This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Edge AI and sensor fusion revolutionize tech by enabling instant, informed decisions through multi-sensor data analysis. Explore their application by building a Smart Running Jacket with Sony Spresense and SensiEDGE CommonSense via Edge Impulse platform.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Edge AI and sensor fusion revolutionize tech by enabling instant, informed decisions through multi-sensor data analysis. Explore their application by building a Smart Running Jacket with Sony Spresense and SensiEDGE CommonSense via Edge Impulse platform.
The Quad Flat No-leads (QFN) package is a type of surface-mount technology (SMT) in the electronics industry known for its compact size and high performance. This comprehensive guide explores its benefits (high performance), applications (mobile devices), and challenges (assembly, soldering).
In the in-depth interview, PI Vice President of Marketing Doug Bailey explains GaN technology and the new possibilities it brings to the power conversion industry.
Researchers have developed a robotic sensor that incorporates artificial intelligence techniques to read braille at speeds roughly double that of most human readers.
QFN packages are leadless and have short interconnects that reduce parasitic elements such as inductance and capacitance. How do they compare to other surface-mount ICs?
In this episode, we discuss the shortcomings of previous attempts at making flexible wearable sensors and how researchers at CalTech have addressed them to create high performance stress sensor stickers.
This detailed guide will cover the fundamentals of SMT vs SMD, and THT, exploring their working principle, advantages and disadvantages, comparative analysis, and choosing the right one for electronics assembly.
At recent 2023 Consumer Electronics Show (CES), Sony and Honda revealed their first electric vehicle prototype, which is equipped with 45 cameras and sensors, as well as Electric Rearview Mirrors.
In the world of printed electronics, surface energy often comes up around the interactions of materials, specifically when we’re printing conductive inks onto various surfaces (substrates).
As cars shift to automated driving, In-Cabin Monitoring Systems (ICMS) are vital for passenger safety and comfort. Incorporating Time-of-Flight cameras and radar sensors enables ICMS to detect occupants and their behaviors promising a safe and personalized automotive experience.