This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Explore the fundamentals of Gray Code, its practical uses in digital systems, and the latest advancements driving innovation in technology and data encoding.
This article delves into the foundational concepts of encoders, their various types, recent advancements, seamless integration with modern systems, and how they are revolutionizing industries.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Explore the fundamentals of Gray Code, its practical uses in digital systems, and the latest advancements driving innovation in technology and data encoding.
This article delves into the foundational concepts of encoders, their various types, recent advancements, seamless integration with modern systems, and how they are revolutionizing industries.
Due to the properties of flexible PCBs and their unique applications, a whole different set of design rules apply to flex boards. In this article, we highlight some basic design guidelines, tips and tricks that every flex PCB designer should know.
Precision screen printing machines have emerged as the premier choice for manufacturing printed electronics due to their unparalleled accuracy, efficiency, and versatility.
Dive into the critical role of via types in modern electronics, exploring how they enhance connectivity and performance in circuit design. Learn about the latest advancements, practical applications, and challenges in using various via types.
The right stretchable ink system compatible with many substrates is essential for many applications including in-mold electronics, wearable electronics, stretchable/conformable circuits, paper electronics, in-mold electronics, electronic textiles, and beyond, etc.
Understanding the intricacies of Vdd and Vss is essential for anyone involved in circuit design. This article explores how Vdd, the positive supply voltage, and Vss, the ground or negative supply voltage, impact the design, performance, and reliability of electronic devices.
In the realm of radar and communication systems, understanding different frequency bands is important. Among these, the K band, Ka band, and X band stand out due to their distinct properties and applications. Mastering their nuances enables engineers to improve system performance and add innovations.
MIT CSAIL researchers enhance robotic precision with sophisticated tactile sensors in the palm and agile fingers, setting the stage for improvements in human-robot interaction and prosthetic technology.