This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
In this episode, we talk about a research study from MIT that estimates the carbon emissions associated with autonomous vehicles will match that currently produced by all of the data centers in the world along with how to address it.
Lead-free solders offer an environment-friendly alternative to toxic lead-based solders, which were dominant in the PCB manufacturing industry till the mid-2000s.
A quick electric pulse completely flips the material’s electronic properties, opening a route to ultrafast, brain-inspired, superconducting electronics.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
In this episode, we talk about a research study from MIT that estimates the carbon emissions associated with autonomous vehicles will match that currently produced by all of the data centers in the world along with how to address it.
Lead-free solders offer an environment-friendly alternative to toxic lead-based solders, which were dominant in the PCB manufacturing industry till the mid-2000s.
A quick electric pulse completely flips the material’s electronic properties, opening a route to ultrafast, brain-inspired, superconducting electronics.
Controlled impedance in printed circuit boards involves the regulation of resistance exerted by signal traces. It is determined by characteristic factors of PCB fabrication, such as trace width and copper thickness. This article discusses controlled impedance and the essentials of its execution in PCB manufacturing.
This article aims to provide a comparative analysis of HASL vs ENIG, providing valuable insights to aid in making informed decisions for PCB design and manufacturing.
The hybrid “eBiobots” are the first to combine soft materials, living muscle and microelectronics, said researchers at the University of Illinois Urbana-Champaign, Northwestern University and collaborating institutions. They described their centimeter-scale biological machines in the journal Science Robotics.
Advancements in power storage devices, Micro Electro Mechanical Systems (MEMS), Gallium Nitride (GaN) semiconductors, etc. are key to achieving carbon neutrality in various industries.
Engineers face persistent challenges with PCBA designs as they become more complex, posing a risk to the development process as a whole. Those who neglect design complexity may fall behind development schedules, incur expenses, and miss market deadlines.
Study shows that if autonomous vehicles are widely adopted, hardware efficiency will need to advance rapidly to keep computing-related emissions in check.
Sensors are used in robotics to calculate the condition and environment of robots, using functions similar to the human sensory organs. A variety of sensors are required by different robots to navigate their environment while performing tasks. This article covers the types of sensors in robotics.
Approximately 7% of the world's gold can be found inside discarded electronic devices, in form of PCB Gold Fingers. While a tonne of Gold Ore produces just 5 grams of pure gold on average, a tonne of electronic scrap can house 300 grams of gold inside it. Here we gloss over the significance of gold fingers in the present day electronics industry and all kinds of gold fingers specifications you need to know.