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International team develops device for continuous, wireless nitric oxide monitoring
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International team develops device for continuous, wireless nitric oxide monitoring
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Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.
Featured
Solder flux has a large impact on final product quality. This article reviews how to use flux during soldering and how to decide on the right technology options for your project.
Engineers Wiki. Most Asked Questions.
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Mouser Electronics is a worldwide leading authorized distributor of semiconductors and electronic components.
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Miniature RFID tags by Murata enable seamless system integration with durable, reprogrammable identification — delivering reliable tracking, authentication & traceability beyond the limits of traditional barcodes.
When Industrial Longevity Meets Semiconductor Speed: The Root of Component Obsolescence
TAGGED WITH microchips
How SimpleChips designs high-voltage silicon for systems that must perform reliably over decades?
In this episode, we talk about the engineers that built a wireless tag that detects and remembers overheating without a chip or a battery, enabling cold-chain monitoring without creating electronic waste.
By stacking multiple active components based on new materials on the back end of a computer chip, this new approach reduces the amount of energy wasted during computation.
Focused laser-like light that covers a wide range of frequencies is highly desirable for many scientific studies and for many applications, for instance quality control of manufacturing semiconductor electronic chips.
Latest Posts
International team develops device for continuous, wireless nitric oxide monitoring
3 minutes read
Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.
Solder flux has a large impact on final product quality. This article reviews how to use flux during soldering and how to decide on the right technology options for your project.
4 minutes read
Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology
2 minutes read
Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
In the Providentia++ project, researchers at the Technical University of Munich (TUM) have worked with industry partners to develop a technology to complement the vehicle perspective based on onboard sensor input with a bird’s-eye view of traffic conditions. This improves road safety – also for autonomous driving.
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.
5 minutes read
Wafer thinning is a part of the semiconductor manufacturing process. It is essentially grinding off the backside of the wafers to control their thickness and is useful for the production of ultra-thin wafers. These flattened wafers are used to effect stacked and high-density packaging in compact or microelectronic devices. This article discusses the meaning of wafer thinning, along with its various techniques and significance.
Cost of production has been a major barrier despite the fact that Cu raw material prices are far lower than Ag. This is because this large raw material cost difference does not often get translated into equally large nanoparticle dispersion or ink costs. Can this be overcome?
In general, silicone based conductive pastes are rare and the versions with AgCl fillers- needed for many medical wearable applications- are even rarer!
Warp knitting is an excellent candidate. It combines weaving and weft knitting, allowing the warp knitted fabrics to have the stability of woven fabrics and the elasticity of knitted ones.
Conformal EMI shielding is a megatrend on its way to become ubiquitous in electronics. The incumbent process is based on sputtering a tri-layer structure consisting of SUS on the EMC of the package. In these slides, you can see performance analysis and detailed cost analysis/projections.
2 minutes read
This article describes the TAeTTOOz printable battery technology developed by Evonik and acquired by InnovationLab for upscaling and mass production. In this article, you can learn about the operating principles, the key working characteristics, the material set, production techniques, and emerging applications of this technology
7 minutes read
Why can microLED technology can help narrow the energy gap in electronic devices? The first slide shows the battery gap- Ahmed (Intel) has collected data by year showing that power demand of phones far exceeds the power supply level of batteries, creating a "battery gap" which ...
The progress of screen printing towards fine line printing has been incredible going from 100 µm features before 2010 to 70 µm to 2015 to 40 µm in 2018 and now pushing - in development- towards 20 µm and less. In parallel, the wet thickness of the printed line have gone down from 12um or so in 2018 to now just 4um.