This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
The Composite Engineering Challenge, organized by the Mitsubishi Chemicals Group and Wevolver, invited innovators, entrepreneurs, startups, and scaleups to submit projects that make use of fiber-reinforced composites.
Article #5 of Innovations in Electric and Autonomous Vehicles Series: EV batteries and chargers evolve, and as traditional auto sales dropped, EV sales continued to rise over the past years. What will this mean for investors and consumers? Where is the tech taking us and what stands in the way?
ABI Research forecasts that TinyML unit volumes will explode from 15 million units in 2020 to 2.5 billion units in 2030. Find out about this machine-learning technique now.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
The Composite Engineering Challenge, organized by the Mitsubishi Chemicals Group and Wevolver, invited innovators, entrepreneurs, startups, and scaleups to submit projects that make use of fiber-reinforced composites.
Article #5 of Innovations in Electric and Autonomous Vehicles Series: EV batteries and chargers evolve, and as traditional auto sales dropped, EV sales continued to rise over the past years. What will this mean for investors and consumers? Where is the tech taking us and what stands in the way?
ABI Research forecasts that TinyML unit volumes will explode from 15 million units in 2020 to 2.5 billion units in 2030. Find out about this machine-learning technique now.
Filled vias are via holes that are completely filled and closed with conductive or non-conductive material or copper plating. The filled via is one of the many realizations of PCB via covering, specified by industry standards. This article covers the definition, benefits, processes, applications, and challenges of filled vias.
Railways are more energy-efficient than other modes of passenger transportation, with CO₂ emissions per ton-kilometer roughly one-seventh those of passenger cars. The difference is more pronounced over long distances, and high-speed railway networks contribute substantially to energy savings in transport infrastructure.
A cold solder joint is a defect caused by improper melting of solder to bond PCB electronic components. This defect can impact the functionality of a PCB assembly, and so must be carefully avoided.
Robotic assembly lines have revolutionized production processes, enabling manufacturers to achieve high levels of efficiency, productivity, and quality.
Article #3 of Innovations in Electric and Autonomous Vehicles Series: 3GPP intends to use 5G in vehicle-to-everything (V2X) applications with significant advantages over current dedicated short-range communication or other cellular-V2X proposals.
Known as COWVR and TEMPEST, the duo is demonstrating that smaller, less expensive science instruments can play an important role in weather forecasting.
Researchers have developed new technology that could usher in the "next-generation" of thinner, higher-resolution and more energy efficient screens and electronic devices.
Testing PCBs involves using various methods and tools to ensure that all the individual elements of a PCB perform optimally, making up a high-quality PCB assembly. This article delves into the methods, procedures, and requirements of PCB testing.
Using green light and a double-layered cell, PhD researcher Riccardo Ollearo has come up with a photodiode that has sensitivity that many can only dream of.
EPFL researchers have come up with a new approach to electronics that involves engineering metastructures at the sub-wavelength scale. It could launch the next generation of ultra-fast devices for exchanging massive amounts of data, with applications in 6G communications and beyond.
Without data, the IoT would be useless. The electromechanical and electronic sensors used to collect information are just as important to the IoT’s digital brains as sight, smell, hearing, and touch are to human organic ones.