This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This is the definitive technical comparison between Junction Field-Effect Transistors and metal-oxide Semiconductor Field-Effect Transistors. This in-depth analysis covers operational physics, performance metrics, and practical implementation guidelines for electronic design engineers.
A comprehensive technical analysis of PCB prepreg and core materials, examining their distinct material properties, manufacturing implications, and selection criteria for multilayer PCB design.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
This is the definitive technical comparison between Junction Field-Effect Transistors and metal-oxide Semiconductor Field-Effect Transistors. This in-depth analysis covers operational physics, performance metrics, and practical implementation guidelines for electronic design engineers.
A comprehensive technical analysis of PCB prepreg and core materials, examining their distinct material properties, manufacturing implications, and selection criteria for multilayer PCB design.
Project CETI and Harvard have established a new reinforcement learning framework for rendezvous with whales using autonomous robots, combining sensing from diverse sensor streams
This article explores the role of biocompatible inks in bioelectronics, particularly within Direct Ink Writing (DIW) systems and forecasts future trends and challenges in on-body and in-body bioelectronic technologies over the next decade.
This article explores the principles behind optical encoders, their types, and their advantages, highlighting how they enhance performance, ensure accuracy, and meet demanding standards in complex control environments.
Semiconductors play a pivotal role in shaping our everyday experiences. From the vehicles we drive to the devices we use, semiconductors are omnipresent, enabling functionalities in computers, smartphones, and various industrial automation technologies.
This article introduces two sensing products. One enables wireless monitoring of water leaks, while the other allows monitoring of humidity and temperature in critical electronics.
Photoresist, a light-sensitive material, is essential in photolithography for transferring intricate circuit patterns onto semiconductor wafers. This article explores positive vs. negative photoresists, detailing their chemical mechanisms, processing parameters, and performance traits.
In this technical article, we will explore what are schematics, their purpose, diverse types, critical applications and how to read and interpret them effectively.
Explore Voltera's innovative project to create a seven-layer magnesium-zinc battery using printable technology. Developed with Saral Designs and employing the NOVA system, the project focuses on building lightweight, flexible, and environmentally friendly batteries on PET substrates.