This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Vias go through two or more layers of PCBs to form an electrical connection. Making them right under the component’s pad saves space, reduces track inductance and simplifies design.
Electrical engineers must continually seek out new options and keep up with market changes. Take note of these six trends within the electronics industry.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Vias go through two or more layers of PCBs to form an electrical connection. Making them right under the component’s pad saves space, reduces track inductance and simplifies design.
Electrical engineers must continually seek out new options and keep up with market changes. Take note of these six trends within the electronics industry.
The Fe+male Tech Heroes was initially designed as a platform from women to (primarily) women. Over the years, our network has expanded and reached many men who understand that diverse input is pivotal for the success of any project. One of those smart minds is Julien Penders, who believes initiatives like ours are crucial to inspire the younger generation and change society for the better.
Printed Circuit Boards (PCBs) provide the foundation for the assembly of electronic components and enable the functionality of a wide range of devices. This article journeys through the requisite steps in the PCB manufacturing process, detailing the procedures involved in each.
Widely publicised in the media, there are rising concerns both within the agricultural industry and from government policymakers as to whether food production can keep up with unprecedented future demands.
The natural resources around us represent the basis for all human activity on Earth. We use these resources to produce food, clean drinking water, clothes, electrical energy, and everything else we need to survive. But these resources are limited.
The popularity of wearable electronics has induced demand for their parts, including power sources such as triboelectric nanogenerators (TENGs). Such power sources must be both stretchy and high-performance, holding up under various deformation conditions over hours of use.
PCBA design capabilities are crucial to the future of wearable technology. Wearables and PCBA design are inextricably linked since both have a significant influence on each other. As wearable devices become more popular, electronics designers and manufacturers are designing smaller, denser, and more flexible devices.
NANOWEB® is an extremely thin, transparent, conductive film that consists of an invisible, nanostructured metal mesh fabricated onto a glass or plastic surface. With its unrivaled transparency, conductivity, and flexibility, this patented functional film holds immense potential for both passive and powered use cases, with applications including electromagnetic interference shielding, antennas, 5G/6G redirection systems for elimination of dead spots, and deicing/defogging devices for vehicle windows and eyewear.
Vias are small holes in a PCB that enable electrical connections between different layers of the board. In the context of PCB design, via tenting refers to the process of covering the vias with a protective layer, typically a solder mask or dry film. This protective layer shields the vias from environmental factors, such as dust, moisture, and chemicals, which can lead to corrosion or short circuits. As PCB technology continues to advance, the importance of via tenting in maintaining the performance and reliability of complex, high-density interconnect (HDI) and flexible PCB designs cannot be overstated. This guide explores the art and science of via tenting, shedding light on its significance, techniques, and applications in modern PCB design and manufacturing.
Learn the best methods and industry standards for cleaning circuit boards, removing contaminants like dust, flux residues, and corrosion to ensure optimal performance and longevity!