The IoT has been a game-changer for large-scale agricultural food growth. Through precision farming—which uses connectivity, sensors, machines, drones and data analytics—farmers can create the ideal crop growing conditions and achieve the best yield-to-input ratio.
The IoT has been a game-changer for large-scale agricultural food growth. Through precision farming—which uses connectivity, sensors, machines, drones and data analytics—farmers can create the ideal crop growing conditions and achieve the best yield-to-input ratio.
Thin film deposition is a process used to create thin film coatings on different materials. Thin films can consist of metal, semiconductors, and dielectrics, providing them with different properties. These properties translate to benefits such as electrical insulation, optical transmission, and corrosion resistance, that can be used to improve substrate performance. This article explores the processes of thin film deposition, along with its types, parameters, benefits, drawbacks, and applications.
As a result of the development of various machines and robots, we have become able to effortlessly handle jobs that humans could not perform with muscle strength and motor skills. Moreover, owing to advances in sensors, AI, and other information processing technologies, we have also become able to use perceptual abilities that exceed the five human senses.
This article explores transistor circuit design for digital design engineers, hardware engineers, and electronics engineering students. Find out the theoretical foundations with practical guidance, enabling you to confidently build and analyze analog and digital transistor circuits.
This article covers every aspect of the Arduino UNO pinout, presenting a technical, pin-by-pin explanation to help readers confidently design, analyze, and implement Arduino-based systems.
This article explores how to read resistor color code correctly, covering the fundamental theory, relevant standards, practical examples, and design-oriented insights, providing practical tips for efficient and accurate circuit prototyping.
Miniature RFID tags by Murata enable seamless system integration with durable, reprogrammable identification — delivering reliable tracking, authentication & traceability beyond the limits of traditional barcodes.
In this episode, we talk about the engineers that built a wireless tag that detects and remembers overheating without a chip or a battery, enabling cold-chain monitoring without creating electronic waste.
By stacking multiple active components based on new materials on the back end of a computer chip, this new approach reduces the amount of energy wasted during computation.
Focused laser-like light that covers a wide range of frequencies is highly desirable for many scientific studies and for many applications, for instance quality control of manufacturing semiconductor electronic chips.
The IoT has been a game-changer for large-scale agricultural food growth. Through precision farming—which uses connectivity, sensors, machines, drones and data analytics—farmers can create the ideal crop growing conditions and achieve the best yield-to-input ratio.
Thin film deposition is a process used to create thin film coatings on different materials. Thin films can consist of metal, semiconductors, and dielectrics, providing them with different properties. These properties translate to benefits such as electrical insulation, optical transmission, and corrosion resistance, that can be used to improve substrate performance. This article explores the processes of thin film deposition, along with its types, parameters, benefits, drawbacks, and applications.
As a result of the development of various machines and robots, we have become able to effortlessly handle jobs that humans could not perform with muscle strength and motor skills. Moreover, owing to advances in sensors, AI, and other information processing technologies, we have also become able to use perceptual abilities that exceed the five human senses.
Researchers at ETH Zurich, Empa and EPFL are developing a 3D-printed insole with integrated sensors that allows the pressure of the sole to be measured in the shoe and thus during any activity. This helps athletes or patients to determine performance and therapy progress.
In this article+talk, electrical 3D printing's technical aspects are covered, covering resin printing, circuit formation, part mounting, materials, and methods. Learn about low-temperature soldering, embedded components, and the impact on rapid prototyping and unique device manufacturing.
Innovations such as biomimicry, software inspired by insect brains, smart skin, neuromorphic computing, and other emerging technologies further expand robots' capabilities and push the boundaries of robotics hardware.
The Composite Engineering Challenge, organized by the Mitsubishi Chemicals Group and Wevolver, invited innovators, entrepreneurs, startups, and scaleups to submit projects that make use of fiber-reinforced composites.
ABI Research forecasts that TinyML unit volumes will explode from 15 million units in 2020 to 2.5 billion units in 2030. Find out about this machine-learning technique now.
Filled vias are via holes that are completely filled and closed with conductive or non-conductive material or copper plating. The filled via is one of the many realizations of PCB via covering, specified by industry standards. This article covers the definition, benefits, processes, applications, and challenges of filled vias.
Railways are more energy-efficient than other modes of passenger transportation, with CO₂ emissions per ton-kilometer roughly one-seventh those of passenger cars. The difference is more pronounced over long distances, and high-speed railway networks contribute substantially to energy savings in transport infrastructure.
Robotic assembly lines have revolutionized production processes, enabling manufacturers to achieve high levels of efficiency, productivity, and quality.
A cold solder joint is a defect caused by improper melting of solder to bond PCB electronic components. This defect can impact the functionality of a PCB assembly, and so must be carefully avoided.
Known as COWVR and TEMPEST, the duo is demonstrating that smaller, less expensive science instruments can play an important role in weather forecasting.