This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Bringing a product to market late has a real and negative impact on profits and brand reputation. In this blog, we go through the types of documentation your project requires and ways to streamline processes.
Introducing the Power Management for Tomorrow’s Innovations Series: A new series featuring articles, case studies, and application guides explaining how product designers can build efficient power supplies for various applications.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Bringing a product to market late has a real and negative impact on profits and brand reputation. In this blog, we go through the types of documentation your project requires and ways to streamline processes.
Introducing the Power Management for Tomorrow’s Innovations Series: A new series featuring articles, case studies, and application guides explaining how product designers can build efficient power supplies for various applications.
Article #4 of the Enabling IoT Series. Industrial enterprises are moving to a new approach to asset management, namely predictive maintenance by leveraging powerful new sensors and data.
This article delves into the core variations between PMOS and NMOS, exploring their fundamentals, structural differences, operating principles, and practical applications.
Article #8 of Power Management for Tomorrow’s Innovations Series: Power electronics converters with an efficiency of up to 95% and very low quiescent current can make the Internet of Things devices last for months together.
Article #7 of Power Management for Tomorrow’s Innovations Series: Power supplies utilized in the medical industry must be compact, reliable, long-lasting, and robust.
Article #6 of Power Management for Tomorrow’s Innovations Series: Power supplies for vehicle asset-tracking devices must be designed to operate at different voltage-current levels, be compact, and offer protection during transients and electrical faults.
Article #5 of Power Management for Tomorrow’s Innovations Series: Single-Inductor Multiple-Output (SIMO) architecture enables design engineers to extend the battery life, and reduce the circuit board size for hearables and wearables
Article #4 of Power Management for Tomorrow’s Innovations Series: This article investigates the effect that power designs have on the phase noise of Radio Frequency amplifiers through an experiment comparing the performance of three power regulators at different frequencies.
In this episode, we discuss how a wearable based sensing platform developed by MIT can provide detailed information about a user’s muscle activity and enable virtual physical therapy to increase access for this vital practice.
EHD is a promising digital printing technology for going beyond the resolution limits of inkjet. Most examples showcase electronic or display related applications.
The three themes are closely linked since QDs can be digitally printed as color conversation materials atop blue microLEDs to enable wide color gamut RGB uLED displays without requiring a separate transfer step for each color.. This is an important technology as it simplifies the manufacturing step for microLED and thus removing a major hinderence.
As microLEDs inevitably shrink in size, the micro-bumping requirements for the microLED dies becomes more challenging. Direct wafer-based printing based on gravure offset techniques offers a promising solution in this regard. Indeed, this is another field where printed electronics can play a role.