This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Article #6 of Power Management for Tomorrow’s Innovations Series: Power supplies for vehicle asset-tracking devices must be designed to operate at different voltage-current levels, be compact, and offer protection during transients and electrical faults.
Article #5 of Power Management for Tomorrow’s Innovations Series: Single-Inductor Multiple-Output (SIMO) architecture enables design engineers to extend the battery life, and reduce the circuit board size for hearables and wearables
Article #4 of Power Management for Tomorrow’s Innovations Series: This article investigates the effect that power designs have on the phase noise of Radio Frequency amplifiers through an experiment comparing the performance of three power regulators at different frequencies.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Article #6 of Power Management for Tomorrow’s Innovations Series: Power supplies for vehicle asset-tracking devices must be designed to operate at different voltage-current levels, be compact, and offer protection during transients and electrical faults.
Article #5 of Power Management for Tomorrow’s Innovations Series: Single-Inductor Multiple-Output (SIMO) architecture enables design engineers to extend the battery life, and reduce the circuit board size for hearables and wearables
Article #4 of Power Management for Tomorrow’s Innovations Series: This article investigates the effect that power designs have on the phase noise of Radio Frequency amplifiers through an experiment comparing the performance of three power regulators at different frequencies.
In this episode, we discuss how a wearable based sensing platform developed by MIT can provide detailed information about a user’s muscle activity and enable virtual physical therapy to increase access for this vital practice.
EHD is a promising digital printing technology for going beyond the resolution limits of inkjet. Most examples showcase electronic or display related applications.
The three themes are closely linked since QDs can be digitally printed as color conversation materials atop blue microLEDs to enable wide color gamut RGB uLED displays without requiring a separate transfer step for each color.. This is an important technology as it simplifies the manufacturing step for microLED and thus removing a major hinderence.
As microLEDs inevitably shrink in size, the micro-bumping requirements for the microLED dies becomes more challenging. Direct wafer-based printing based on gravure offset techniques offers a promising solution in this regard. Indeed, this is another field where printed electronics can play a role.
Nano-Ops is commercialising an automated wafer-based process and fab-in-a-box based on the directed assembly technology which can 'print' features down to 20nm.
Here, In the first step a pattern is first etched into a template wafer.
The progress of screen printing towards fine line printing has been incredible going from 100 µm features before 2010 to 70 µm to 2015 to 40 µm in 2018 and now pushing - in development- towards 20 µm and less. In parallel, the wet thickness of the printed line have gone down from 12um or so in 2018 to now just 4um.
To scale up microLED displays to large areas, smaller displays can be titled. Because microLEDs can be truely edge-less devices, the tiling can function, yielding a seemless look.
Stretchable Electronics and inks for durable wearable electronics. These inks can be printed on TPU films which can be bonded to fabrics. This results in devices that stretch without cracking and maintain excellent electrical properties. Examples include biometric sensors & fixed resistance heaters
As wearable electronic devices continue to be more prevalent, it becomes an ever-greater challenge for companies that manufacture them to keep their competitive edge. It is vitally important for manufacturers that each device is effective, cost-efficient and reflects the highest quality available.
Silver nanoparticle inks improve every year. These improvements are often incremental, but very important. One ever-present direction of development is towards inks which offer ever higher conductivity levels at a low curing temperature and a short curing time. This a critical figure of merit because it opens more substrate choices, saves time, and lowers energy consumption costs.