Carnegie Mellon University collaborators pioneer the CMU Array—a customizable, 3D nano-printed, ultra-high-density microelectrode array platform for next-generation brain-computer interfaces. This technology can transform the way doctors are able to treat neurological disorders.
Carnegie Mellon University collaborators pioneer the CMU Array—a customizable, 3D nano-printed, ultra-high-density microelectrode array platform for next-generation brain-computer interfaces. This technology can transform the way doctors are able to treat neurological disorders.
Article #2 of the "Why Edge?" Series. Edge AI increases battery life, reduces latency, and in many cases, eliminates the need for cloud communication, making wearable devices more user-friendly and secure.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
A crystal oscillator is an electronic circuit that uses a quartz crystal to produce a precise and stable frequency reference. This article covers crystal operation, equivalent circuit models, resonance, load capacitance, oscillator topologies, stability, aging, and design practices.
Carnegie Mellon University collaborators pioneer the CMU Array—a customizable, 3D nano-printed, ultra-high-density microelectrode array platform for next-generation brain-computer interfaces. This technology can transform the way doctors are able to treat neurological disorders.
Article #2 of the "Why Edge?" Series. Edge AI increases battery life, reduces latency, and in many cases, eliminates the need for cloud communication, making wearable devices more user-friendly and secure.
For the length of human history, technology has played an important role in preventing theft. Before car keys, Henry Ford had to chain his car to a lamppost to avoid anyone with the strength to turn a physical crank from stealing it.
Printed batteries offer thinness and flexibility, enabling new applications, but their production is deceivingly complex. Gunter Hübner from Stuttgart Media University offered some insights at the e-Swiss conference last week.
Experimenting in the world of Flexible Hybrid Electronics (FHE) comes with a variety of hurdles. Printing technologies are vastly different in terms of materials compatibility and have pros and cons that make them suitable for particular applications. Choosing materials that match the printing technology you intend to use is the most important decision you’re going to make.
But what if one could print, digitally, using any paste and ink on any substrate? Read more
Researchers have designed smart, colour-controllable white light devices from quantum dots, tiny semiconductors just a few billionths of a metre in size, which are more efficient and have better colour saturation than standard LEDs, and can dynamically reproduce daylight conditions in a single light
The pace of change in consumer electronics has always been fast which poses its own challenges for manufacturers. Here we take a look at 7 trends that will shape the future of product development and manufacturing in the industry…
Integrated circuit (IC) package types encompass a range of protective enclosures designed to shield semiconductor components from physical damage and corrosion. This article explores the various classifications of IC packages, each tailored to specific requirements and applications.
Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.