This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
Article #4 of our Industrial IoT revolution series: To deal with the extremities of harsh environments like construction, mining, or agriculture, physical and wireless interconnects need to be engineered for durability.
Article #3 of our Industrial IoT revolution series. Although data is the key in deriving meaningful insights, feature-full connectivity has emerged as a leading need in retrofitting existing manufacturing environments with automation.
Understanding the key differences between the two high-in-demand battery types. This article focuses on Energy density, lifespan, safety, and cost trade-offs for the technical selection of Li-Ion and LiFePO4 batteries.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
Article #4 of our Industrial IoT revolution series: To deal with the extremities of harsh environments like construction, mining, or agriculture, physical and wireless interconnects need to be engineered for durability.
Article #3 of our Industrial IoT revolution series. Although data is the key in deriving meaningful insights, feature-full connectivity has emerged as a leading need in retrofitting existing manufacturing environments with automation.
Article #2 of our Industrial IoT revolution series: The purpose of HVACR, and IAQ systems is to create a comfortable, and secure environment indoors. But to do so, these systems require accurate feedback of the environment variables.
Article #1 of our Industrial IoT Revolution Series: As the power requirements and operating frequencies of electronic components rise, new interconnecting technologies are required to cater to the ever-growing demand.
Engineers at EPFL have developed a method for reading several qubits – the smallest unit of quantum data – at the same time. Their method paves the way to a new generation of even more powerful quantum computers.
People living with disabilities don't want special treatment; they want equal opportunity. The ability to act independently of, and at the same time connect with, others when moving, communicating, learning, working, and socializing.
The semiconductor manufacturing field employs a range of etching techniques to craft intricate patterns and structures on material surfaces, with dry etching and wet etching being primary methods.
Article #7 of our Circuit Protection Series: Designer engineers must incorporate circuit protection early enough in the process of vehicle electronics to avoid last-minute revisions that can delay compliance approvals and potentially compromise circuit performance.
Startram is a concept mass driver that can launch payloads into space without rocket propulsion, instead relying on magnetic levitation (maglev) technology.
Despite specific industries experiencing slowdowns caused by the Covid-19 pandemic, projections in the Bluetooth technology market are optimistic through the remainder of 2021 and beyond.
Silicon wafers are thin slices of highly pure crystalline Silicon, used in the production of integrated circuits. This article delves into the fascinating world of silicon wafers, unraveling their production process, unique properties, and the wide range of applications that make them indispensable.
Puntozero redesigned the cold plate of the power electronics of Dynamis PRC’s electric race car for additive manufacturing. The result was a 25% lighter liquid-cooled heat sink and bioinspired flow guides that increased the heat transfer surface area by 300%.