This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Princeton researchers have developed a flexible, lightweight and energy efficient soft robot that moves without the use of any legs or rotary parts. Instead, the device uses actuators that convert electrical energy into vibrations that allow it to wiggle from point to point using only a single watt.
Understanding what drains energy is a game-changer, whether you're a developer crafting the next IoT breakthrough, fine-tuning an embedded system, or simply interested in gauging the power efficiency of your devices.
Unveiling the Art and Science Behind Circuit Boards - Copper Etching to Silkscreens, a Comprehensive Guide to Elements, Manufacturing Processes, and Multilayered Varieties in Electronic Circuit Boards
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Princeton researchers have developed a flexible, lightweight and energy efficient soft robot that moves without the use of any legs or rotary parts. Instead, the device uses actuators that convert electrical energy into vibrations that allow it to wiggle from point to point using only a single watt.
Understanding what drains energy is a game-changer, whether you're a developer crafting the next IoT breakthrough, fine-tuning an embedded system, or simply interested in gauging the power efficiency of your devices.
Unveiling the Art and Science Behind Circuit Boards - Copper Etching to Silkscreens, a Comprehensive Guide to Elements, Manufacturing Processes, and Multilayered Varieties in Electronic Circuit Boards
Silicon-level security is crucial in protecting the hardware of computing devices, serving as a foundational layer for data integrity and system reliability in our increasingly digital world.
Organic Photovoltaics (OPV are a 3rd Gen PV technology with unique attribute. The key to their success is in Roll-to-Roll (R2R) processing. Here you will learn about the advantages and challenges of R2R manufacturing in OPVs and printed electronics
EPFL scientists have crafted a biological system that mimics an electronic bandpass filter, a novel sensor that could revolutionize self-regulated biological mechanisms in synthetic biology.
Today’s rapidly evolving market requires quick product development cycles, presenting a challenge for PCBA design teams that are short on qualified workers
Developed by EPFL researchers, the first large-scale in-memory processor using 2D semiconductor materials could substantially cut the ICT sector’s energy footprint.
With a groundbreaking open-source architecture, RISC-V is paving the way for a new era of computing technology. In this article, we’ll delve into RISC-V’s evolution, its underlying principles and technical aspects, as well as its limitations and future prospects.
Lasers have become relatively commonplace in everyday life, but they have many uses outside of providing light shows at raves and scanning barcodes on groceries. Lasers are also of great importance in telecommunications and computing as well as biology, chemistry, and physics research.