This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Ion milling is a material etching technique used extensively in modern manufacturing and research. It involves the bombardment of a sample with charged particles, called ions, to remove material from the surface in a controlled manner. This article explores the fundamental principles of ion milling, the various techniques used, the equipment required, and its applications in different fields.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Ion milling is a material etching technique used extensively in modern manufacturing and research. It involves the bombardment of a sample with charged particles, called ions, to remove material from the surface in a controlled manner. This article explores the fundamental principles of ion milling, the various techniques used, the equipment required, and its applications in different fields.
In this article, we will delve into the structure and operation of NMOS and PMOS transistors, and discuss the applications and characteristics of these essential components in electronic circuits.
Research from elite athletes informs the design of these robust and adaptable prosthetics. We interview researcher Tijmen Seignette, about his ambitions to change how we approach prosthetic design.
Article #1 of Transforming Industrial Manufacturing with Industry 4.0 Series: Advancements in less-glamorized technologies like sensing, Programmable Logic Controllers, low-power components, and vision systems have played important roles in the rapid progression of Manufacturing 4.0.
Columbia Engineers design a robot hand that is the first device of its kind to join advanced sense of touch with motor-learning algorithms — it doesn’t rely on vision to manipulate objects
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.
In today's interconnected world, network topologies play a crucial role in determining the efficiency and reliability of communication between devices. One such network topology is the bus topology, known for its simplicity and cost-effectiveness. In this comprehensive guide, we will delve deeper into bus topology, exploring its advantages, disadvantages, applications, and the future of this network design.
This free-to-attend, immersive virtual event, on 22 June 2023 will cover all aspects of flexible and printed electronics, from material advancements to the development of novel deposition and manufacturing technologies.