A new method safely extracts valuable metals locked up in discarded electronics and low-grade ore using dramatically less energy and fewer chemical materials than current methods, report University of Illinois Urbana-Champaign researchers in the journal Nature Chemical Engineering.
Hackers can access sensitive data and disrupt device operations by activating embedded malware or hardware trojans in counterfeit components. How can you avoid these issues?
R2R Sputtering + Direct Laser Patterning is a great way to create large-area circuits on flexible circuits, even with materials such as graphene or MoS2. The technology R2R produces high-quality uniform films on large substrates whilst the laser forms precision circuit patterns without photolith.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
This article provides a technical overview of the brushless vs brushed motor paradigm, equipping design engineers with the analytical framework necessary to make informed, application-specific decisions.
This article explains the IPC-A-610 standard for electronic assemblies, including solder joints, inspection criteria, product classes, and quality requirements for reliable PCB manufacturing and high-performance electronics.
A complete technical guide to buck converters covering operating principles, CCM and DCM, synchronous vs. asynchronous designs, component selection, control methods, PCB layout, and common troubleshooting issues.
This in depth article explores the theoretical foundation and practical considerations of connecting inductor in series for engineers and electronics students. Learn how series inductance works, why it increases total inductance, how mutual coupling affects it and how to design effective filters.
Learn how Altium Agile Teams enables secure hardware collaboration with centralized identity, role-based access, and full traceability — so teams can scale without sacrificing speed or control.
A new method safely extracts valuable metals locked up in discarded electronics and low-grade ore using dramatically less energy and fewer chemical materials than current methods, report University of Illinois Urbana-Champaign researchers in the journal Nature Chemical Engineering.
Hackers can access sensitive data and disrupt device operations by activating embedded malware or hardware trojans in counterfeit components. How can you avoid these issues?
R2R Sputtering + Direct Laser Patterning is a great way to create large-area circuits on flexible circuits, even with materials such as graphene or MoS2. The technology R2R produces high-quality uniform films on large substrates whilst the laser forms precision circuit patterns without photolith.
This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.
This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.
Multi-material printing without inks? The technology’s on-demand and in-situ nanoparticle generation and real-time sintering capability allow the printing of various electronics and functional devices with pure, multifunctional, hybrid materials printing - without inks and with bulk properties!
Adequate component spacing is typically not high on the PCB designer's list of priorities, but oversights can be frustrating and could demand substantial re-work. Here we look at an example, give general guidelines and look at how tools can be used to educate designers and save time.
The world is witnessing a rise in more electric aircraft (MEA) where only the propulsion remains fuel-driven and other subsystems are electric rather than hydraulic or pneumatic. Find out what this change means for EEs.
Engineers, researchers, entrepreneurs, inventors, and end users are invited to join TechBlick Innovations Festival, exploring additive, printed, 3D, and wearable electronics on 25 April 2024 online.
This article provides a detailed understanding of microprocessor vs integrated circuit, their basics, key differences, future trends, challenges, and how they synergize to form the backbone of our digital systems.
Stanford researchers have developed soft integrated circuits that are powerful enough to drive a micro-LED screen and small enough to read thousands of sensors in a single square centimeter.
Understanding circuit board components is essential. It's key to creating and fixing gadgets in our tech-filled world. In this article, we’ll explore popular circuit board components and various techniques to identify them.
Parker and Stephen chat with James Lewis (aka the Bald Engineer) about constructing a functional computer based on the Apple II GS's Mega II chip, and also announce a contest sponsored by Mouser!
A microvia connects layers in HDI substrates and PCBs, enabling high input/output density in advanced packages. This article delves into the role and significance of microvias in modern electronics, exploring their impact on device miniaturization and functionality.