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Integrated circuit (IC) package types encompass a range of protective enclosures designed to shield semiconductor components from physical damage and corrosion. This article explores the various classifications of IC packages, each tailored to specific requirements and applications.

IC Package Types: A Comprehensive Guide

Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.

Chips and Wafers: What's the Difference?

Solder flux has a large impact on final product quality. This article reviews how to use flux during soldering and how to decide on the right technology options for your project.

A Practical Guide to Solder Flux

Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology

The advantages and functioning of PTC heaters

Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.

Reliable, Scalable, Anisotropic Interconnect Solution for Wearable Electronics

Your new PCBA project design needs to pass production validation testing (PVT) to prove it's ready for production. The planning you did for cost, quality assurance, quality control, and scalability now positions your project for success.

Fab Insights: PVT in PCBA Product Development

Wafer thinning is a part of the semiconductor manufacturing process. It is essentially grinding off the backside of the wafers to control their thickness and is useful for the production of ultra-thin wafers. These flattened wafers are used to effect stacked and high-density packaging in compact or microelectronic devices. This article discusses the meaning of wafer thinning, along with its various techniques and significance.

Wafer Thinning: Investigating an essential part of semiconductor fabrication

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