This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Silicon Carbide (SiC) wafers are specialized materials employed in semiconductor technology, crafted from silicon carbide. This article explores the advent of silicon carbide (SiC) wafers and how it has opened up new possibilities in power electronics.
Discover the Qoitech Otii Arc Pro, the ultimate power analysis tool for enhancing device energy efficiency. Learn how its precision, user-friendly interface, and unique battery optimization features can transform your electronic design and development projects for the better.
Discover the science behind EMI shielding and its crucial role in ensuring the reliability and performance of electronic devices across various industries.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Silicon Carbide (SiC) wafers are specialized materials employed in semiconductor technology, crafted from silicon carbide. This article explores the advent of silicon carbide (SiC) wafers and how it has opened up new possibilities in power electronics.
Discover the Qoitech Otii Arc Pro, the ultimate power analysis tool for enhancing device energy efficiency. Learn how its precision, user-friendly interface, and unique battery optimization features can transform your electronic design and development projects for the better.
Discover the science behind EMI shielding and its crucial role in ensuring the reliability and performance of electronic devices across various industries.
This article delves into the various types of printed circuit boards, their fundamental concepts, structures, manufacturing processes, and advanced PCB technologies, highlighting their advantages, limitations, and typical applications.
EPFL researchers are targeting the next generation of soft actuators and robots with an elastomer-based ink for 3D printing objects with locally changing mechanical properties, eliminating the need for cumbersome mechanical joints.
To excel in the fast-paced electronics industry, you need not just adaptability, but a cultivated expertise to discern the far-reaching impact of your design decisions. This eBook is your key to building such expertise.
Explore the transformative potential of the ROCK 3 Compute Module in revolutionizing pipeline inspection. Discover the power and versatility of this innovative solution, designed to enhance safety, efficiency, and operational excellence in infrastructure maintenance.
R2R Sputtering + Direct Laser Patterning is a great way to create large-area circuits on flexible circuits, even with materials such as graphene or MoS2. The technology R2R produces high-quality uniform films on large substrates whilst the laser forms precision circuit patterns without photolith.
Murata Manufacturing (Murata) has developed a technology that has the potential to enable ultrasonic scans, which are presently used to view the fetus within the uterus, to be used to view the brain within the cranium.
Multi-material printing without inks? The technology’s on-demand and in-situ nanoparticle generation and real-time sintering capability allow the printing of various electronics and functional devices with pure, multifunctional, hybrid materials printing - without inks and with bulk properties!
Duru Uluk, a Voltera test engineering intern, created an induction mug heater using in-mold electronics (also known as in-mold structural electronics).
Magnetism is a force exerted by charged particles in motion that allows them to attract/repel other moving charged particles. The universal phenomenon is responsible for shaping the world as we know it.