This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Engineers, researchers, entrepreneurs, inventors, and end users are invited to join TechBlick Innovations Festival, exploring additive, printed, 3D, and wearable electronics on 25 April 2024 online.
The world is witnessing a rise in more electric aircraft (MEA) where only the propulsion remains fuel-driven and other subsystems are electric rather than hydraulic or pneumatic. Find out what this change means for EEs.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Engineers, researchers, entrepreneurs, inventors, and end users are invited to join TechBlick Innovations Festival, exploring additive, printed, 3D, and wearable electronics on 25 April 2024 online.
The world is witnessing a rise in more electric aircraft (MEA) where only the propulsion remains fuel-driven and other subsystems are electric rather than hydraulic or pneumatic. Find out what this change means for EEs.
Selecting the right microcontroller (MCU) is crucial in embedded systems engineering, as it significantly influences the system's performance, power consumption, and overall success.
Understanding circuit board components is essential. It's key to creating and fixing gadgets in our tech-filled world. In this article, we’ll explore popular circuit board components and various techniques to identify them.
This article provides a detailed understanding of microprocessor vs integrated circuit, their basics, key differences, future trends, challenges, and how they synergize to form the backbone of our digital systems.
Stanford researchers have developed soft integrated circuits that are powerful enough to drive a micro-LED screen and small enough to read thousands of sensors in a single square centimeter.
A microvia connects layers in HDI substrates and PCBs, enabling high input/output density in advanced packages. This article delves into the role and significance of microvias in modern electronics, exploring their impact on device miniaturization and functionality.
New, highly stretchable sensors can monitor and transmit plant growth information without human intervention, report University of Illinois Urbana-Champaign researchers in the journal Device.
The Defense Department’s largest research organization has partnered with a Princeton-led effort to develop advanced microchips for artificial intelligence.
Parker and Stephen chat with James Lewis (aka the Bald Engineer) about constructing a functional computer based on the Apple II GS's Mega II chip, and also announce a contest sponsored by Mouser!
This article is a practical guide to RF PCB materials, controlled impedance, stackup design, manufacturing processes, signal integrity, and 5G mmWave techniques for achieving reliable, low-loss high-frequency performance.
In this episode, we discuss a novel sticker capable of monitoring the health of organs in real time allowing for more successful organ transplants and catching signs of diseases earlier than ever!
Printed electronics, characterized by their low cost and versatility through processes like inkjet or screen printing, are pivotal in advancing technologies such as wearable tech and the Internet of Things.