This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This article provides a detailed guide to System in Package technology, its advantages and challenges, key components, design, and manufacturing process.
The Inflation Reduction Act directs nearly $400 billion to clean energy incentives including $47 billion allocated for manufacturing. This article concentrates on the advantages offered to businesses.
Introducing a brand new series featuring innovative projects related to edge computing and machine learning. The first article presents a predictive maintenance solution utilizing the Nordic Thingy:91, monitoring machine health through anomaly detection with a TinyML model.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
This article provides a detailed guide to System in Package technology, its advantages and challenges, key components, design, and manufacturing process.
The Inflation Reduction Act directs nearly $400 billion to clean energy incentives including $47 billion allocated for manufacturing. This article concentrates on the advantages offered to businesses.
Introducing a brand new series featuring innovative projects related to edge computing and machine learning. The first article presents a predictive maintenance solution utilizing the Nordic Thingy:91, monitoring machine health through anomaly detection with a TinyML model.
In this episode, we talk about a combined effort between ETH Zurich & the Swiss Federal Lab for Material Science (EMPA) to create “smart” internal bandages for safely patching patients post stomach/intestinal surgery while providing insight to the medical staff about the status of the patch to prevent leakages which can be fatal.
Wafer backgrinding is a crucial step in semiconductor manufacturing, as it prepares the wafer for further processing and packaging. The procedure comprises the thinning of silicon wafers by scraping out material from the backside, which is crucial for enhancing the functionality and dependability of semiconductor devices. This article examines the wafer backgrinding procedure, its difficulties, and the significance of quality control in ensuring the production of high-quality semiconductor devices.
Products referred to as "beauty tech" that utilize AI, IoT, and other technologies are breathing new life into the cosmetics industry. First, let's look at the background that led to the birth of beauty tech.
Healthcare is undergoing a transformative shift with the rise of stick-to-skin wearable monitoring devices. These data-collecting marvels, such as continuous glucose or cardiac monitoring devices, offer convenience & real-time insights.This article explores capabilities, applications & market trends
In wearables, the design on paper often does not work in practice. In this world, your idea may only go as far as your chosen contract manufacturer can take you. It is the key role of the contract manufacturers to help you make the vital adjustment to make your product a success.
An In-depth Analysis of Features, Applications, and Selection Criteria for Embedded Systems Design. Discover the Advantages and Limitations of SPI, I2C, and UART for Efficient Data Exchange in Various Scenarios.
Additive electronics is intrinsically more sustainable than subtractive processes. Yet the current materials are often based on metallic inks and plastic substrates. This is a particular issue in medical wearables with disposable devices. Hence the need to develop sustainable material options
Based on the revised Food Sanitation Act, the institutionalization of hygiene management in accordance with HACCP started in Japan in June 2021. HACCP is an acronym for Hazard Analysis and Critical Control Point.