This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Known as COWVR and TEMPEST, the duo is demonstrating that smaller, less expensive science instruments can play an important role in weather forecasting.
Researchers have developed new technology that could usher in the "next-generation" of thinner, higher-resolution and more energy efficient screens and electronic devices.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Known as COWVR and TEMPEST, the duo is demonstrating that smaller, less expensive science instruments can play an important role in weather forecasting.
Researchers have developed new technology that could usher in the "next-generation" of thinner, higher-resolution and more energy efficient screens and electronic devices.
Testing PCBs involves using various methods and tools to ensure that all the individual elements of a PCB perform optimally, making up a high-quality PCB assembly. This article delves into the methods, procedures, and requirements of PCB testing.
Using green light and a double-layered cell, PhD researcher Riccardo Ollearo has come up with a photodiode that has sensitivity that many can only dream of.
EPFL researchers have come up with a new approach to electronics that involves engineering metastructures at the sub-wavelength scale. It could launch the next generation of ultra-fast devices for exchanging massive amounts of data, with applications in 6G communications and beyond.
Without data, the IoT would be useless. The electromechanical and electronic sensors used to collect information are just as important to the IoT’s digital brains as sight, smell, hearing, and touch are to human organic ones.
Event planners should shift away from gas generators and towards clean, off-grid energy sources like solar to power their outdoor events. In this blog we’ll look at an alternative to gas generators, why it can be difficult to adopt, and how Capacitech makes this adoption easier and more affordable.
Article #1 of Innovations in Electric and Autonomous Vehicles Series: With so much emphasis on electrification, advancements in autonomous driving seem to have taken a backseat. Let’s take a look at the changes required to reach the point where cars drive around without needing any manual intervention.
While babies have a natural mechanism for alerting their parents that they need a diaper change, a new sensor developed by researchers at Penn State could help workers in daycares, hospitals and other settings provide more immediate care to their charges.
PCB Panelization is a PCB manufacturing technique. It involves the grouping of several small printed circuit boards to form a single array, which is known as a panel. Panelization is commonly employed in PCB manufacturing because it saves time and cost. This article discusses the conditions, design considerations, methods, types, and benefits of PCB panelization.
The global trade in counterfeit is worth up to $1 trillion annually, with electronics accounting for a significant portion of that figure. How do you keep your builds counterfeit-free?