This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
R2R Sputtering + Direct Laser Patterning is a great way to create large-area circuits on flexible circuits, even with materials such as graphene or MoS2. The technology R2R produces high-quality uniform films on large substrates whilst the laser forms precision circuit patterns without photolith.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
R2R Sputtering + Direct Laser Patterning is a great way to create large-area circuits on flexible circuits, even with materials such as graphene or MoS2. The technology R2R produces high-quality uniform films on large substrates whilst the laser forms precision circuit patterns without photolith.
Murata Manufacturing (Murata) has developed a technology that has the potential to enable ultrasonic scans, which are presently used to view the fetus within the uterus, to be used to view the brain within the cranium.
Multi-material printing without inks? The technology’s on-demand and in-situ nanoparticle generation and real-time sintering capability allow the printing of various electronics and functional devices with pure, multifunctional, hybrid materials printing - without inks and with bulk properties!
Duru Uluk, a Voltera test engineering intern, created an induction mug heater using in-mold electronics (also known as in-mold structural electronics).
Magnetism is a force exerted by charged particles in motion that allows them to attract/repel other moving charged particles. The universal phenomenon is responsible for shaping the world as we know it.
To make AI as smart as the butterflies, a team of Penn State researchers has created a multi-sensory AI platform that is both more advanced and uses less energy than other AI technologies.
A new method safely extracts valuable metals locked up in discarded electronics and low-grade ore using dramatically less energy and fewer chemical materials than current methods, report University of Illinois Urbana-Champaign researchers in the journal Nature Chemical Engineering.
Hackers can access sensitive data and disrupt device operations by activating embedded malware or hardware trojans in counterfeit components. How can you avoid these issues?
This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.
This comprehensive series delves into the fundamentals of PCB design, including design workflow, signal integrity, manufacturing, testing and debugging, advanced design techniques, and the latest software and tools available for PCB design.
The coming years will see a surge in Edge AI advancements, driven by real-time, efficient, and privacy-focused AI applications, alongside innovations in Wi-Fi and IoT, marking a promising future shaped by researchers, industry leaders, and open-source contributions.
Discover how the AI-powered Tiny Code Reader by Useful Sensors revolutionises data input and verification tasks, offering unparalleled efficiency and accuracy. Explore the benefits for businesses and developers in integrating this cutting-edge technology into their operations.