This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Advanced testing methodologies and innovation in semiconductor packaging ensure product reliability in dynamic and harsh operational environments. These strategies are particularly crucial in the rapidly evolving automotive industry.
Additive electronics is sustainable reduceing copper and water consumption vs. the traditional PCB production processes by 70% and 95%, respectively whilst reducing the carbon footprint by 75%. Here you will read about the latest advances by one of the leading firms in the field from Japan
Mesh topology is the most used network topology, as all computer networks are connected. Each computer sends signals and relays the data from other computer networks. The dedicated link transmits information from one node to another and connects all the nodes.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Advanced testing methodologies and innovation in semiconductor packaging ensure product reliability in dynamic and harsh operational environments. These strategies are particularly crucial in the rapidly evolving automotive industry.
Additive electronics is sustainable reduceing copper and water consumption vs. the traditional PCB production processes by 70% and 95%, respectively whilst reducing the carbon footprint by 75%. Here you will read about the latest advances by one of the leading firms in the field from Japan
Mesh topology is the most used network topology, as all computer networks are connected. Each computer sends signals and relays the data from other computer networks. The dedicated link transmits information from one node to another and connects all the nodes.
2D and 3D Automated inspection systems are often used for detecting manufacturing errors in fast production lines. Learn how they provide a comprehensive and efficient solution for quality assurance.
After 20 years of calling me to fix their email and antivirus settings, my parents started calling my 13-year-old daughter for help instead. Technology seems to have been nagging rather than helping grandparents, but the advent of cheap computing gives fundamental reasons to change this balance.
In this episode, we discuss the accidental discovery of how amputees can sense temperature in their phantom limbs and how EPFL researchers have exploited this to develop the first generation of prosthetics that can feel.
With the increasing need for critical applications technology, PCBAs have become smaller and more complex, requiring designers to create more individual designs in a shorter timeframe. Learn how to do so while avoiding common errors that can derail your project.
New technologies in life sciences and health are transforming healthcare from a labor-intensive industry to a data-driven, innovation-intensive industry.
Mass manufacturing electronic textiles and in doing so combining textile based wiring and sensors with PCB electronics is no easy task. In this article, you will learn about an innovative approach to enable embriodery of PCBs and conductive wiring/sensors in mass produced e-textiles
As part of TechBlick series on additive and printed electronics, Michael LeFebvre draws upon his four decades of industry experience to highlight 3 recent technical and application innovations impacting transparent 5G antennas, ADAS, and wearable therapy all based on printed & additive electronics
Silicon, with its abundant availability and unique properties, serves as the fundamental building block for semiconductor manufacturing. Its semi-metallic nature makes it an ideal material for controlled conduction of electricity. Furthermore, the combination of silicon with oxygen produces silicon dioxide, a crucial insulating component in silicon chip manufacturing.
Die attach, also known as die bonding or die mount, is a process used in the semiconductor industry to attach a silicon chip to the die pad of a semiconductor package's support structure, such as a leadframe or metal can header. This article explores the fundamentals of die attach, its importance, materials, and methods used in die attach, its parameters, quality, and reliability techniques.