This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
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Article #1 of Power Management for Tomorrow’s Innovations Series: Optimizing the power converter and battery management system designs can solve the challenges associated with present-gen electric vehicles like short traveling ranges and high costs.
Article #4 of the Enabling IoT Series. Industrial enterprises are moving to a new approach to asset management, namely predictive maintenance by leveraging powerful new sensors and data.
4 ways to improve part design through customisation, material considerations, iterative prototyping with multi-cavity tooling, and the use of digital manufacturing resources
Understanding the key differences between the two high-in-demand battery types. This article focuses on Energy density, lifespan, safety, and cost trade-offs for the technical selection of Li-Ion and LiFePO4 batteries.
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Electronics
Mouser Electronics is a worldwide leading authorized distributor of semiconductors and electronic components.
219 Posts
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
Ultra-efficient chip design enables extremely strong cryptography algorithms to run on energy-constrained edge devices.
Researchers at ETH Zurich have now developed chip technology that enables verification of the authenticity of sensor data, including images or videos.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
Article #1 of Power Management for Tomorrow’s Innovations Series: Optimizing the power converter and battery management system designs can solve the challenges associated with present-gen electric vehicles like short traveling ranges and high costs.
Article #4 of the Enabling IoT Series. Industrial enterprises are moving to a new approach to asset management, namely predictive maintenance by leveraging powerful new sensors and data.
4 ways to improve part design through customisation, material considerations, iterative prototyping with multi-cavity tooling, and the use of digital manufacturing resources
8 minutes read
Conformal coating protects from damage caused by fungus, moisture, salt spray, or corrosion.
3 minutes read
Introducing the Power Management for Tomorrow’s Innovations Series: A new series featuring articles, case studies, and application guides explaining how product designers can build efficient power supplies for various applications.
As wearable electronic devices continue to be more prevalent, it becomes an ever-greater challenge for companies that manufacture them to keep their competitive edge. It is vitally important for manufacturers that each device is effective, cost-efficient and reflects the highest quality available.
2 minutes read
In this episode, we discuss how a wearable based sensing platform developed by MIT can provide detailed information about a user’s muscle activity and enable virtual physical therapy to increase access for this vital practice.
EHD is a promising digital printing technology for going beyond the resolution limits of inkjet. Most examples showcase electronic or display related applications.
Nano-Ops is commercialising an automated wafer-based process and fab-in-a-box based on the directed assembly technology which can 'print' features down to 20nm. Here, In the first step a pattern is first etched into a template wafer.
2 minutes read
To scale up microLED displays to large areas, smaller displays can be titled. Because microLEDs can be truely edge-less devices, the tiling can function, yielding a seemless look.
Stretchable Electronics and inks for durable wearable electronics. These inks can be printed on TPU films which can be bonded to fabrics. This results in devices that stretch without cracking and maintain excellent electrical properties. Examples include biometric sensors & fixed resistance heaters
Silver nanoparticle inks improve every year. These improvements are often incremental, but very important. One ever-present direction of development is towards inks which offer ever higher conductivity levels at a low curing temperature and a short curing time. This a critical figure of merit because it opens more substrate choices, saves time, and lowers energy consumption costs.
This article explores the key differences between active and passive filters, detailing their transfer functions, frequency responses, components, circuit configurations, stability, design challenges, approximation methods, and CAD tools for filter simulation and optimization.
Circuit card assemblies (CCA) give birth to a complete printed circuit board (PCB) after assembling every component. A printed circuit board has no electrical components and needs to go through a manufacturing process called circuit card assemblies which are the complete board assembly.
A short primer on how to choose PCBA surface finishes
4 minutes read
