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The ZEUS laser at the University of Michigan has begun its commissioning experiments
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The Guide to Understanding the Technologies Defining the Next Phase of Edge AI
PCB Trace Width Calculator
Glossary of Semiconductors Terms
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Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.
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A short guide to understanding the edge neural network design.
Engineers Wiki. Most Asked Questions.
Comprehensive Guide
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
Brushless vs Brushed Motor: Engineering Trade-offs and Design Decisions
By Umar Waseem.
14 minutes read.
How to Open SLDPRT Files: A Practical Guide
By Ramsha Jawaid.
16 minutes read.
ORGANIZATIONS. SHAPING THE INDUSTRY.
Nordic Semiconductor
Semiconductors
Nordic Semiconductor is a fabless semiconductor company specializing in wireless technology that powers the IoT.
181 Posts
TAGGED WITH flexible electronics
This article provides a technical overview of the brushless vs brushed motor paradigm, equipping design engineers with the analytical framework necessary to make informed, application-specific decisions.
Learn how USB 3.2 Gen 2x1 delivers 10Gbps high-speed performance with simpler single-lane routing, lower power consumption, and easier PCB design for embedded, FPGA, and industrial systems.
Explore how first-principles engineering and human judgment shape reliable high-voltage IC design, from yield thinking to long-term system lifetime and root-cause discipline.
How data-driven material decisions keep production moving amid supply chain disruption and material scarcity
TAGGED WITH pcb
This in depth article explores the theoretical foundation and practical considerations of connecting inductor in series for engineers and electronics students. Learn how series inductance works, why it increases total inductance, how mutual coupling affects it and how to design effective filters.
Learn how Altium Agile Teams enables secure hardware collaboration with centralized identity, role-based access, and full traceability — so teams can scale without sacrificing speed or control.
OMRONs XW4M/XW4N push-in terminal block PCB connectors are designed to simplify wiring, inspection, and maintenance while supporting consistent performance in industrial systems.
Soldering wires is the process of joining electrical conductors using a melted filler metal to create strong, low-resistance connections. This guide explains tools, techniques, heat control, materials, common defects, and engineering best practices for reliable electrical connections.
Latest Posts
The ZEUS laser at the University of Michigan has begun its commissioning experiments
4 minutes read
Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.
A short guide to understanding the edge neural network design.
Solder flux has a large impact on final product quality. This article reviews how to use flux during soldering and how to decide on the right technology options for your project.
4 minutes read
Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology
2 minutes read
Proven benchmarks provide a structured method for comparing ML/DL products and services.
Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.
5 minutes read
Your new PCBA project design needs to pass production validation testing (PVT) to prove it's ready for production. The planning you did for cost, quality assurance, quality control, and scalability now positions your project for success.
3 minutes read
Wafer thinning is a part of the semiconductor manufacturing process. It is essentially grinding off the backside of the wafers to control their thickness and is useful for the production of ultra-thin wafers. These flattened wafers are used to effect stacked and high-density packaging in compact or microelectronic devices. This article discusses the meaning of wafer thinning, along with its various techniques and significance.
Cost of production has been a major barrier despite the fact that Cu raw material prices are far lower than Ag. This is because this large raw material cost difference does not often get translated into equally large nanoparticle dispersion or ink costs. Can this be overcome?
In general, silicone based conductive pastes are rare and the versions with AgCl fillers- needed for many medical wearable applications- are even rarer!
Warp knitting is an excellent candidate. It combines weaving and weft knitting, allowing the warp knitted fabrics to have the stability of woven fabrics and the elasticity of knitted ones.
Conformal EMI shielding is a megatrend on its way to become ubiquitous in electronics. The incumbent process is based on sputtering a tri-layer structure consisting of SUS on the EMC of the package. In these slides, you can see performance analysis and detailed cost analysis/projections.
2 minutes read
The progress of screen printing towards fine line printing has been incredible going from 100 µm features before 2010 to 70 µm to 2015 to 40 µm in 2018 and now pushing - in development- towards 20 µm and less. In parallel, the wet thickness of the printed line have gone down from 12um or so in 2018 to now just 4um.