This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Widely publicised in the media, there are rising concerns both within the agricultural industry and from government policymakers as to whether food production can keep up with unprecedented future demands.
The natural resources around us represent the basis for all human activity on Earth. We use these resources to produce food, clean drinking water, clothes, electrical energy, and everything else we need to survive. But these resources are limited.
The popularity of wearable electronics has induced demand for their parts, including power sources such as triboelectric nanogenerators (TENGs). Such power sources must be both stretchy and high-performance, holding up under various deformation conditions over hours of use.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Widely publicised in the media, there are rising concerns both within the agricultural industry and from government policymakers as to whether food production can keep up with unprecedented future demands.
The natural resources around us represent the basis for all human activity on Earth. We use these resources to produce food, clean drinking water, clothes, electrical energy, and everything else we need to survive. But these resources are limited.
The popularity of wearable electronics has induced demand for their parts, including power sources such as triboelectric nanogenerators (TENGs). Such power sources must be both stretchy and high-performance, holding up under various deformation conditions over hours of use.
PCBA design capabilities are crucial to the future of wearable technology. Wearables and PCBA design are inextricably linked since both have a significant influence on each other. As wearable devices become more popular, electronics designers and manufacturers are designing smaller, denser, and more flexible devices.
NANOWEB® is an extremely thin, transparent, conductive film that consists of an invisible, nanostructured metal mesh fabricated onto a glass or plastic surface. With its unrivaled transparency, conductivity, and flexibility, this patented functional film holds immense potential for both passive and powered use cases, with applications including electromagnetic interference shielding, antennas, 5G/6G redirection systems for elimination of dead spots, and deicing/defogging devices for vehicle windows and eyewear.
Vias are small holes in a PCB that enable electrical connections between different layers of the board. In the context of PCB design, via tenting refers to the process of covering the vias with a protective layer, typically a solder mask or dry film. This protective layer shields the vias from environmental factors, such as dust, moisture, and chemicals, which can lead to corrosion or short circuits. As PCB technology continues to advance, the importance of via tenting in maintaining the performance and reliability of complex, high-density interconnect (HDI) and flexible PCB designs cannot be overstated. This guide explores the art and science of via tenting, shedding light on its significance, techniques, and applications in modern PCB design and manufacturing.
Learn the best methods and industry standards for cleaning circuit boards, removing contaminants like dust, flux residues, and corrosion to ensure optimal performance and longevity!
Capacitors store electrical energy, similar to batteries, and are used in many electronic devices. Due to their voltage-storing nature, handling them can be dangerous. This article outlines various techniques and safety measures to safely discharge capacitors.
A new method for the miniaturisation of biosensors will enable new possibilities for minimally invasive implants. The miniaturised transistors are fabricated on thin, flexible substrates, and amplify biosignals, producing currents more than 200 times larger than analogous alternatives.