Electronic shelf labels (ESL) are connected, low-power ‘e-paper’ display devices that can replace traditional paper labels and can display text, numbers, icons, lines, barcodes and pictures. They enable retailers to automatically update individual shelf price labels from a central point across multiple stores and branches—or in certain geographic locations—at the touch of a button.
RISC-V, the groundbreaking open and customizable instruction set architecture (ISA), is transforming the world of microprocessors. Its exceptional flexibility empowers developers to craft processors precisely suited for their needs, setting it apart as the go-to choice for a diverse range of devices, from energy-efficient IoT gadgets to powerful servers.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
This article provides a technical overview of the brushless vs brushed motor paradigm, equipping design engineers with the analytical framework necessary to make informed, application-specific decisions.
This article explains the IPC-A-610 standard for electronic assemblies, including solder joints, inspection criteria, product classes, and quality requirements for reliable PCB manufacturing and high-performance electronics.
A complete technical guide to buck converters covering operating principles, CCM and DCM, synchronous vs. asynchronous designs, component selection, control methods, PCB layout, and common troubleshooting issues.
This in depth article explores the theoretical foundation and practical considerations of connecting inductor in series for engineers and electronics students. Learn how series inductance works, why it increases total inductance, how mutual coupling affects it and how to design effective filters.
Learn how Altium Agile Teams enables secure hardware collaboration with centralized identity, role-based access, and full traceability — so teams can scale without sacrificing speed or control.
Electronic shelf labels (ESL) are connected, low-power ‘e-paper’ display devices that can replace traditional paper labels and can display text, numbers, icons, lines, barcodes and pictures. They enable retailers to automatically update individual shelf price labels from a central point across multiple stores and branches—or in certain geographic locations—at the touch of a button.
RISC-V, the groundbreaking open and customizable instruction set architecture (ISA), is transforming the world of microprocessors. Its exceptional flexibility empowers developers to craft processors precisely suited for their needs, setting it apart as the go-to choice for a diverse range of devices, from energy-efficient IoT gadgets to powerful servers.
In response to the OKDo Engineering Challenge, Marcel Ochsendorf and Sebastian Kindorf developed a medical device that uses thermal imaging for remote patient monitoring. Their innovative project won the Wevolver Community Vote.
Heaters are one of the most successful applications of printed electronics. At first they seem deceptively simple, yet their successful realization is in fact an art relying on the interplay of all the elements from the right material selection to right design, right printing, etc. Learn how here.
Advanced packaging of semiconductor-based sensors - specially on flexible substrates- brings very specific interconnection requirements. These often are related to a very narrow pitch of the interconnections or the fragility of the sensor. Learn how inkjet printing solves the issues
In this article, we will discuss the different aspects of an effective ink delivery system. We will focus on a recirculating inkjet system as they are highly in demand in industry, especially where functional fluids come into play.
A growing desire for continuous data collection, real-time information, and connectivity has resulted in increased demand for electronic functionalities that are fully integrated in everyday objects. Consumer electronics, healthcare, wearable electronics, IoT, and smart packaging ...
FR4, often called "fiberglass," quietly underpins our daily lives. Think about your electronics, from smartphones to car and appliance circuit boards. FR4 is the unsung hero behind the scenes, making them work smoothly and power our modern world.
Conversational AI enables machines to respond in a human-like manner. These intelligent systems are designed to understand intent and context, remember user preferences, and engage in meaningful conversations.
FPGAs are reconfigurable hardware used for parallel, high-speed processing, while microcontrollers are fixed-architecture chips designed for sequential, control-oriented tasks. FPGAs offer flexibility and performance MCUs provide low power, ease of use, and cost-efficiency.
The fusion of 2D semiconductors and ferroelectric materials could lead to joint digital and analog information processing, with significant improvement in energy consumption, electronic device performance, and lead to novel functionalities.