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Solder flux has a large impact on final product quality. This article reviews how to use flux during soldering and how to decide on the right technology options for your project.
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This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
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Featured
Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology
Featured
Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
Engineers Wiki. Most Asked Questions.
Understanding the key differences between the two high-in-demand battery types. This article focuses on Energy density, lifespan, safety, and cost trade-offs for the technical selection of Li-Ion and LiFePO4 batteries.
DC Motor Speed Control: PWM Techniques for Brushed and BLDC Drives
By Umar Waseem.
16 minutes read.
Crystal Oscillator: Fundamentals, Models, and Design Guidelines
By Abiola Ayodele.
20 minutes read.
What Is LiFePO4? Engineering Guide to Lithium Iron Phosphate Batteries
By Umar Waseem.
15 minutes read.
Bandgap Voltage Reference: Complete Guide for Analog Engineers
By Ramsha Jawaid.
20 minutes read.
How to Charge a Lithium-Ion Battery Safely and Efficiently?
By Umar Waseem.
13 minutes read.
Voltage Reference: A Survey for Precision Engineers
By Abiola Ayodele.
28 minutes read.
ORGANIZATIONS. SHAPING THE INDUSTRY.
Mouser Electronics
Electronics
Mouser Electronics is a worldwide leading authorized distributor of semiconductors and electronic components.
219 Posts
TAGGED WITH flexible electronics
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
TAGGED WITH microchips
Ultra-efficient chip design enables extremely strong cryptography algorithms to run on energy-constrained edge devices.
Researchers at ETH Zurich have now developed chip technology that enables verification of the authenticity of sensor data, including images or videos.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
Latest Posts
Solder flux has a large impact on final product quality. This article reviews how to use flux during soldering and how to decide on the right technology options for your project.
4 minutes read
Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology
2 minutes read
Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
In the Providentia++ project, researchers at the Technical University of Munich (TUM) have worked with industry partners to develop a technology to complement the vehicle perspective based on onboard sensor input with a bird’s-eye view of traffic conditions. This improves road safety – also for autonomous driving.
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.
5 minutes read
Wafer thinning is a part of the semiconductor manufacturing process. It is essentially grinding off the backside of the wafers to control their thickness and is useful for the production of ultra-thin wafers. These flattened wafers are used to effect stacked and high-density packaging in compact or microelectronic devices. This article discusses the meaning of wafer thinning, along with its various techniques and significance.
Cost of production has been a major barrier despite the fact that Cu raw material prices are far lower than Ag. This is because this large raw material cost difference does not often get translated into equally large nanoparticle dispersion or ink costs. Can this be overcome?
In general, silicone based conductive pastes are rare and the versions with AgCl fillers- needed for many medical wearable applications- are even rarer!
Warp knitting is an excellent candidate. It combines weaving and weft knitting, allowing the warp knitted fabrics to have the stability of woven fabrics and the elasticity of knitted ones.
Conformal EMI shielding is a megatrend on its way to become ubiquitous in electronics. The incumbent process is based on sputtering a tri-layer structure consisting of SUS on the EMC of the package. In these slides, you can see performance analysis and detailed cost analysis/projections.
2 minutes read
This article describes the TAeTTOOz printable battery technology developed by Evonik and acquired by InnovationLab for upscaling and mass production. In this article, you can learn about the operating principles, the key working characteristics, the material set, production techniques, and emerging applications of this technology
7 minutes read
Why can microLED technology can help narrow the energy gap in electronic devices? The first slide shows the battery gap- Ahmed (Intel) has collected data by year showing that power demand of phones far exceeds the power supply level of batteries, creating a "battery gap" which ...
The progress of screen printing towards fine line printing has been incredible going from 100 µm features before 2010 to 70 µm to 2015 to 40 µm in 2018 and now pushing - in development- towards 20 µm and less. In parallel, the wet thickness of the printed line have gone down from 12um or so in 2018 to now just 4um.
As microLEDs inevitably shrink in size, the micro-bumping requirements for the microLED dies becomes more challenging. Direct wafer-based printing based on gravure offset techniques offers a promising solution in this regard. Indeed, this is another field where printed electronics can play a role.
The three themes are closely linked since QDs can be digitally printed as color conversation materials atop blue microLEDs to enable wide color gamut RGB uLED displays without requiring a separate transfer step for each color.. This is an important technology as it simplifies the manufacturing step for microLED and thus removing a major hinderence.