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If the transition to renewables is to succeed, we will need a viable means of storing surplus heat and electricity. Globe spoke to experts from ETH Zurich about the promising technologies that could help us reach net zero.
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The Guide to Understanding the Technologies Defining the Next Phase of Edge AI
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Featured
The collaborative nature of open source projects brings together people across the world to work towards improving and monitoring our natural resources.
Featured
The device could help scientists explore unknown regions of the ocean, track pollution, or monitor the effects of climate change.
Engineers Wiki. Most Asked Questions.
This article provides a comprehensive overview of motor controllers, covering definitions, types, control strategies, design considerations, selection guidelines, and emerging trends.
ORGANIZATIONS. SHAPING THE INDUSTRY.
Mouser Electronics
Electronics
Mouser Electronics is a worldwide leading authorized distributor of semiconductors and electronic components.
219 Posts
TAGGED WITH flexible electronics
Explore how first-principles engineering and human judgment shape reliable high-voltage IC design, from yield thinking to long-term system lifetime and root-cause discipline.
How data-driven material decisions keep production moving amid supply chain disruption and material scarcity
Discover how component miniaturization powers next-generation medical devices and implantables, improving portability, reliability, and lifespan.
This article explains what is LDO, how the LDO regulator works, discusses key specifications such as dropout voltage, line/load regulation, noise, and PSRR, and shows how to select and design with LDOs to meet demanding engineering requirements.
TAGGED WITH microchips
The integrated design achieves accurate micro gas chromatography and can help reduce the cost of monitoring chemical synthesis, natural gas pipelines or at-home air quality.
Hybrid bonding provides the adhesive free, copper to copper interconnects that are driving cutting edge 3D chip stacking. This article explains the theory, process, benefits, challenges, applications, and emerging trends of hybrid bonding for engineers.
How SimpleChips designs high-voltage silicon for systems that must perform reliably over decades?
In this episode, we talk about the engineers that built a wireless tag that detects and remembers overheating without a chip or a battery, enabling cold-chain monitoring without creating electronic waste.
Latest Posts
If the transition to renewables is to succeed, we will need a viable means of storing surplus heat and electricity. Globe spoke to experts from ETH Zurich about the promising technologies that could help us reach net zero.
9 minutes read
The collaborative nature of open source projects brings together people across the world to work towards improving and monitoring our natural resources.
The device could help scientists explore unknown regions of the ocean, track pollution, or monitor the effects of climate change.
The pace of change in consumer electronics has always been fast which poses its own challenges for manufacturers. Here we take a look at 7 trends that will shape the future of product development and manufacturing in the industry…
4 minutes read
Integrated circuit (IC) package types encompass a range of protective enclosures designed to shield semiconductor components from physical damage and corrosion. This article explores the various classifications of IC packages, each tailored to specific requirements and applications.
Into the future, more transport companies may start to integrate wastewater monitoring systems to manage these key facilities effectively. But this opportunity isn’t only limited to transport – any water monitoring capabilities can help reduce waste, and save energy, time and resources.
3 minutes read
The German Aerospace Center (DLR) is researching the infrastructure and railway operational framework conditions, working on new, capacity-increasing concepts for vehicles, operations and infrastructure, as well as innovative methods for maintenance and servicing.
7 minutes read
The ZEUS laser at the University of Michigan has begun its commissioning experiments
4 minutes read
International team develops device for continuous, wireless nitric oxide monitoring
3 minutes read
Chips and wafers are the integral components of a semiconductor device. Find out the differences between chip wafers and chips and understand their role in semiconductor manufacturing.
Solder flux has a large impact on final product quality. This article reviews how to use flux during soldering and how to decide on the right technology options for your project.
4 minutes read
Sometimes manufacturers would like to install heating in objects that are difficult to heat. The armrest of your car. Your sporty winter coat. Bags for food delivery. Sleeping bags. etc This has been difficult to achieve until now. Read more about printed heater technology
2 minutes read
Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
In the Providentia++ project, researchers at the Technical University of Munich (TUM) have worked with industry partners to develop a technology to complement the vehicle perspective based on onboard sensor input with a bird’s-eye view of traffic conditions. This improves road safety – also for autonomous driving.
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.
5 minutes read
