This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
The electrical isolation procedure is a process that ensures electrical equipment has been safely, securely and properly disconnected from the power source.
Plasma cleaning is a high-tech surface treatment that uses ionized gas to remove microscopic contaminants, enhancing adhesion and durability in materials. This article explains plasma cleaning’s role across industries, its eco-friendly benefits, and emerging trends in sustainable manufacturing.
Gallium nitride (GaN) offers superior efficiency and power density, with reliability assessed using the "bathtub curve" to predict and prevent failures from defects, overstress, and aging.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
The electrical isolation procedure is a process that ensures electrical equipment has been safely, securely and properly disconnected from the power source.
Plasma cleaning is a high-tech surface treatment that uses ionized gas to remove microscopic contaminants, enhancing adhesion and durability in materials. This article explains plasma cleaning’s role across industries, its eco-friendly benefits, and emerging trends in sustainable manufacturing.
Gallium nitride (GaN) offers superior efficiency and power density, with reliability assessed using the "bathtub curve" to predict and prevent failures from defects, overstress, and aging.
Spatial computing is revolutionizing the interaction between the digital world and the physical world, creating immersive experiences where virtual elements blend seamlessly with reality.
The first project is developing light-based chips to bridge the gap between photonics and electronics. The second project plans to make blood cells using blood stem cells. The two projects are the first ERC Synergy grants for TU/e.
The "smart home" is a near future housing concept that utilizes advanced information processing technologies to improve the efficiency and prosperity of life.
Large language models (LLMs) are increasingly automating tasks like translation, text classification and customer service. But tapping into an LLM’s power typically requires users to send their requests to a centralized server — a process that’s expensive, energy-intensive and often slow.
From AI-powered manufacturing to sustainable mobility solutions, Electronica 2024 revealed how electronics are paving the way to a carbon-neutral world. This year’s record-breaking event featured game-changing technologies and fostered collaboration across the global industry.
Thin film deposition applies material layers at the atomic/molecular level, vital for advancing electronics, energy, and aerospace. Key methods like CVD, PVD, and ALD enhance material properties, driving innovations in semiconductors, solar cells, and precision tech.
Due to their consistent brightness, low cost and high energy efficiency, electroluminescent inks are used in a wide range of electroluminescent display applications. This project is an example of printing an electroluminescent ink on soft and flexible substrates.
This article will discuss the different post-processing methods and their impact on dimensional accuracy, helping you navigate potential challenges and ensuring your designs achieve the precision and quality they require.
Kapsula is an innovative solution designed to provide extreme protection for electronic devices in harsh environments. Utilizing advanced materials like polyphenylene sulfide reinforced with carbon fiber (PPS CF), Kapsula offers unparalleled durability against physical impacts, high temperatures