The Guide to Understanding the Technologies Defining the Next Phase of Edge AI
PCB Trace Width Calculator
Glossary of Semiconductors Terms
This article explores the key differences between active and passive filters, detailing their transfer functions, frequency responses, components, circuit configurations, stability, design challenges, approximation methods, and CAD tools for filter simulation and optimization.
Circuit card assemblies (CCA) give birth to a complete printed circuit board (PCB) after assembling every component. A printed circuit board has no electrical components and needs to go through a manufacturing process called circuit card assemblies which are the complete board assembly.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
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Semiconductors
Nordic Semiconductor is a fabless semiconductor company specializing in wireless technology that powers the IoT.
181 Posts
This article provides a technical overview of the brushless vs brushed motor paradigm, equipping design engineers with the analytical framework necessary to make informed, application-specific decisions.
Learn how USB 3.2 Gen 2x1 delivers 10Gbps high-speed performance with simpler single-lane routing, lower power consumption, and easier PCB design for embedded, FPGA, and industrial systems.
Explore how first-principles engineering and human judgment shape reliable high-voltage IC design, from yield thinking to long-term system lifetime and root-cause discipline.
How data-driven material decisions keep production moving amid supply chain disruption and material scarcity
This in depth article explores the theoretical foundation and practical considerations of connecting inductor in series for engineers and electronics students. Learn how series inductance works, why it increases total inductance, how mutual coupling affects it and how to design effective filters.
Learn how Altium Agile Teams enables secure hardware collaboration with centralized identity, role-based access, and full traceability — so teams can scale without sacrificing speed or control.
OMRONs XW4M/XW4N push-in terminal block PCB connectors are designed to simplify wiring, inspection, and maintenance while supporting consistent performance in industrial systems.
Soldering wires is the process of joining electrical conductors using a melted filler metal to create strong, low-resistance connections. This guide explains tools, techniques, heat control, materials, common defects, and engineering best practices for reliable electrical connections.
This article explores the key differences between active and passive filters, detailing their transfer functions, frequency responses, components, circuit configurations, stability, design challenges, approximation methods, and CAD tools for filter simulation and optimization.
Circuit card assemblies (CCA) give birth to a complete printed circuit board (PCB) after assembling every component. A printed circuit board has no electrical components and needs to go through a manufacturing process called circuit card assemblies which are the complete board assembly.
A short primer on how to choose PCBA surface finishes
4 minutes read
Carnegie Mellon University collaborators pioneer the CMU Array—a customizable, 3D nano-printed, ultra-high-density microelectrode array platform for next-generation brain-computer interfaces. This technology can transform the way doctors are able to treat neurological disorders.
3 minutes read
Article #5 Electronics Innovation Series. IoT security is a shared responsibility between chip manufacturers, hardware designers, and the consumer.
Article #2 of the "Why Edge?" Series. Edge AI increases battery life, reduces latency, and in many cases, eliminates the need for cloud communication, making wearable devices more user-friendly and secure.
For the length of human history, technology has played an important role in preventing theft. Before car keys, Henry Ford had to chain his car to a lamppost to avoid anyone with the strength to turn a physical crank from stealing it.
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Printed batteries offer thinness and flexibility, enabling new applications, but their production is deceivingly complex. Gunter Hübner from Stuttgart Media University offered some insights at the e-Swiss conference last week.
Experimenting in the world of Flexible Hybrid Electronics (FHE) comes with a variety of hurdles. Printing technologies are vastly different in terms of materials compatibility and have pros and cons that make them suitable for particular applications. Choosing materials that match the printing technology you intend to use is the most important decision you’re going to make. But what if one could print, digitally, using any paste and ink on any substrate? Read more
3 minutes read
Researchers have designed smart, colour-controllable white light devices from quantum dots, tiny semiconductors just a few billionths of a metre in size, which are more efficient and have better colour saturation than standard LEDs, and can dynamically reproduce daylight conditions in a single light
The challenges of EV charging must be addressed quickly to ensure the rapid adoption of electric transportation.
A system's manufacturability depends on design decisions made early in the project's lifecycle.
4 minutes read
The device could help scientists explore unknown regions of the ocean, track pollution, or monitor the effects of climate change.
The pace of change in consumer electronics has always been fast which poses its own challenges for manufacturers. Here we take a look at 7 trends that will shape the future of product development and manufacturing in the industry…
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Integrated circuit (IC) package types encompass a range of protective enclosures designed to shield semiconductor components from physical damage and corrosion. This article explores the various classifications of IC packages, each tailored to specific requirements and applications.
