Status and evolution of intelligent skin patches, enabled by flexible hybrid electronics, going from a single wired sensors to complex wireless multi-function capability. Learn about trends, archirectures and challenges from a manufacturer's point of view to understand how to design for production.
Status and evolution of intelligent skin patches, enabled by flexible hybrid electronics, going from a single wired sensors to complex wireless multi-function capability. Learn about trends, archirectures and challenges from a manufacturer's point of view to understand how to design for production.
Article 3 of Bringing Intelligence to the Edge Series: Balancing the critical metrics of accuracy, power consumption, latency, and memory requirements is key to unlocking the potential of Tiny Machine Learning (TinyML) in low-power microcontrollers and edge computing.
Article 2 of Bringing Intelligence to the Edge Series: Advancements in AI and embedded vision technologies are revolutionizing various industries, enabling real-time decision-making, enhancing security, and facilitating automation in various applications.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
This article provides a detailed examination of logic gate symbols, truth tables, and transistor level implementations, with practical insights for digital design and hardware professionals.
This article covers every aspect of the Arduino UNO pinout, presenting a technical, pin-by-pin explanation to help readers confidently design, analyze, and implement Arduino-based systems.
This article explores how to read resistor color code correctly, covering the fundamental theory, relevant standards, practical examples, and design-oriented insights, providing practical tips for efficient and accurate circuit prototyping.
Miniature RFID tags by Murata enable seamless system integration with durable, reprogrammable identification — delivering reliable tracking, authentication & traceability beyond the limits of traditional barcodes.
Learn why growing hardware teams slow down as they scale, and how aligned workflows, parallel collaboration, and real-time design visibility restore speed and momentum.
This article explores how to read resistor color code correctly, covering the fundamental theory, relevant standards, practical examples, and design-oriented insights, providing practical tips for efficient and accurate circuit prototyping.
Learn how to select the right Murata MLCCs for modern power architectures, balancing low ESL, stable capacitance, and smart placement to ensure power integrity in high-speed, high-current systems.
Status and evolution of intelligent skin patches, enabled by flexible hybrid electronics, going from a single wired sensors to complex wireless multi-function capability. Learn about trends, archirectures and challenges from a manufacturer's point of view to understand how to design for production.
Article 3 of Bringing Intelligence to the Edge Series: Balancing the critical metrics of accuracy, power consumption, latency, and memory requirements is key to unlocking the potential of Tiny Machine Learning (TinyML) in low-power microcontrollers and edge computing.
Article 2 of Bringing Intelligence to the Edge Series: Advancements in AI and embedded vision technologies are revolutionizing various industries, enabling real-time decision-making, enhancing security, and facilitating automation in various applications.
Article 1 of Bringing Intelligence to the Edge Series: With the introduction of AI, IoT devices can become more intelligent and less reliant on external systems— but not without trade-offs in performance and cost. Understanding how to make that decision is key.
Introducing the Bringing Intelligence to the Edge Series: Exploring how Artificial Intelligence is moving to embedded systems, transforming technology across various applications.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
The Inflation Reduction Act directs nearly $400 billion to clean energy incentives including $47 billion allocated for manufacturing. This article concentrates on the advantages offered to businesses.
This article provides a detailed guide to System in Package technology, its advantages and challenges, key components, design, and manufacturing process.
Wafer backgrinding is a crucial step in semiconductor manufacturing, as it prepares the wafer for further processing and packaging. The procedure comprises the thinning of silicon wafers by scraping out material from the backside, which is crucial for enhancing the functionality and dependability of semiconductor devices. This article examines the wafer backgrinding procedure, its difficulties, and the significance of quality control in ensuring the production of high-quality semiconductor devices.
Healthcare is undergoing a transformative shift with the rise of stick-to-skin wearable monitoring devices. These data-collecting marvels, such as continuous glucose or cardiac monitoring devices, offer convenience & real-time insights.This article explores capabilities, applications & market trends