This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Engineers at Caltech and the University of Southampton have collaboratively designed an electronics chip integrated with a photonics chip (which uses light to transfer data)—creating a cohesive final product capable of transmitting information at ultrahigh speed while generating minimal heat.
PCBs are extensively used across industries, powering devices from simple gadgets to complex systems. In this article, we’ll understand the importance of PCB thickness, the various factors affecting it, and its impact on design and other factors.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Engineers at Caltech and the University of Southampton have collaboratively designed an electronics chip integrated with a photonics chip (which uses light to transfer data)—creating a cohesive final product capable of transmitting information at ultrahigh speed while generating minimal heat.
PCBs are extensively used across industries, powering devices from simple gadgets to complex systems. In this article, we’ll understand the importance of PCB thickness, the various factors affecting it, and its impact on design and other factors.
In this episode, we talk about the tattoo-like flexible wearable technology that’ll provide seamless high precision health monitoring for patients and enthusiasts.
The COVID-19 global pandemic has caused incredible disruption to our society over the last 2 years, and unfortunately resulted in substantial loss of life. To date there have been 430 million diagnosed cases worldwide, with close to 6 million deaths being reported.
Article #3 of Power Management for Tomorrow’s Innovations Series: Digital Power System Managers facilitate accurate measurement of the output current to let power supplies operate reliably and offer protection in case of electrical faults.
Announcing TechBlick's free-to-attend virtual conference and exhibition covering innovations in Wearable Sensors | E-Textiles | Printed Electronics & Beyond. It is a unique event with two-parallel live tracks, a live engaging exhibition floor, and 400+ attendees. See details & registration link here
A unique new approach of printing functional materials with unparallel precision and repeatability. Technology called Ultra-Precise Deposition (UPD) is a nanodispensing method capable to print high density and high viscous materials with the resolution down to 1 µm in feature size and with high ratio of width to height after single pass. For this method material extrusion is controlled by a pressure, which means it is not supported with high electric field. Thanks to this there are no limitation if the substrate is conductive or dielectric.
Human activity, from climate change, pollution, and habitat destruction, to poaching, territorial conflict, and trophy hunting, has seen the IUCN’s list of endangered species balloon to more than 147,000 in recent years, with 41,000 species threatened with extinction.
PCB traces are fundamental components in circuit design, serving as the pathways for electrical signals. This article examines the advancements, applications, and challenges of PCB trace technology. Discover insights into optimizing designs and overcoming common obstacles in PCB trace implementation.
4 ways to improve part design through customisation, material considerations, iterative prototyping with multi-cavity tooling, and the use of digital manufacturing resources
Article #1 of Power Management for Tomorrow’s Innovations Series: Optimizing the power converter and battery management system designs can solve the challenges associated with present-gen electric vehicles like short traveling ranges and high costs.
Using Artificial Intelligence (AI) to replace optical and mechanical components, researchers have designed a tiny spectrometer that breaks all current resolution records.