Vias go through two or more layers of PCBs to form an electrical connection. Making them right under the component’s pad saves space, reduces track inductance and simplifies design.
First, the general specifics and commonly used kinds of reflow soldering processes are discussed. Subsequently the focus is on vapor phase soldering and its properties. The process itself is explained clearly.
The best designs must consider all available opportunities to reduce costs at the outset. We give some common sense guidelines that can make a difference in your bottom line.