Article #7 of Innovations in Electric and Autonomous Vehicles Series: As electric vehicles (EVs) gain traction, challenges surrounding noise cancellation are dramatically changing, and the desire to reduce the weight of EVs is driving engineers toward active noise-cancellation solutions.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
A PCB design can be electrically correct, pass every design rule check and perform exactly as expected on an engineer's screen - and still cause significant problems when it reaches manufacturing.
A semiconductor is a material whose electrical conductivity falls between that of a conductor and an insulator and can be controlled by temperature, light, and impurities. This article covers semiconductor materials, doping, diodes, transistors, and integrated circuits.
Article #7 of Innovations in Electric and Autonomous Vehicles Series: As electric vehicles (EVs) gain traction, challenges surrounding noise cancellation are dramatically changing, and the desire to reduce the weight of EVs is driving engineers toward active noise-cancellation solutions.
Articulated robots are highly versatile and efficient robots that have the ability to mimic human arm movements for various industrial and commercial applications.
Wafer Probing is an electrical testing process conducted on semiconductor wafers after the integrated circuits are applied to the wafers. This is an essential step in the semiconductor manufacturing process that helps to determine the functionality of wafers and overall production quality. This article explores the process, importance, types, and applications of wafer probing.
Leaking fluids can wreak havoc if not detected at an early stage. This article showcases ultra-thin and flexible leak-detection solutions that can stick to any surface and immediately alert users in case of a leakage.
Thin film deposition is a process used to create thin film coatings on different materials. Thin films can consist of metal, semiconductors, and dielectrics, providing them with different properties. These properties translate to benefits such as electrical insulation, optical transmission, and corrosion resistance, that can be used to improve substrate performance. This article explores the processes of thin film deposition, along with its types, parameters, benefits, drawbacks, and applications.
Article #5 of Innovations in Electric and Autonomous Vehicles Series: EV batteries and chargers evolve, and as traditional auto sales dropped, EV sales continued to rise over the past years. What will this mean for investors and consumers? Where is the tech taking us and what stands in the way?
Single-board computers (SBCs) are the brain of an EV charger. With the EV charging market taking off, SBCs are at the centre of the electrification movement. But what are the challenges that lay ahead? And what do cutting-edge SBCs bring forth?