This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
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Canadian researchers have discovered that they can stick hydrogel plasters to the skin very effectively using ultrasound. Outi Supponen has now explained the underlying mechanism: imploding bubbles that form within the adhesive located between the plaster and the skin anchor the one on the other.
Magnetism is a force exerted by charged particles in motion that allows them to attract/repel other moving charged particles. The universal phenomenon is responsible for shaping the world as we know it.
Open and honest communication is crucial to a successful design. Product and engineering decision-makers need to work in sync.
An instrumentation amplifier is a precision differential amplifier designed to amplify small voltage differences. This guide explains the three-op-amp architecture, and how to choose between INA128, AD620, LT1167, and a standard difference amplifier for sensor front-ends.
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Electronics
Mouser Electronics is a worldwide leading authorized distributor of semiconductors and electronic components.
219 Posts
Learn how a Hall Effect Current Sensor works, including principles, topologies, specifications, comparisons and engineering applications.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Ultra-efficient chip design enables extremely strong cryptography algorithms to run on energy-constrained edge devices.
Researchers at ETH Zurich have now developed chip technology that enables verification of the authenticity of sensor data, including images or videos.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
Canadian researchers have discovered that they can stick hydrogel plasters to the skin very effectively using ultrasound. Outi Supponen has now explained the underlying mechanism: imploding bubbles that form within the adhesive located between the plaster and the skin anchor the one on the other.
2 minutes read
Magnetism is a force exerted by charged particles in motion that allows them to attract/repel other moving charged particles. The universal phenomenon is responsible for shaping the world as we know it.
Open and honest communication is crucial to a successful design. Product and engineering decision-makers need to work in sync.
4 minutes read
Phosphors or QDs for color conversion in LCD and microLED ? Which will win? This is an evolving technology space to watch. Here, it is shown that phosphor technology is evolving, enabling not just red but also green narrowband color conversation with small particle sizes compatible with microLEDs
2 minutes read
Molecular particle free inks can offer extreme formability and stretchability, allowing the design and production of 3D shaped and/or in-mold electronics parts with extreme curvatures and complex shapes.
As NASA prepares to send astronauts back to the Moon to live and explore, capabilities for space-based manufacturing of sensors, circuits, and other electronics will become increasingly critical. Recent microgravity flights have helped to advance cutting-edge methods for 3D printing of electronics
4 minutes read
This article delves into the specifics of NPN and PNP transistors, their working principles, applications, comparisons, and factors to consider when choosing between them.
In this episode, we talk about how researchers are developing a sticker that can conduct ultrasound tests along with a machine learning powered robotic solution for choosing chemical proteins when developing new drugs and biofuels or recycling plastics.
The rigid, flex and rigid-flex PCBs are all types of printed circuit boards. The rigid PCB is the traditional board and the base from which the other two variations came about, in response to industry and market needs. Flex PCBs introduced versatility to PCB fabrication and rigid-flex combines both for increased performance. Learn more about these board types, their benefits, disadvantages, and applications in this article.
In this episode, we talk about how researchers are bringing affordable space technology to the masses via additive manufacturing along with a manufacturing approach that could serve as the keystone for wide scale use of affordable, semitransparent organic solar cells.
How to overcome the traditional limits of LDS (laser direct structuring) to metallize 2D and 3D objects made from all kinds of surfaces?
A student article explaining how quasioptical framework is advantageous for developing radiative wireless power transfer systems with high efficiency.
Digital imaging giant Teledyne DALSA is one of the most senior residents at High Tech Campus Eindhoven. Using state-of-the-art X-ray detectors for medical, dental and industrial applications their ambition is to be both world and innovation leader in their field.
4 minutes read
It is incredible to see the progress that organic semiconductors (OSC) have made over the past 15-20 years. Ian Jenks explains in this short 5-min presentation how they are removing the long-existing barriers to adoption of OTFT technology.
Gallium-Indium-Tin is an interesting material for stretchable electronics. It can be formed into a non-toxic RoHS-compliant gel and applied to almost any substrate to form stretchable conductive metallizations and circuits.
