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The collaborative nature of open source projects brings together people across the world to work towards improving and monitoring our natural resources.
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This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
PCB Trace Width Calculator
Featured
The device could help scientists explore unknown regions of the ocean, track pollution, or monitor the effects of climate change.
Featured
The pace of change in consumer electronics has always been fast which poses its own challenges for manufacturers. Here we take a look at 7 trends that will shape the future of product development and manufacturing in the industry…
Engineers Wiki. Most Asked Questions.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
NTC Thermistor: How It Works, Key Specs, and Circuit Design
By Umar Waseem.
14 minutes read.
SCCR Rating: How to Determine, Raise, and Mark It
By Umar Waseem.
15 minutes read.
What Is a Motor Control Center (MCC)? Components, Types and How It Works
By Umar Waseem.
17 minutes read.
Single Point of Failure: How to Find and Eliminate SPOFs
By Ramsha Jawaid.
26 minutes read.
Spine and Leaf Architecture: Design, Sizing, and Cabling
By Ramsha Jawaid.
24 minutes read.
ORGANIZATIONS. SHAPING THE INDUSTRY.
TAGGED WITH flexible electronics
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Exploring the shift to additive digital printing in modern electronics fabrication.
This article explains the ESP8266 pinout, covering GPIO mapping, boot-strapping pins, safe-to-use pins, flash connections, ADC limits, deep-sleep functions, and NodeMCU and D1 mini pin labels.
Learn how a Hall Effect Current Sensor works, including principles, topologies, specifications, comparisons and engineering applications.
TAGGED WITH microchips
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
Agent part of Cadence's ChipStack software generates Verilog RTL through C++ and high-level synthesis
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Ultra-efficient chip design enables extremely strong cryptography algorithms to run on energy-constrained edge devices.
Latest Posts
The collaborative nature of open source projects brings together people across the world to work towards improving and monitoring our natural resources.
The device could help scientists explore unknown regions of the ocean, track pollution, or monitor the effects of climate change.
The pace of change in consumer electronics has always been fast which poses its own challenges for manufacturers. Here we take a look at 7 trends that will shape the future of product development and manufacturing in the industry…
4 minutes read
Integrated circuit (IC) package types encompass a range of protective enclosures designed to shield semiconductor components from physical damage and corrosion. This article explores the various classifications of IC packages, each tailored to specific requirements and applications.
Into the future, more transport companies may start to integrate wastewater monitoring systems to manage these key facilities effectively. But this opportunity isn’t only limited to transport – any water monitoring capabilities can help reduce waste, and save energy, time and resources.
3 minutes read
The German Aerospace Center (DLR) is researching the infrastructure and railway operational framework conditions, working on new, capacity-increasing concepts for vehicles, operations and infrastructure, as well as innovative methods for maintenance and servicing.
7 minutes read
The ZEUS laser at the University of Michigan has begun its commissioning experiments
4 minutes read
International team develops device for continuous, wireless nitric oxide monitoring
3 minutes read
Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.
Solder flux has a large impact on final product quality. This article reviews how to use flux during soldering and how to decide on the right technology options for your project.
4 minutes read
Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology
2 minutes read
Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
In the Providentia++ project, researchers at the Technical University of Munich (TUM) have worked with industry partners to develop a technology to complement the vehicle perspective based on onboard sensor input with a bird’s-eye view of traffic conditions. This improves road safety – also for autonomous driving.
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.
5 minutes read
Wafer thinning is a part of the semiconductor manufacturing process. It is essentially grinding off the backside of the wafers to control their thickness and is useful for the production of ultra-thin wafers. These flattened wafers are used to effect stacked and high-density packaging in compact or microelectronic devices. This article discusses the meaning of wafer thinning, along with its various techniques and significance.
