The Guide to Understanding the Technologies Defining the Next Phase of Edge AI
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Glossary of Semiconductors Terms
OSAT (Outsourced Semiconductor Assembly and Test) firms package, assemble, and test chips for fabless companies and foundries. As chip complexity rises, they boost efficiency, lower costs, and speed market entry for AI, IoT, and HPC. This article reviews OSAT fundamentals, players, and trends.
Flexible hybrid electronics (FHE) enable bendable, stretchable devices for healthcare, consumer tech, and automotive. Explore how electronics manufacturers are leveraging FHE to meet new requirements across industries.
Advanced PCBs use features like microvias and fine-line traces to achieve ultra-high wiring density that leads to miniaturization and improved device performance
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
14 minutes read.
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Semiconductors
Nordic Semiconductor is a fabless semiconductor company specializing in wireless technology that powers the IoT.
181 Posts
This article provides a technical overview of the brushless vs brushed motor paradigm, equipping design engineers with the analytical framework necessary to make informed, application-specific decisions.
Learn how USB 3.2 Gen 2x1 delivers 10Gbps high-speed performance with simpler single-lane routing, lower power consumption, and easier PCB design for embedded, FPGA, and industrial systems.
Explore how first-principles engineering and human judgment shape reliable high-voltage IC design, from yield thinking to long-term system lifetime and root-cause discipline.
How data-driven material decisions keep production moving amid supply chain disruption and material scarcity
This in depth article explores the theoretical foundation and practical considerations of connecting inductor in series for engineers and electronics students. Learn how series inductance works, why it increases total inductance, how mutual coupling affects it and how to design effective filters.
Learn how Altium Agile Teams enables secure hardware collaboration with centralized identity, role-based access, and full traceability — so teams can scale without sacrificing speed or control.
OMRONs XW4M/XW4N push-in terminal block PCB connectors are designed to simplify wiring, inspection, and maintenance while supporting consistent performance in industrial systems.
Soldering wires is the process of joining electrical conductors using a melted filler metal to create strong, low-resistance connections. This guide explains tools, techniques, heat control, materials, common defects, and engineering best practices for reliable electrical connections.
OSAT (Outsourced Semiconductor Assembly and Test) firms package, assemble, and test chips for fabless companies and foundries. As chip complexity rises, they boost efficiency, lower costs, and speed market entry for AI, IoT, and HPC. This article reviews OSAT fundamentals, players, and trends.
Flexible hybrid electronics (FHE) enable bendable, stretchable devices for healthcare, consumer tech, and automotive. Explore how electronics manufacturers are leveraging FHE to meet new requirements across industries.
4 minutes read
Advanced PCBs use features like microvias and fine-line traces to achieve ultra-high wiring density that leads to miniaturization and improved device performance
Nanoinks and nanopastes are composed of nanoparticles suspended in a solution or paste. These materials can be printed or applied to surfaces with extreme precision, making them ideal for electronic manufacturing.
High-Bandwidth Memory (HBM) is a 3D-stacked DRAM designed for ultra-high bandwidth and efficiency. Used in GPUs, AI, and HPC, it tackles memory bottlenecks by stacking dies vertically near processors. This article explores its evolution, architecture, and impact on modern computing.
Discover how NOVA’s Smart Dispenser module unlocks consistent and high-precision trace printing for a range of ink viscosities.
Researchers developed a scalable, low-cost device that can generate high-power terahertz waves on a chip, without bulky silicon lenses.
The future of hardware engineering is being redefined by automation, Git-powered version control, and CI/CD integration. With tools like AllSpice enabling real-time collaboration, development cycles are becoming faster, smarter, and more seamless—pushing the limits of innovation like never before.
CAD file types are fundamental to modern engineering workflows. This guide explores different CAD file formats, explaining their uses, advantages, and how to choose the right format.
The guide to understanding the current state of the art in hardware & software for Edge AI.
Many of the long-held beliefs surrounding date codes have been empirically proven erroneous.
While rooted in historical necessity, date codes are being rendered antiquated by modern practices and standards.
The Importance of Traceability in Semiconductor Reliability and Supply Chain Resilience
Designing a Wi-Fi front end module using a wireless SoC based on the new Wi-Fi standards can be complex and costly, so choosing a pre-certified module is the most straightforward way to get to market quickly.
As the demand for smarter, faster, and more efficient electronic devices grows, the development of advanced circuits is becoming central to the evolution of next-generation technologies.
