In the ever-evolving world of processor architectures, the showdown between RISC-V and ARM sparks fervent competition. With their distinct histories, these two giants are redefining computing power and igniting discussions on openness, customization, and innovation in microprocessors.
This article explains the IPC-A-610 standard for electronic assemblies, including solder joints, inspection criteria, product classes, and quality requirements for reliable PCB manufacturing and high-performance electronics.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
This article provides a technical overview of the brushless vs brushed motor paradigm, equipping design engineers with the analytical framework necessary to make informed, application-specific decisions.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
In the ever-evolving world of processor architectures, the showdown between RISC-V and ARM sparks fervent competition. With their distinct histories, these two giants are redefining computing power and igniting discussions on openness, customization, and innovation in microprocessors.
In this episode, we discuss the accidental discovery of how amputees can sense temperature in their phantom limbs and how EPFL researchers have exploited this to develop the first generation of prosthetics that can feel.
Silicon has emerged as the most widely used semiconductor material in the electronic industry, paving the way for the digital age. However, many are still oblivious to the unique properties and characteristics that make silicon ideal for a range of applications. This article explores the fundamentals of semiconductor materials, the properties of silicon that make it a prominent player in the semiconductor industry, and its diverse applications in electronic devices.
Cavitation dispersion process improves the properties of materials used in additive manufacturing of circuits. You will learn how one can control hydrodynamic cavitation to produce unique dispersions, formulated inks & pastes, high aspect ratio nanoparticle & ‘2D’ filler particle masterbatches.
The key enabler for reliable device fabrication in printed electronics is functional inks with tunable electrical properties incl. conductivity, dielectric strength & electrical resistance. Here, you will learn about unique polyimide based pastes able to withstand temperatures up to 300°C.
The demand for compact yet energy-efficient radar sensors for remote vital sign monitoring is witnessing an exponential rise in the healthcare industry for several reasons.
Single-board computers are an increasingly attractive option to shift electricity grid management towards more advanced and less resource consuming smart grids.
Highlights from the 3rd Annual tinyML EMEA Innovation Forum include exploring hardware developments, algorithm optimization, and deploying MLOps tools.
Sensors are ubiquitous in our modern world, playing pivotal roles in numerous sectors. This article delves into their fundamental principles, diverse types, and their significant impact across industries.