Featured
The pace of change in consumer electronics has always been fast which poses its own challenges for manufacturers. Here we take a look at 7 trends that will shape the future of product development and manufacturing in the industry…
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This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
PCB Trace Width Calculator
Featured
Integrated circuit (IC) package types encompass a range of protective enclosures designed to shield semiconductor components from physical damage and corrosion. This article explores the various classifications of IC packages, each tailored to specific requirements and applications.
Featured
Into the future, more transport companies may start to integrate wastewater monitoring systems to manage these key facilities effectively. But this opportunity isn’t only limited to transport – any water monitoring capabilities can help reduce waste, and save energy, time and resources.
Engineers Wiki. Most Asked Questions.
An instrumentation amplifier is a precision differential amplifier designed to amplify small voltage differences. This guide explains the three-op-amp architecture, and how to choose between INA128, AD620, LT1167, and a standard difference amplifier for sensor front-ends.
Crystal vs Oscillator: Choosing the Right Timing Component
By Abiola Ayodele.
18 minutes read.
LiFePO4 Voltage Chart: SOC & Voltages for 3.2V/12V/24V/48V Systems
By Ramsha Jawaid.
14 minutes read.
Full-Wave Rectifier: Working, Types, and Applications
By Ramsha Jawaid.
10 minutes read.
Current Divider Rule: Formula, Derivation, and Worked Example
By Abiola Ayodele.
13 minutes read.
ORGANIZATIONS. SHAPING THE INDUSTRY.
Mouser Electronics
Electronics
Mouser Electronics is a worldwide leading authorized distributor of semiconductors and electronic components.
219 Posts
TAGGED WITH flexible electronics
Learn how a Hall Effect Current Sensor works, including principles, topologies, specifications, comparisons and engineering applications.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
TAGGED WITH microchips
Ultra-efficient chip design enables extremely strong cryptography algorithms to run on energy-constrained edge devices.
Researchers at ETH Zurich have now developed chip technology that enables verification of the authenticity of sensor data, including images or videos.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
Latest Posts
The pace of change in consumer electronics has always been fast which poses its own challenges for manufacturers. Here we take a look at 7 trends that will shape the future of product development and manufacturing in the industry…
4 minutes read
Integrated circuit (IC) package types encompass a range of protective enclosures designed to shield semiconductor components from physical damage and corrosion. This article explores the various classifications of IC packages, each tailored to specific requirements and applications.
Into the future, more transport companies may start to integrate wastewater monitoring systems to manage these key facilities effectively. But this opportunity isn’t only limited to transport – any water monitoring capabilities can help reduce waste, and save energy, time and resources.
3 minutes read
The German Aerospace Center (DLR) is researching the infrastructure and railway operational framework conditions, working on new, capacity-increasing concepts for vehicles, operations and infrastructure, as well as innovative methods for maintenance and servicing.
7 minutes read
The ZEUS laser at the University of Michigan has begun its commissioning experiments
4 minutes read
International team develops device for continuous, wireless nitric oxide monitoring
3 minutes read
Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.
Solder flux has a large impact on final product quality. This article reviews how to use flux during soldering and how to decide on the right technology options for your project.
4 minutes read
Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology
2 minutes read
Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
In the Providentia++ project, researchers at the Technical University of Munich (TUM) have worked with industry partners to develop a technology to complement the vehicle perspective based on onboard sensor input with a bird’s-eye view of traffic conditions. This improves road safety – also for autonomous driving.
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.
5 minutes read
Wafer thinning is a part of the semiconductor manufacturing process. It is essentially grinding off the backside of the wafers to control their thickness and is useful for the production of ultra-thin wafers. These flattened wafers are used to effect stacked and high-density packaging in compact or microelectronic devices. This article discusses the meaning of wafer thinning, along with its various techniques and significance.
Cost of production has been a major barrier despite the fact that Cu raw material prices are far lower than Ag. This is because this large raw material cost difference does not often get translated into equally large nanoparticle dispersion or ink costs. Can this be overcome?
In general, silicone based conductive pastes are rare and the versions with AgCl fillers- needed for many medical wearable applications- are even rarer!
