Wafer dicing separates individual integrated circuits or chips from a semiconductor wafer without damaging their delicate structures and circuits. This process is crucial for the production of electronic devices and components used in various industries, and the demand for it has increased with the development of high-performance and smaller electronic devices. Different dicing techniques, such as blade dicing, laser dicing, and plasma dicing, have been developed, and new innovations continue to emerge to address the challenges of complex semiconductor devices.
Learn the powerful approach of combining data from multiple sensors to enhance the overall perception, reliability, and decision-making capabilities of various systems with ease.
This article provides a comprehensive overview of motor controllers, covering definitions, types, control strategies, design considerations, selection guidelines, and emerging trends.
Learn how USB 3.2 Gen 2x1 delivers 10Gbps high-speed performance with simpler single-lane routing, lower power consumption, and easier PCB design for embedded, FPGA, and industrial systems.
Explore how first-principles engineering and human judgment shape reliable high-voltage IC design, from yield thinking to long-term system lifetime and root-cause discipline.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
In this episode, we talk about the engineers that built a wireless tag that detects and remembers overheating without a chip or a battery, enabling cold-chain monitoring without creating electronic waste.
Wafer dicing separates individual integrated circuits or chips from a semiconductor wafer without damaging their delicate structures and circuits. This process is crucial for the production of electronic devices and components used in various industries, and the demand for it has increased with the development of high-performance and smaller electronic devices. Different dicing techniques, such as blade dicing, laser dicing, and plasma dicing, have been developed, and new innovations continue to emerge to address the challenges of complex semiconductor devices.
Learn the powerful approach of combining data from multiple sensors to enhance the overall perception, reliability, and decision-making capabilities of various systems with ease.
In this article, we will delve into the structure and operation of NMOS and PMOS transistors, and discuss the applications and characteristics of these essential components in electronic circuits.
Article #1 of Transforming Industrial Manufacturing with Industry 4.0 Series: Advancements in less-glamorized technologies like sensing, Programmable Logic Controllers, low-power components, and vision systems have played important roles in the rapid progression of Manufacturing 4.0.
Research from elite athletes informs the design of these robust and adaptable prosthetics. We interview researcher Tijmen Seignette, about his ambitions to change how we approach prosthetic design.
Columbia Engineers design a robot hand that is the first device of its kind to join advanced sense of touch with motor-learning algorithms — it doesn’t rely on vision to manipulate objects
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.
This free-to-attend, immersive virtual event, on 22 June 2023 will cover all aspects of flexible and printed electronics, from material advancements to the development of novel deposition and manufacturing technologies.
In today's interconnected world, network topologies play a crucial role in determining the efficiency and reliability of communication between devices. One such network topology is the bus topology, known for its simplicity and cost-effectiveness. In this comprehensive guide, we will delve deeper into bus topology, exploring its advantages, disadvantages, applications, and the future of this network design.
UART and SPI are key communication methods in electronics. UART is ideal for simple, long-distance connections, while SPI excels in fast data transfer. Used in GPS modules, SD cards, and microcontrollers, understanding their differences can help you choose the best for any given project.
PCB mounting is critical for ensuring the lifetime and dependability of electronic products, including careful component selection and location, adherence to industry standards, and the use of high-quality materials and assembly procedures. This post will go over PCB mounting techniques, tips, and best practices and expand on crucial aspects of printed circuit board mounting.