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Status and evolution of intelligent skin patches, enabled by flexible hybrid electronics, going from a single wired sensors to complex wireless multi-function capability. Learn about trends, archirectures and challenges from a manufacturer's point of view to understand how to design for production.

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Glossary of Semiconductors Terms

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Status and evolution of intelligent skin patches, enabled by flexible hybrid electronics, going from a single wired sensors to complex wireless multi-function capability. Learn about trends, archirectures and challenges from a manufacturer's point of view to understand how to design for production.

Smart Skin Patches and Noninvasive Medical Sensing
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Article 3 of Bringing Intelligence to the Edge Series: Balancing the critical metrics of accuracy, power consumption, latency, and memory requirements is key to unlocking the potential of Tiny Machine Learning (TinyML) in low-power microcontrollers and edge computing.

Four Metrics You Must Consider When Developing TinyML Systems
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Article 2 of Bringing Intelligence to the Edge Series: Advancements in AI and embedded vision technologies are revolutionizing various industries, enabling real-time decision-making, enhancing security, and facilitating automation in various applications.

Revolution of Endpoint AI in Embedded Vision Applications

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ORGANIZATIONS.

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Nordic Semiconductor

Semiconductors

Nordic Semiconductor is a fabless semiconductor company specializing in wireless technology that powers the IoT.

181 Posts

MacroFab

EMS manufacturing

A better way to build electronics through a redefined experience, innovativ...

79 Posts

TechBlick

Electronics

TechBlick is a year round platform for onsite and online conferences, class...

65 Posts

OKdo

Appliances, Electrical, and Electronics Manufacturing

We’re OKdo, the global technology business from Electrocomponents Group. We...

37 Posts

Murata Electronics

Electrical and Electronics Manufacturing

Join the Innovators in Electronics.

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Miniature RFID tags by Murata enable seamless system integration with durable, reprogrammable identification — delivering reliable tracking, authentication & traceability beyond the limits of traditional barcodes.

How RFID Tags by Murata Boost System Integration

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Status and evolution of intelligent skin patches, enabled by flexible hybrid electronics, going from a single wired sensors to complex wireless multi-function capability. Learn about trends, archirectures and challenges from a manufacturer's point of view to understand how to design for production.

Smart Skin Patches and Noninvasive Medical Sensing

Article 3 of Bringing Intelligence to the Edge Series: Balancing the critical metrics of accuracy, power consumption, latency, and memory requirements is key to unlocking the potential of Tiny Machine Learning (TinyML) in low-power microcontrollers and edge computing.

Four Metrics You Must Consider When Developing TinyML Systems

Article 2 of Bringing Intelligence to the Edge Series: Advancements in AI and embedded vision technologies are revolutionizing various industries, enabling real-time decision-making, enhancing security, and facilitating automation in various applications.

Revolution of Endpoint AI in Embedded Vision Applications

Introducing the Bringing Intelligence to the Edge Series: Exploring how Artificial Intelligence is moving to embedded systems, transforming technology across various applications.

Bringing Intelligence to the Edge Series

Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.

What is a Semiconductor? A Comprehensive Guide to Engineering Principles and Applications

Wafer backgrinding is a crucial step in semiconductor manufacturing, as it prepares the wafer for further processing and packaging. The procedure comprises the thinning of silicon wafers by scraping out material from the backside, which is crucial for enhancing the functionality and dependability of semiconductor devices. This article examines the wafer backgrinding procedure, its difficulties, and the significance of quality control in ensuring the production of high-quality semiconductor devices.

Wafer Backgrinding: An In-Depth Guide to Semiconductor Manufacturing