This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
Cody Endlich, MacroFab's head of strategic sourcing, discusses counterfeit PCBA parts and their impact on electronic builds, and how MacroFab has managed a zero percent failure rate for nonconformity or counterfeit parts.
It is common for electrical devices to be rated under both systems, which provide comprehensive protection while meeting various global standards. But do you know how they are the same, and how they differ?
Understanding the key differences between the two high-in-demand battery types. This article focuses on Energy density, lifespan, safety, and cost trade-offs for the technical selection of Li-Ion and LiFePO4 batteries.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
Cody Endlich, MacroFab's head of strategic sourcing, discusses counterfeit PCBA parts and their impact on electronic builds, and how MacroFab has managed a zero percent failure rate for nonconformity or counterfeit parts.
It is common for electrical devices to be rated under both systems, which provide comprehensive protection while meeting various global standards. But do you know how they are the same, and how they differ?
Sensor and actuator networks are systems that collect and transmit data from a physical environment for digital processing. Data is collected at sensors and actuators in the field, then digitized at the sensor or actuator. The digitized data can be used for a variety of applications, and the method for data processing depends on the application
In the ever-evolving world of processor architectures, the showdown between RISC-V and ARM sparks fervent competition. With their distinct histories, these two giants are redefining computing power and igniting discussions on openness, customization, and innovation in microprocessors.
In this episode, we discuss the accidental discovery of how amputees can sense temperature in their phantom limbs and how EPFL researchers have exploited this to develop the first generation of prosthetics that can feel.
Silicon has emerged as the most widely used semiconductor material in the electronic industry, paving the way for the digital age. However, many are still oblivious to the unique properties and characteristics that make silicon ideal for a range of applications. This article explores the fundamentals of semiconductor materials, the properties of silicon that make it a prominent player in the semiconductor industry, and its diverse applications in electronic devices.
Cavitation dispersion process improves the properties of materials used in additive manufacturing of circuits. You will learn how one can control hydrodynamic cavitation to produce unique dispersions, formulated inks & pastes, high aspect ratio nanoparticle & ‘2D’ filler particle masterbatches.
The key enabler for reliable device fabrication in printed electronics is functional inks with tunable electrical properties incl. conductivity, dielectric strength & electrical resistance. Here, you will learn about unique polyimide based pastes able to withstand temperatures up to 300°C.
The demand for compact yet energy-efficient radar sensors for remote vital sign monitoring is witnessing an exponential rise in the healthcare industry for several reasons.