This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Despite the prevalence of newer surface mount technology, THT still retains several unique benefits that underscore its enduring relevance. Find out which method is best for your projects.
Introducing the Bringing Intelligence to the Edge Series: Exploring how Artificial Intelligence is moving to embedded systems, transforming technology across various applications.
Status and evolution of intelligent skin patches, enabled by flexible hybrid electronics, going from a single wired sensors to complex wireless multi-function capability. Learn about trends, archirectures and challenges from a manufacturer's point of view to understand how to design for production.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Despite the prevalence of newer surface mount technology, THT still retains several unique benefits that underscore its enduring relevance. Find out which method is best for your projects.
Introducing the Bringing Intelligence to the Edge Series: Exploring how Artificial Intelligence is moving to embedded systems, transforming technology across various applications.
Status and evolution of intelligent skin patches, enabled by flexible hybrid electronics, going from a single wired sensors to complex wireless multi-function capability. Learn about trends, archirectures and challenges from a manufacturer's point of view to understand how to design for production.
As IoT technology evolves, automation will play a more important role by, for instance, automatically stopping the watering process once the soil has received a sufficient level of moisture. Furthermore, analysis of irrigation data transmitted to Cloud computing can help ensure that watering occurs at the optimal time (for example, overnight or at cooler times during the day) to minimize evaporation losses.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
This comprehensive article dives deep into the world of robotics, exploring the history, types, engineering components, applications, and future trends of robots, offering readers an in-depth understanding of how these remarkable machines work and shape our lives.
This article provides a detailed guide to System in Package technology, its advantages and challenges, key components, design, and manufacturing process.
The Inflation Reduction Act directs nearly $400 billion to clean energy incentives including $47 billion allocated for manufacturing. This article concentrates on the advantages offered to businesses.
Introducing a brand new series featuring innovative projects related to edge computing and machine learning. The first article presents a predictive maintenance solution utilizing the Nordic Thingy:91, monitoring machine health through anomaly detection with a TinyML model.
In this episode, we talk about a combined effort between ETH Zurich & the Swiss Federal Lab for Material Science (EMPA) to create “smart” internal bandages for safely patching patients post stomach/intestinal surgery while providing insight to the medical staff about the status of the patch to prevent leakages which can be fatal.
Wafer backgrinding is a crucial step in semiconductor manufacturing, as it prepares the wafer for further processing and packaging. The procedure comprises the thinning of silicon wafers by scraping out material from the backside, which is crucial for enhancing the functionality and dependability of semiconductor devices. This article examines the wafer backgrinding procedure, its difficulties, and the significance of quality control in ensuring the production of high-quality semiconductor devices.
Products referred to as "beauty tech" that utilize AI, IoT, and other technologies are breathing new life into the cosmetics industry. First, let's look at the background that led to the birth of beauty tech.
Healthcare is undergoing a transformative shift with the rise of stick-to-skin wearable monitoring devices. These data-collecting marvels, such as continuous glucose or cardiac monitoring devices, offer convenience & real-time insights.This article explores capabilities, applications & market trends