This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Two primary PCB assembly techniques have emerged as the electronics industry standards: Through-Hole Technology (THT) and Surface Mount Technology (SMT). This article delves into the intricacies of THT and SMT, providing a thorough comparison of their advantages, disadvantages, and applications.
Transistors — the tiny on-off switches inside microchips — have gotten smaller and smaller over the years, increasing computing power and enabling smaller devices. During that time, the copper wires that connect these switches have likewise shrunk.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Two primary PCB assembly techniques have emerged as the electronics industry standards: Through-Hole Technology (THT) and Surface Mount Technology (SMT). This article delves into the intricacies of THT and SMT, providing a thorough comparison of their advantages, disadvantages, and applications.
Transistors — the tiny on-off switches inside microchips — have gotten smaller and smaller over the years, increasing computing power and enabling smaller devices. During that time, the copper wires that connect these switches have likewise shrunk.
Sensor fusion enables the seamless integration of data from multiple sensors, paving the way for advanced Edge AI implementations that optimize real-time processing, enhance decision-making, and boost system responsiveness in dynamic environments.
Advanced packaging of semiconductor-based sensors - specially on flexible substrates- brings very specific interconnection requirements. These often are related to a very narrow pitch of the interconnections or the fragility of the sensor. Learn how inkjet printing solves the issues
MSE researchers are using a Catalyst Award from the National Academy of Medicine to develop a pressure-relieving sensor system that could also be used in hospital beds.
Sponsor interview with Theresa Hackl, Application Marketing Engineer, Komei Takura, Senior Business Development Manager for Mobility and
Yoichi Murakami, Senior Product Manager for Function Devices at Murata.
Digital platforms have profoundly transformed the design process for cobot motor drives, enabling engineers to streamline workflows, enhance precision, and rapidly adapt to the evolving demands of the industrial landscape.
ETH Zurich researchers taught an autonomous excavator to construct dry stone walls itself using boulders weighing several tonnes and demolition debris.
Heaters are one of the most successful applications of printed electronics. At first they seem deceptively simple, yet their successful realization is in fact an art relying on the interplay of all the elements from the right material selection to right design, right printing, etc. Learn how here.
To advance cell-based therapies, researchers have identified a novel device that makes on-site oxygen for biological cells transplanted inside the body.
A new study led by chemists at the University of Illinois Urbana-Champaign brings fresh insight into the development of semiconductor materials that can do things their traditional silicon counterparts cannot – harness the power of chirality, a non-superimposable mirror image.