This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
A unique new approach of printing functional materials with unparallel precision and repeatability. Technology called Ultra-Precise Deposition (UPD) is a nanodispensing method capable to print high density and high viscous materials with the resolution down to 1 µm in feature size and with high ratio of width to height after single pass. For this method material extrusion is controlled by a pressure, which means it is not supported with high electric field. Thanks to this there are no limitation if the substrate is conductive or dielectric.
Human activity, from climate change, pollution, and habitat destruction, to poaching, territorial conflict, and trophy hunting, has seen the IUCN’s list of endangered species balloon to more than 147,000 in recent years, with 41,000 species threatened with extinction.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
A unique new approach of printing functional materials with unparallel precision and repeatability. Technology called Ultra-Precise Deposition (UPD) is a nanodispensing method capable to print high density and high viscous materials with the resolution down to 1 µm in feature size and with high ratio of width to height after single pass. For this method material extrusion is controlled by a pressure, which means it is not supported with high electric field. Thanks to this there are no limitation if the substrate is conductive or dielectric.
Human activity, from climate change, pollution, and habitat destruction, to poaching, territorial conflict, and trophy hunting, has seen the IUCN’s list of endangered species balloon to more than 147,000 in recent years, with 41,000 species threatened with extinction.
PCB traces are fundamental components in circuit design, serving as the pathways for electrical signals. This article examines the advancements, applications, and challenges of PCB trace technology. Discover insights into optimizing designs and overcoming common obstacles in PCB trace implementation.
4 ways to improve part design through customisation, material considerations, iterative prototyping with multi-cavity tooling, and the use of digital manufacturing resources
Article #1 of Power Management for Tomorrow’s Innovations Series: Optimizing the power converter and battery management system designs can solve the challenges associated with present-gen electric vehicles like short traveling ranges and high costs.
Using Artificial Intelligence (AI) to replace optical and mechanical components, researchers have designed a tiny spectrometer that breaks all current resolution records.
Bringing a product to market late has a real and negative impact on profits and brand reputation. In this blog, we go through the types of documentation your project requires and ways to streamline processes.
Introducing the Power Management for Tomorrow’s Innovations Series: A new series featuring articles, case studies, and application guides explaining how product designers can build efficient power supplies for various applications.
Article #4 of the Enabling IoT Series. Industrial enterprises are moving to a new approach to asset management, namely predictive maintenance by leveraging powerful new sensors and data.
This article delves into the core variations between PMOS and NMOS, exploring their fundamentals, structural differences, operating principles, and practical applications.
Article #8 of Power Management for Tomorrow’s Innovations Series: Power electronics converters with an efficiency of up to 95% and very low quiescent current can make the Internet of Things devices last for months together.
Article #7 of Power Management for Tomorrow’s Innovations Series: Power supplies utilized in the medical industry must be compact, reliable, long-lasting, and robust.