This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Princeton researchers have combined brain cells and advanced electronics into a 3D device that can be programmed to recognize patterns using computational techniques.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Princeton researchers have combined brain cells and advanced electronics into a 3D device that can be programmed to recognize patterns using computational techniques.
Discover how Industry 4.0, 5.0, and AI are transforming control panels into intelligent, secure, and scalable systems for modern industrial automation.
An interview with Ryan Smart, VP of Product at Harwin, discussing the challenges of shielding in high-reliability connectors, high-current design trends, and the hybrid power-and-signal connector layouts.
Learn how edge AI in wireless vibration sensors improves machine health monitoring, extends battery life, and enables smarter predictive maintenance in factories.
This article explains the IPC-A-610 standard for electronic assemblies, including solder joints, inspection criteria, product classes, and quality requirements for reliable PCB manufacturing and high-performance electronics.
Understanding gate-driver fundamentals, architectures, drive techniques for SiC MOSFETs and GaN HEMTs, protection features, key specifications, and selection guidance for modern power electronics.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
This article presents a comprehensive engineering guide to Hall Effect Sensors, covering theoretical foundations, device structures, sensor types, specifications, applications, and practical integration strategies for modern electronic system design.
Practical and architectural insights into IoT gateways, including edge versus cloud placement, protocol translation, data aggregation, hardware designs, and deployment patterns for industrial IoT.