This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Bidirectional charging introduces exciting possibilities for EVs to power entire buildings but necessitates meticulous control of energy flow. Components like high-capacity relays play a critical role, ensuring safe and efficient power transfer through precise switching and circuit isolation.
In this episode, we discuss how MIT researchers are leveraging a state of the art 3D printer to create much more efficient field electron emitters which could unlock huge potential for ion propulsion in space travel!
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Bidirectional charging introduces exciting possibilities for EVs to power entire buildings but necessitates meticulous control of energy flow. Components like high-capacity relays play a critical role, ensuring safe and efficient power transfer through precise switching and circuit isolation.
In this episode, we discuss how MIT researchers are leveraging a state of the art 3D printer to create much more efficient field electron emitters which could unlock huge potential for ion propulsion in space travel!
Discover the latest advancements in PCBA manufacturing and how they are transforming the electronics industry. Learn about foundational concepts, innovative technologies, real-world applications, and challenges in this comprehensive guide.
Structured text is a standardized method of organizing and presenting information in a hierarchical format, ensuring precision and consistency in engineering and programming environments.
Visualizing the energy consumption profile of your embedded IoT device marks the initial step toward achieving low-power design and extended battery life. The subsequent step is analysis, where you can make a significant impact on your energy optimization efforts.
Discover the critical role of in-circuit testing in modern engineering, exploring its foundational principles, technological advancements, and real-world applications.
Traditionally used in aerospace Conformal coating protects electronics against damage from moisture and oxidation, by applying a thin breathable layer to circuit boards. Explore our guide to learn all about how this helpful technique is used for protecting wearable tech to industrial robots.
Drone flight is energetically expensive, especially for smaller devices. To manage this, drone PCBAs are designed to be compact, dense, and fast to pack more functions into a smaller space.
From a component supplier to a strategic partner, Nexperia's collaboration with Synapticon facilitated innovations such as integrated motion devices. These compact units merge control, actuation, and feedback in robot joints, enhancing efficiency and broadening application potential.
Learn about the various sizes of SMD resistors, their impact on electronic circuit design, and the latest technological advancements in SMD Resistor Technology. This guide discusses practical insights for engineering professionals looking to optimize their designs with precise resistor sizes.
This article explores the fundamentals, advantages, and practical uses of Hipot testing, emphasizing its role in electrical safety and reliability, alongside recent advancements and the challenges faced by engineers.