This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Diabetes leads to nerve damage in half of all people affected, starting in the feet. The smart sock from ETH spin-off MYNERVA helps sufferers feel the ground again when walking and alleviates their chronic pain.
Understanding how to calculate power in electrical, mechanical and digital systems is essential for designing energy efficient circuits and machines. This guide combines theory, formulas and practical measurement methods to equip digital design engineers, hardware engineers and electronics
Learn everything about the MOSFET symbol, from what its shapes and arrows mean to how it is used in digital design and power electronics. This article covers NMOS/PMOS symbols, modes, intrinsic body diodes, selection criteria, modern FinFET, wide bandgap devices, and the latest market trends.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Diabetes leads to nerve damage in half of all people affected, starting in the feet. The smart sock from ETH spin-off MYNERVA helps sufferers feel the ground again when walking and alleviates their chronic pain.
Understanding how to calculate power in electrical, mechanical and digital systems is essential for designing energy efficient circuits and machines. This guide combines theory, formulas and practical measurement methods to equip digital design engineers, hardware engineers and electronics
Learn everything about the MOSFET symbol, from what its shapes and arrows mean to how it is used in digital design and power electronics. This article covers NMOS/PMOS symbols, modes, intrinsic body diodes, selection criteria, modern FinFET, wide bandgap devices, and the latest market trends.
ROHM's "Quality First" philosophy places continuous quality assurance and attention to detail at the core of product development. The proactive approach to quality fosters reliability, drives continuous improvement, and strengthens customer trust.
A technical deep dive into the NMOS symbol, working, and device behavior, contribution in analog design and advanced NMOS technologies in the modern age.
An insight into applying color codes for electrical applications. This guide enlightens engineers and designers about standard color codes for resistors, inductors, capacitors, network cabling and power wiring to help improve accuracy, safety and maintainability in design projects.
This technical article explains, what is HBM, detailing its 3D-stacked architecture, the critical role of advanced packaging, and its application in modern GPUs, AI accelerators, and embedded systems.
When designing a printed circuit board (PCB), one of the most critical aspects to consider is the spacing between conductive elements, such as traces and pads.
Cornell researchers have built a programmable optical chip that can change the color of light by merging photons, without requiring a new chip for new colors.
EV on-board chargers require precise protection against overvoltage, overcurrent, electric shock, and thermal stress. TDK delivers dedicated solutions across these domains to enhance safety, reliability, and compliance in high-voltage automotive systems.