Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
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Semiconductors
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Warp knitting is an excellent candidate. It combines weaving and weft knitting, allowing the warp knitted fabrics to have the stability of woven fabrics and the elasticity of knitted ones.
Conformal EMI shielding is a megatrend on its way to become ubiquitous in electronics. The incumbent process is based on sputtering a tri-layer structure consisting of SUS on the EMC of the package. In these slides, you can see performance analysis and detailed cost analysis/projections.
2 minutes read
The progress of screen printing towards fine line printing has been incredible going from 100 µm features before 2010 to 70 µm to 2015 to 40 µm in 2018 and now pushing - in development- towards 20 µm and less. In parallel, the wet thickness of the printed line have gone down from 12um or so in 2018 to now just 4um.
As microLEDs inevitably shrink in size, the micro-bumping requirements for the microLED dies becomes more challenging. Direct wafer-based printing based on gravure offset techniques offers a promising solution in this regard. Indeed, this is another field where printed electronics can play a role.
The three themes are closely linked since QDs can be digitally printed as color conversation materials atop blue microLEDs to enable wide color gamut RGB uLED displays without requiring a separate transfer step for each color.. This is an important technology as it simplifies the manufacturing step for microLED and thus removing a major hinderence.
The new approach moves energy efficiently and could reduce energy losses converting light into electricity.
3 minutes read
At the DVT stage, your design is not yet ready for manufacturing. All certifications, qualifications, and specification requirements get tested now.
3 minutes read
PCB layers are the copper layers within a printed circuit board, laminated between or onto layers of conductive material. These layers are stacked to enhance the functionality of electronic devices. This article explores the concept of PCB layering, the various types of layers, and their benefits.
In this article, we look at how Super Low power Wi-Fi and Bluetooth LE enable smart locks to be more agile and reliable by demonstrating these features with a case study from Renesas.
The EVT Stage implements the design in its form, fit, and function to better inform stakeholders of your production intent. Don't rush this important milestone.
3 minutes read
Flexible electronics have enabled the design of sensors, actuators, microfluidics and electronics on flexible, conformal and/or stretchable sublayers for wearable, implantable or ingestible applications.
Article #4 Electronics Innovation Series. Alternative SBC’s and customer-orientated manufacturing will ease supply chain conditions.
5 minutes read
Article #3 of the Enabling IoT Series. This article looks at how Time of Flight (ToF) sensors are used for this purpose and are changing the way we can interact with VR, and other video technologies.
Canadian researchers have discovered that they can stick hydrogel plasters to the skin very effectively using ultrasound. Outi Supponen has now explained the underlying mechanism: imploding bubbles that form within the adhesive located between the plaster and the skin anchor the one on the other.
2 minutes read
Open and honest communication is crucial to a successful design. Product and engineering decision-makers need to work in sync.
4 minutes read
