 by hacking Nintendo consoles into portable gaming units. The following year he designed and produced an Atari 2600 video mod to allow the Atari to display a crisp, RF fuzz free picture on newer TVs. Over a thousand Atari video mods where produced by Parker from 2006 to 2011 and the mod is still made by other enthusiasts in the Atari community.In 2006, Parker enrolled at The University of Texas at Austin as a Petroleum Engineer. After realizing electronics was his passion he switched majors in 2007 to Electrical and Computer Engineering. Following his previous background in making the Atari 2600 video mod, Parker decided to take more board layout classes and circuit design classes. Other areas of study include robotics, microcontroller theory and design, FPGA development with VHDL and Verilog, and image and signal processing with DSPs. In 2010, Parker won a Ti sponsored Launchpad programming and design contest that was held by the IEEE CS chapter at the University. Parker graduated with a BS in Electrical and Computer Engineering in the Spring of 2012.In the Summer of 2012, Parker was hired on as an Electrical Engineer at Dynamic Perception to design and prototype new electronic products. Here, Parker learned about full product development cycles and honed his board layout skills. Seeing the difficulties in managing operations and FCC/CE compliance testing, Parker thought there had to be a better way for small electronic companies to get their product out in customer's hands.Parker also runs the blog, longhornengineer.com, where he posts his personal projects, technical guides, and appnotes about board layout design and components.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1710945957606-stephen-kraig.jpg" alt="Stephen Kraig" class="fr-fic fr-dii" style="width: 758px;">Stephen Kraig from MacroFab's CircuitBreak&nbsp;<h5>&nbsp; Stephen Kraig</h5>Stephen Kraig is a component engineer working in the aerospace industry. He has applied his electrical engineering knowledge in a variety of contexts previously, including oil and gas, contract manufacturing, audio electronic repair, and synthesizer design. A graduate of Texas A&amp;M, Stephen has lived his adult life in the Houston, TX, and Denver, CO, areas.Stephen has never said no to a project. From building guitar amps (starting when he was 17) to designing and building his own CNC table to fine-tuning the mineral composition of the water he uses to brew beer, he thrives on testing, experimentation, and problem-solving. Tune into the podcast to learn more about the wacky stuff Stephen gets up to.

Parker and Stephen chat with James Lewis (aka the Bald Engineer) about constructing a functional computer based on the Apple II GS's Mega II chip, and also announce a contest sponsored by Mouser! 

Circuit Break Podcast 420: The Mega IIe: A Vintage Computing Adventure with James Lewis

<h2 dir="ltr" id="isPasted">Introduction</h2>Embedded systems are integral to our daily lives, found in everything from home appliances to industrial machines. The heart of any such system is its microcontroller (MCU). This tiny yet important component is more than just a piece of hardware; it is the decision-maker that drives the functionality, efficiency, and success of the entire project. Choosing the right MCU is not a mere technical decision; it's a strategic one that significantly impacts the overall system performance, power consumption, and functionality of your embedded design. A well-chosen MCU ensures that your system runs reliably and efficiently, handling tasks with the necessary speed and consuming power with careful consideration. Conversely, a poorly selected MCU can lead to underperformance, high energy consumption, and increased costs, potentially compromising the project's success. Therefore, understanding the main benefits of MCUs and aligning them with your project's needs is an important part of your project in the field of embedded systems engineering.<h2>Understanding Project Requirements&nbsp;</h2>Selecting the right MCU for an embedded project is an important decision relying on the project's specific requirements, as the chosen MCU directly influences the functionality, efficiency, and scalability of the project. This process begins with a thorough analysis of the project's goals and technical needs. Firstly, it’s important to analyze the project's functional requirements, which includes understanding the tasks the MCU needs to perform, such as data processing, signal control, or communication with other devices.&nbsp;The processing power of the MCU determines how quickly and efficiently it can execute tasks, important for applications that require real-time processing or handling complex algorithms. It is essential to assess the processing needs of your project, whether it involves simple control tasks or more demanding computational work. A more powerful MCU might be necessary for intensive tasks, but it could also mean higher costs and energy consumption.Memory is another critical factor. The MCU's memory is split into two main types: flash (for storing your program) and RAM (for temporary data storage during operation). The size of your code and the data it needs to handle will dictate the memory requirements. Insufficient memory can lead to performance issues or limit the scope of your project, so it’s important to estimate memory needs accurately.Furthermore, the nature and number of I/O interfaces determine how the MCU will interact with other components like sensors, actuators, and user interfaces. Count the number and type of I/O pins you need and ensure that the MCU can accommodate them. Additionally, consider the need for specialized functions, such as analog-to-digital converters (ADCs) or pulse-width modulation (PWM) outputs.But also, many embedded projects require MCUs to communicate with other devices. This could be through standard protocols like UART, SPI, or I2C for onboard communication, or more advanced interfaces like Ethernet or Wi-Fi for network connectivity. The choice of MCU should align with these communication needs, ensuring it supports the required protocols without necessitating extensive additional hardware.<h2>Microcontroller Architectures</h2>In order to choose the right MCU it is important to understand the various MCU architectures, like AVR, ARM, and PIC, each having unique properties and influence differently like performance, power efficiency, and development flexibility.Firstly, AVR architecture, widely recognized through the Arduino platform, stands out for its user-friendly approach. Ideal for beginners and educational purposes, AVR chips are known for their simplicity in programming and debugging. They offer a decent balance of power efficiency and processing capability, making them well-suited for moderate-level applications like hobbyist projects or basic automation systems.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA5ODE0NDk4OTIwLVBST0dSQU0gUk9NLnBuZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 100%px;" class="fr-fic fr-dib">ARM architecture, on the other hand, is known for its high-performance capabilities and remarkable energy efficiency. ARM-based MCUs are versatile, scaling from lower-end Cortex-M series to the more powerful Cortex-R and Cortex-A series, making them applicable for a broad range of applications, from simple devices to complex, compute-intensive applications like smart home systems, advanced robotics, and IoT devices.PIC architecture is favored for its adaptability and low power consumption, comes in a variety of options, accommodating a wide range of needs from basic to complex. PIC chips are particularly noted for their robustness and reliability, making them a preferred choice in industrial applications and consumer electronics.Selecting the appropriate architecture requires a careful evaluation of your project's needs. If your project demands high processing power and energy efficiency, ARM-based MCUs are typically the go-to choose. For projects that prioritize ease of use and cost-effectiveness, especially for those new to embedded systems, AVR might be more appropriate. Meanwhile, for applications that require a balance between performance, power efficiency, and versatility, PIC MCUs are often a reliable choice.<h2 dir="ltr">Power Consumption Considerations</h2>The energy efficiency of a MCU can greatly influence the longevity and reliability of a system, affecting everything from user experience to maintenance costs. In battery-operated devices, such as portable medical devices, wearables, or remote sensors, minimizing power consumption is important. Especially when high power usage leads to frequent battery replacements or recharges, which can be impractical or costly. Additionally, in applications where it is difficult to access the device for maintenance, such as embedded sensors in smart infrastructure, efficient power usage becomes even more important for ensuring long-term operation.Modern MCUs are equipped with various low-power modes and energy-saving features. These include sleep or idle modes, where the MCU slows down or turns off certain functions when they are not needed. For instance, a MCU might power down its CPU while keeping its memory active, allowing it to quickly resume full operation when required. Other features include efficient clock management and power gating, which selectively shuts down unneeded peripherals.Achieving the right balance between processing power and energy efficiency is a challenging aspect of MCU selection. Higher processing power generally leads to higher power consumption, but this is not always a linear relationship. Advanced MCUs are designed to provide optimum performance with minimal energy use. When selecting a MCU, consider the processing demands of your application and compare them against the power specifications of the MCU. Often, it’s possible to find a MCU that offers sufficient processing capabilities while still maintaining a low energy footprint.<h2 dir="ltr">Development Ecosystem and Tools</h2>The choice of a MCU is greatly influenced by the availability and quality of its development ecosystem. This ecosystem encompasses the software tools, libraries, community support, and documentation available for a particular MCU. A strong development ecosystem simplifies every stage of the project lifecycle, from prototyping to deployment. It provides developers with vital resources like compilers, integrated development environments (IDEs), and code libraries. Additionally, a community support network can be an important benefit, offering solutions to common problems, advice on best practices, and shared experiences from fellow developers.A well-supported ecosystem can significantly streamline the development process. Access to comprehensive libraries and frameworks allows developers to avoid misleading steps for common tasks and functionalities. Moreover, good documentation and active community forums can speed up the troubleshooting process, reducing development time.Development tools are important especially in simplifying debugging and testing. Advanced IDEs offer features like code completion, error highlighting, and sophisticated debugging tools that can detect and help resolve issues quickly. These tools are invaluable in ensuring the reliability and performance of the final product. Moreover, some ecosystems provide simulation tools allowing developers to test their code in a virtual environment before deploying it on actual hardware, further easing the development process.<h2>Costs</h2>The price of a microcontroller can significantly impact the overall budget of a project, especially in large-scale productions or cost-sensitive applications. The cost of a microcontroller is not limited to its purchase price alone. It encompasses the long-term expenses associated with development, maintenance, and potential scalability needs. In projects where large quantities of MCUs are required, even a small difference in unit cost can substantially affect the total expenditure. Therefore, it is important to choose wisely and select a MCU that fits within the budget while meeting the project requirements.<h2>Practical Examples&nbsp;</h2>In this section, two practical examples will be shortly observed. In the first one, application of MCUs for home automation systems is of interest. This automation project has requirements to have low power consumption, Wi-Fi connectivity, and the ability to handle multiple sensor inputs. An ESP32 microcontroller was chosen for its built-in Wi-Fi capabilities, efficient power management, and ample GPIO pins for sensor connectivity. The result was a cost-effective, energy-efficient system capable of seamless integration into a smart home environment.Another example is installation of MCUs as an industrial monitoring device, where a robust MCU for monitoring equipment is required. The critical factors were reliability under harsh conditions, extended temperature range, and real-time processing. A microcontroller from the STM32 family was selected for its ruggedness, wide temperature tolerance, and high processing power. This choice ensured reliable and accurate monitoring under industrial conditions.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA5Nzk0ODM2OTA1LW1vdXNlciBtY3UuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib"><h2 dir="ltr" id="isPasted">Conclusion&nbsp;</h2>The selection of the right microcontroller extends far beyond technical specifications, it also involves a thoughtful and customized approach that aligns with the specific needs and constraints of the project. A microcontroller is not just a component; it is the driving force behind the functionality, efficiency, and scalability of an embedded system. The diverse range of architectures, from AVR to ARM to PIC, offers a spectrum of options catering to different project needs. By understanding these various elements and applying this knowledge carefully, engineers and developers can make informed decisions that lead to efficient, reliable, and successful embedded systems.

Selecting the right microcontroller (MCU) is crucial in embedded systems engineering, as it significantly influences the system's performance, power consumption, and overall success.

Choosing the Right Microcontroller for Your Embedded Project

After the incredible impact of the previous Build2gether 1.0 challenge, we’re thrilled to invite innovators, dreamers, and engineers from around the globe to participate in this year's challenge for groundbreaking solutions that enhance accessibility for people with disabilities.Objective: Focus on creating assistive technologies that address the unique challenges faced by individuals with visual and mobility impairments, enhancing their daily lives both indoors and outdoors.Prizes:&nbsp;Over $100,000 in Prizes.&nbsp;From the Build2Gether 2.0 Ultimate Award to multiple category prizes and lucky draws.<a href="https://wevlv.co/btg2-hack-lp" target="_blank" rel="noopener noreferrer" class="button-main-action">Learn more</a><h2 id="isPasted">Two Paths to Innovation</h2>This year's challenge is organized into two main focus areas, each divided into two specific tracks to guide your innovations. There are several Contest Masters (i.e., experts in the disability space) helping you in each track.VISUAL IMPAIRMENTS<ul><li>Track 1:Adaptation for&nbsp;OUTDOOR&nbsp;Activities for people with visual impairments with Contest Masters: Marc Chiang, Steady Goh, Stuart Francis, Tony Morgan, Kah Wee Neo, Joan Hung Hui Xin, and Josh Tseng.</li><li>Track 2:Adaptation for INDOOR Activities for people with visual Impairments&nbsp;with Contest Masters: Amanda Chong, Amanda Swafford, Benson Loo, Hong Sen, Patricia Poo, Alan Etermi, and Dallon Au Yew Zhang.</li></ul>MOBILITY IMPAIRMENTS<ul><li>Track 1:&nbsp;Accessible HOME &amp; TOOLS&nbsp;for people with mobility impairments&nbsp;with Contest Masters: Paul Fjare, Drew McPherson, Paul Amadeus Lane, and Vivek Gohil.</li><li>Track 2:&nbsp;Accessible SPORTS &amp; HOBBIES for People with Mobility Impairments&nbsp;with Contest Masters: Julie Keenan, Ashley Lindsey, Jake Scarborough, and Hoàng Gia Khánh.</li></ul><h3>Win Big and Make an Impact:</h3><ul><li>200 Hardware SUPERBOXES up for grabs, each packed with cutting-edge tech.</li><li>Over $100,000 in Prizes: From the Build2Gether 2.0 Ultimate Award to multiple category prizes and lucky draws.</li></ul>The SUPERBOX contains the following hardware:<ul><li><a href="https://blues.com/" data-ha='{"eventName":"Clicked link","customProps":{"value":"Blues","href":"https://blues.com/","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">Blues</a>' kit worth $130 (<a href="https://shop.blues.com/collections/swan/products/swan" data-ha='{"eventName":"Clicked link","customProps":{"value":"Swan v3","href":"https://shop.blues.com/collections/swan/products/swan","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">Swan v3</a>,&nbsp;<a href="https://shop.blues.com/collections/notecarrier/products/carr-al" data-ha='{"eventName":"Clicked link","customProps":{"value":"Notecarrier AL or AA","href":"https://shop.blues.com/collections/notecarrier/products/carr-al","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">Notecarrier AL or AA</a>,&nbsp;<a href="https://shop.blues.com/collections/notecard/products/notecard" data-ha='{"eventName":"Clicked link","customProps":{"value":"Notecard Cellular NBGL","href":"https://shop.blues.com/collections/notecard/products/notecard","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">Notecard Cellular NBGL</a>,&nbsp;<a href="https://shop.blues.com/collections/notecard/products/wifi-notecard" data-ha='{"eventName":"Clicked link","customProps":{"value":"Notecard WiFi v1","href":"https://shop.blues.com/collections/notecard/products/wifi-notecard","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">Notecard WiFi v1</a>).</li><li><a href="https://www.nordicsemi.com/" data-ha='{"eventName":"Clicked link","customProps":{"value":"Nordic Semiconductor","href":"https://www.nordicsemi.com/","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">Nordic Semiconductor</a>'s&nbsp;<a href="https://www.nordicsemi.com/Products/Development-hardware/nrf52840-dk" data-ha='{"eventName":"Clicked link","customProps":{"value":"nRF52840 DK","href":"https://www.nordicsemi.com/Products/Development-hardware/nrf52840-dk","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">nRF52840 DK</a>&nbsp;worth $40.</li><li><a href="https://www.seeedstudio.com/?gad_source=1&gclid=CjwKCAiA29auBhBxEiwAnKcSqoK1Oe2qAYQ7zDNvRcVUjsKDK6-d3mpEPcpYo00BeFEuC66g1oDICRoCqM4QAvD_BwE" data-ha='{"eventName":"Clicked link","customProps":{"value":"Seeed Studio","href":"https://www.seeedstudio.com/?gad_source=1\u0026gclid=CjwKCAiA29auBhBxEiwAnKcSqoK1Oe2qAYQ7zDNvRcVUjsKDK6-d3mpEPcpYo00BeFEuC66g1oDICRoCqM4QAvD_BwE","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">Seeed Studio</a>'s kit worth $20 (<a href="https://www.seeedstudio.com/XIAO-ESP32S3-Sense-p-5639.html" data-ha='{"eventName":"Clicked link","customProps":{"value":"XIAO ESP32S3 Sense","href":"https://www.seeedstudio.com/XIAO-ESP32S3-Sense-p-5639.html","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">XIAO ESP32S3 Sense</a>&nbsp;+&nbsp;<a href="https://www.seeedstudio.com/Grove-Shield-for-Seeeduino-XIAO-p-4621.html" data-ha='{"eventName":"Clicked link","customProps":{"value":"Grove Shield for Xiao","href":"https://www.seeedstudio.com/Grove-Shield-for-Seeeduino-XIAO-p-4621.html","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">Grove Shield for Xiao</a>).</li><li><a href="https://www.dfrobot.com/" data-ha='{"eventName":"Clicked link","customProps":{"value":"DFRobot","href":"https://www.dfrobot.com/","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">DFRobot</a>&nbsp;$80 giftcard for&nbsp;<a href="https://www.dfrobot.com/product-2691.html" data-ha='{"eventName":"Clicked link","customProps":{"value":"UNIHIKER","href":"https://www.dfrobot.com/product-2691.html","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">UNIHIKER</a>.</li><li><a href="https://www.pcbway.com/" data-ha='{"eventName":"Clicked link","customProps":{"value":"PCBWay","href":"https://www.pcbway.com/","type":"story","location":"story"},"clickOpts":{"delayRedirect":true}}' rel="nofollow" target="_blank">PCBWay</a>&nbsp;$40 giftcard.</li></ul><h3 id="isPasted">Key Dates</h3><table><tbody><tr><td>EVENT</td><td>DATE</td></tr><tr><td>Contest Begins</td><td>February 26, 2024 at 3:00 PM PST</td></tr><tr><td>Submissions close</td><td>August 15, 2024 at 11:00 PM PDT</td></tr><tr><td>Winners announced by</td><td><div data-hypernova-key="ContestBriefPage" data-hypernova-id="e201336d-ef39-435b-a2dc-a0af0298ffbc" id="isPasted"><div data-reactroot=""><div data-hypernova-key="ContestBriefPage" data-hypernova-id="98dfc449-4aee-4f2c-8039-a0ec0e635839" id="isPasted"><div data-reactroot="">Sep 1, 2024</div></div></div></div></td></tr></tbody></table><h2>Get Started:</h2>Engage: Submit up to two solutions, one for each focus area. *For your submission to be eligible to receive prizes, you must fill out the survey found at hackster.io by&nbsp;May 1, 2024 at 10:00 AM PT.Collaborate: Benefit from tailored feedback from our Contest Masters.Innovate: Your solutions could win you amazing prizes and the chance to change lives.Everything you need to know, including information on the prizes, Contest Masters etc. can be found at the <a target="_blank" data-stringify-link="http://hackster.io" data-sk="tooltip_parent" href="https://wevlv.co/btg2-hack-lp" rel="noopener noreferrer" id="isPasted">hackster.io</a> page.<a href="https://wevlv.co/btg2-hack-lp" target="_blank" rel="noopener noreferrer" class="button-main-action">Learn more</a> <h2>Sponsors of the Build2gether 2.0 Challenge</h2><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNzA5Mjg5ODk5MDY2LXNwb25zb3JzdHJ1Y3R1cmVfVVFvcjFuQWlBTSAoMSkucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 100%px;" class="fr-fic fr-dib">

Explore and address needs in assistive technology, creating meaningful solutions for individuals with disabilities. Win great prizes!

Build2gether 2.0 Inclusive Innovation Challenge

An AI-generated depiction of a modern day chipset

Gaining a comprehensive understanding of the distinct capabilities and applications of TPUs and GPUs is crucial for developers and researchers aiming to navigate the complex and rapidly changing terrain of artificial intelligence.

TPU vs GPU in AI: A Comprehensive Guide to Their Roles and Impact on Artificial Intelligence

<h1 id="isPasted"> </h1><section><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1709134953278-1709134953278.png" alt="Hardware construction" class="fr-fic fr-dii">Hardware businesses are notoriously challenging in the vast, dynamic world of startups. There are over 72,500 startups in the U.S. alone, yet only half have a survival rate beyond five years. In hardware startups, the stats are even worse: only 24 percent raise second-round funding, and 97 percent die or become zombie companies.This stark reality becomes even more pronounced for hardware startups as they face high risks and navigate a path to success littered with obstacles. Yet, despite these odds, entrepreneurs and investors continue to chase the dream of creating the next billion-dollar tech success, constantly fueling the sector’s growth.But why do so many hardware startups fail? This article explores key factors contributing to the failure of numerous hardware startups, supported by data analysis.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1709134952946-1709134952946.png" alt="Hardware hustle chart" class="fr-fic fr-dii"><h2></h2><h3>A Brutal Landscape</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1709134953365-1709134953365.png" alt="Hardware brutal landscape" class="fr-fic fr-dii">Startups, especially those in the hardware sector, often face a path riddled with obstacles that make the journey toward success incredibly arduous. Several factors, such as lack of consumer demand, excessive spending, waning interest after initial crowdfunding, and strategic errors in product development, can often lead to their downfall.Moreover, recent data suggest that lengthy development times and poor product-market fit contribute significantly to their failure, with 42 percent of startups succumbing to protracted development phases and 34 percent failing due to a lack of product-market fit.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1709134953399-1709134953399.png" alt="Pitfalls hardware startups" class="fr-fic fr-dii">The journey from concept to tangible product in the hardware space encompasses numerous stages that include <a href="https://www.macrofab.com/electronics-manufacturing-platform/" target="_blank">design, prototyping, testing, manufacturing, and distribution</a>. Each stage takes time, which is a crucial factor that startups must manage efficiently.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1709134953443-1709134953443.png" alt="Concept to product hardware" class="fr-fic fr-dii">The process is particularly challenging when each stage occurs with a different vendor, and there is an extended period of onboarding and downtime between each stage. Prolonged development phases can strain a startup’s limited resources, raising the risk of changing market dynamics or new competitors surfacing while the product is still under development.Insufficient product-market fit is another key reason behind a third of startup failures. This term refers to the extent to which a product meets strong market demand. As hardware startups strive for innovation, they may create products that, despite being technologically advanced, fail to align with end-user needs or wants. Sometimes, they overestimate their target market size or need to understand the subtle nuances of market behavior. This disconnect between the product and its target market can result in weak sales, low customer retention, and, ultimately, the startup’s downfall.Hardware development comes with its inherent challenges, such as the need for considerable upfront investment, long development cycles, and robust manufacturing and distribution processes. Further, hardware startups face the uphill task of designing a product that will break through in markets often dominated by established brands.<h2></h2><h3>The Funding Conundrum</h3>Funding plays a crucial role in a startup’s success or failure. But according to Holly Eve at Forbes, less than one percent of startups <a href="https://www.forbes.com/sites/hollyeve/2020/07/06/venture-capital-is-not-the-funding-reality-of-most-startups-heres-what-is/?sh=3f52e3ef65ea" target="_blank">succeed in securing venture capital</a>, a form of financing that significantly influences their success. Even when startups secure venture capital, the likelihood of becoming a unicorn–or a company valued over $1 billion– is minimal.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1709134953827-1709134953827.png" alt="Hardware funding" class="fr-fic fr-dii">In hardware startups, crowdfunding platforms like Kickstarter and IndieGoGo have emerged as vital tools. They enable entrepreneurs to raise capital for concept designs or early-stage prototypes that might not meet traditional venture capital criteria. Still, the common notion among entrepreneurs that crowdfunding exposure will facilitate securing venture capital often doesn’t match reality, as such transitions are still rare.While crowdfunding can serve as an initial stepping stone for hardware startups by providing both initial funds and visibility, the journey to securing venture capital tends to be more intricate than many entrepreneurs expect. The acquisition of venture capital hinges on several critical factors. Primarily, the product-market fit of the startup’s offering is a fundamental determinant. The product should not only be innovative but also meet substantial market demand, a hurdle that is often a challenging feat for hardware startups.Moreover, crowdfunding can act as a double-edged sword. The early exposure it provides can set high expectations among the public and potential investors. Failure to meet these expectations can erode trust and act as an obstacle to future funding efforts. Furthermore, the high failure rate of crowdfunded projects can fuel skepticism among prospective venture capital investors. This skepticism presents an additional hurdle for startups in their quest to secure venture capital funding.<h2></h2><h3>Gleaning Insights from Failures</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1709134953862-1709134953862.png" alt="Gleaning insights hardware failure" class="fr-fic fr-dii">While failure can be a bitter pill, it often catalyzes future triumphs. It’s worth noting that the founders of unsuccessful startups are 20 percent more likely to prosper in their second venture, underlining the value of reflecting on and learning from previous missteps. Moreover, according to a study by the Harvard Business Review, successful entrepreneurs have an average age of 45, suggesting that experience plays a crucial role in startup success. This statistic further bolsters the argument that resilience, informed by past failures, is critical to a successful enterprise.The ability to weather and learn from setbacks is critical to entrepreneurship. Research from the Kauffman Foundation indicates that the average cost of starting a business from scratch is around $30,000. This underscores the significance of financial backing for a startup to iterate, pivot, and learn from failures. Thus, wealth and capital contribute to a startup’s survival and enable the learning process that can lead to long-term success.<h2></h2><h3>Conclusion</h3><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1709134953796-1709134953796.png" alt="Hardware failure pcb" class="fr-fic fr-dii">The journey of hardware startups is challenging, strewn with many obstacles and high stakes. Yet, precisely this brutal nature makes the sector a fertile ground for innovation, risk-taking, and breakthroughs. The high failure rate among these startups is indicative not of the futility of their endeavors but instead of the severe nature of the obstacles they face. A misstep in product strategy, a misjudgment of market demand, or a miscalculation in the funding process can lead to a startup’s downfall.However, these failures are also rich in insights that can serve as guiding posts for entrepreneurs and investors alike.Despite the challenges, the spirit of entrepreneurship continues to thrive in the hardware sector. Armed with lessons from past failures, founders continually enter the arena, ready to take another shot at success. The resilience and determination to persevere, learn, and bounce back from defeat are fundamental to this process. Additionally, securing sufficient financial backing allows startups the space to make mistakes, learn from them, and emerge stronger.In essence, the narrative of hardware startups is one of relentless pursuit of innovation. It is a testament to the entrepreneurial spirit that continues to push boundaries, challenge norms, and aspire to create products that can make a difference.While the journey may be fraught with failure, each setback lays the groundwork for future successes and contributes to the constant evolution of the sector. As such, the story of hardware startups is as much about failures as it is about wins, as both are intrinsic to the entrepreneurial journey.<h4 id="isPasted">See How MacroFab Helps Startups Develop Faster</h4><a href="https://www.macrofab.com/startups/" target="_blank">HARDWARE STARTUP SOLUTIONS</a><section><h5> </h5></section></section>

Startups in the hardware industry have an uphill battle to build a product that will break through in highly competitive markets. Only half survive beyond five years. 

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