Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
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Semiconductors
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ORGANIZATIONS. SHAPING THE INDUSTRY.
Nordic Semiconductor
Semiconductors
Nordic Semiconductor is a fabless semiconductor company specializing in wireless technology that powers the IoT.
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Murata is a global solution provider and the market leader in the design, m...
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TAGGED WITH flexible electronics
This article explores the basics of SR Latch, covering its fundamental principles and implementation using NOR and NAND gates, metastability and race conditions, illustration of gated variants and real world applications such as switch debouncing and integrated latch ICs.
Protect sensitive electronics by understanding the current limiting resistor, learning how to calculate appropriate values, and applying them in LEDs, transistors, microcontroller inputs and other circuits.
This guide explains how potentiometer pins interact with mechanical rotation, resistive tracks, and load conditions across various circuit configurations. It provides clarity for both low-power electronic designs and high-precision embedded systems.
This technical article explains the theory behind potentiometer schematics. It shows how to implement mechanical and digital potentiometers in practical circuits, tailored for engineers, and students.
TAGGED WITH pcb
Source transformation is the method of converting a voltage source with series resistance into an equivalent current source with parallel resistance (and vice versa). This guide explains the theory, math, circuit examples, and practical applications for modern digital and hardware engineers.
Resistors are the quiet regulators of electronic circuits. They shape current, set voltages, bias transistors, protect components, and stabilize signals. This article breaks down the physics of resistance, explores modern resistor technologies, and offers practical guidance.
Many beginners may be confused about the Solder Mask Layer and Paste Mask Layer because they share some similarities. In this article, we will introduce the differences between solder masks and paste masks, enabling beginners to gain a better understanding.
Ground is the reference point that makes voltage meaningful and the return path that allows current to flow. This article explains what is ground in a circuit, discusses different types of grounds, and shows how to implement effective grounding strategies
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Experimenting in the world of Flexible Hybrid Electronics (FHE) comes with a variety of hurdles. Printing technologies are vastly different in terms of materials compatibility and have pros and cons that make them suitable for particular applications. Choosing materials that match the printing technology you intend to use is the most important decision you’re going to make. But what if one could print, digitally, using any paste and ink on any substrate? Read more
3 minutes read
Researchers have designed smart, colour-controllable white light devices from quantum dots, tiny semiconductors just a few billionths of a metre in size, which are more efficient and have better colour saturation than standard LEDs, and can dynamically reproduce daylight conditions in a single light
The challenges of EV charging must be addressed quickly to ensure the rapid adoption of electric transportation.
A system's manufacturability depends on design decisions made early in the project's lifecycle.
4 minutes read
The device could help scientists explore unknown regions of the ocean, track pollution, or monitor the effects of climate change.
The pace of change in consumer electronics has always been fast which poses its own challenges for manufacturers. Here we take a look at 7 trends that will shape the future of product development and manufacturing in the industry…
4 minutes read
Integrated circuit (IC) package types encompass a range of protective enclosures designed to shield semiconductor components from physical damage and corrosion. This article explores the various classifications of IC packages, each tailored to specific requirements and applications.
The ZEUS laser at the University of Michigan has begun its commissioning experiments
4 minutes read
Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.
A short guide to understanding the edge neural network design.
Solder flux has a large impact on final product quality. This article reviews how to use flux during soldering and how to decide on the right technology options for your project.
4 minutes read
Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology
2 minutes read
Proven benchmarks provide a structured method for comparing ML/DL products and services.
Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.
5 minutes read
