Introducing the Power Management for Tomorrow’s Innovations Series: A new series featuring articles, case studies, and application guides explaining how product designers can build efficient power supplies for various applications.
As wearable electronic devices continue to be more prevalent, it becomes an ever-greater challenge for companies that manufacture them to keep their competitive edge. It is vitally important for manufacturers that each device is effective, cost-efficient and reflects the highest quality available.
This technical guide provides a comparative analysis of step-up and step-down transformers covering turns ratio, grid voltage levels, design parameters, autotransformers, buck-boost configurations, efficiency standards and selection criteria.
This article is a comprehensive technical guide to relay wiring diagrams, covering 4-pin and 5-pin configurations, working principles, safety practices, standards, and advanced relay applications in modern systems.
Explore how frequency shapes EMC behavior from RF emissions to ultra-low-frequency drift, with mitigation strategies for robust, compliant electronic system design.
This article provides a technical overview of the brushless vs brushed motor paradigm, equipping design engineers with the analytical framework necessary to make informed, application-specific decisions.
Learn how USB 3.2 Gen 2x1 delivers 10Gbps high-speed performance with simpler single-lane routing, lower power consumption, and easier PCB design for embedded, FPGA, and industrial systems.
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
In this episode, we talk about the engineers that built a wireless tag that detects and remembers overheating without a chip or a battery, enabling cold-chain monitoring without creating electronic waste.
Introducing the Power Management for Tomorrow’s Innovations Series: A new series featuring articles, case studies, and application guides explaining how product designers can build efficient power supplies for various applications.
As wearable electronic devices continue to be more prevalent, it becomes an ever-greater challenge for companies that manufacture them to keep their competitive edge. It is vitally important for manufacturers that each device is effective, cost-efficient and reflects the highest quality available.
In this episode, we discuss how a wearable based sensing platform developed by MIT can provide detailed information about a user’s muscle activity and enable virtual physical therapy to increase access for this vital practice.
EHD is a promising digital printing technology for going beyond the resolution limits of inkjet. Most examples showcase electronic or display related applications.
Nano-Ops is commercialising an automated wafer-based process and fab-in-a-box based on the directed assembly technology which can 'print' features down to 20nm.
Here, In the first step a pattern is first etched into a template wafer.
To scale up microLED displays to large areas, smaller displays can be titled. Because microLEDs can be truely edge-less devices, the tiling can function, yielding a seemless look.
Stretchable Electronics and inks for durable wearable electronics. These inks can be printed on TPU films which can be bonded to fabrics. This results in devices that stretch without cracking and maintain excellent electrical properties. Examples include biometric sensors & fixed resistance heaters
Silver nanoparticle inks improve every year. These improvements are often incremental, but very important. One ever-present direction of development is towards inks which offer ever higher conductivity levels at a low curing temperature and a short curing time. This a critical figure of merit because it opens more substrate choices, saves time, and lowers energy consumption costs.
This article explores the key differences between active and passive filters, detailing their transfer functions, frequency responses, components, circuit configurations, stability, design challenges, approximation methods, and CAD tools for filter simulation and optimization.
Circuit card assemblies (CCA) give birth to a complete printed circuit board (PCB) after assembling every component. A printed circuit board has no electrical components and needs to go through a manufacturing process called circuit card assemblies which are the complete board assembly.
Carnegie Mellon University collaborators pioneer the CMU Array—a customizable, 3D nano-printed, ultra-high-density microelectrode array platform for next-generation brain-computer interfaces. This technology can transform the way doctors are able to treat neurological disorders.
Printed batteries offer thinness and flexibility, enabling new applications, but their production is deceivingly complex. Gunter Hübner from Stuttgart Media University offered some insights at the e-Swiss conference last week.
Experimenting in the world of Flexible Hybrid Electronics (FHE) comes with a variety of hurdles. Printing technologies are vastly different in terms of materials compatibility and have pros and cons that make them suitable for particular applications. Choosing materials that match the printing technology you intend to use is the most important decision you’re going to make.
But what if one could print, digitally, using any paste and ink on any substrate? Read more