This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
Explore the transformative potential of the ROCK 3 Compute Module in revolutionizing pipeline inspection. Discover the power and versatility of this innovative solution, designed to enhance safety, efficiency, and operational excellence in infrastructure maintenance.
To excel in the fast-paced electronics industry, you need not just adaptability, but a cultivated expertise to discern the far-reaching impact of your design decisions. This eBook is your key to building such expertise.
Murata Manufacturing (Murata) has developed a technology that has the potential to enable ultrasonic scans, which are presently used to view the fetus within the uterus, to be used to view the brain within the cranium.
Understanding the key differences between the two high-in-demand battery types. This article focuses on Energy density, lifespan, safety, and cost trade-offs for the technical selection of Li-Ion and LiFePO4 batteries.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
Explore the transformative potential of the ROCK 3 Compute Module in revolutionizing pipeline inspection. Discover the power and versatility of this innovative solution, designed to enhance safety, efficiency, and operational excellence in infrastructure maintenance.
To excel in the fast-paced electronics industry, you need not just adaptability, but a cultivated expertise to discern the far-reaching impact of your design decisions. This eBook is your key to building such expertise.
Murata Manufacturing (Murata) has developed a technology that has the potential to enable ultrasonic scans, which are presently used to view the fetus within the uterus, to be used to view the brain within the cranium.
Properties and application of paste technology for noise reduction in high frequency (110-170 GHz) electronic devices and packaging . This is a dispensable material can be easily installed in narrow spaces, suppressing noise inside electronic devices used in beyond 5G/6G
Transitioning from Lab-scale in Printed Electronics: Going from lab and pilot equipment to rotary screen printing. Learn about example applications in printed low-power displays for use in retail as well as cost-per unit calculation comparing flat-bed vs. rotary screen printing for mass production
To make AI as smart as the butterflies, a team of Penn State researchers has created a multi-sensory AI platform that is both more advanced and uses less energy than other AI technologies.
Duru Uluk, a Voltera test engineering intern, created an induction mug heater using in-mold electronics (also known as in-mold structural electronics).
A new method safely extracts valuable metals locked up in discarded electronics and low-grade ore using dramatically less energy and fewer chemical materials than current methods, report University of Illinois Urbana-Champaign researchers in the journal Nature Chemical Engineering.
Hackers can access sensitive data and disrupt device operations by activating embedded malware or hardware trojans in counterfeit components. How can you avoid these issues?
R2R Sputtering + Direct Laser Patterning is a great way to create large-area circuits on flexible circuits, even with materials such as graphene or MoS2. The technology R2R produces high-quality uniform films on large substrates whilst the laser forms precision circuit patterns without photolith.
This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.
This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.
Multi-material printing without inks? The technology’s on-demand and in-situ nanoparticle generation and real-time sintering capability allow the printing of various electronics and functional devices with pure, multifunctional, hybrid materials printing - without inks and with bulk properties!