This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Using an ultrasensitive photonic crystal, TU/e researchers were able to detect single particles down to 50 nanometers in diameter. The new research has just been published in the journal Optica.
The miniaturization of electronics is widely attributed to advances in semiconductor technology as observed by Moore’s Law, but many overlook the design and manufacturing challenges involved in utilizing small device packages such as ball grid arrays.
A comprehensive exploration of open circuits, detailing their characteristics, detection methods, and the pivotal role they play in modern engineering systems.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Using an ultrasensitive photonic crystal, TU/e researchers were able to detect single particles down to 50 nanometers in diameter. The new research has just been published in the journal Optica.
The miniaturization of electronics is widely attributed to advances in semiconductor technology as observed by Moore’s Law, but many overlook the design and manufacturing challenges involved in utilizing small device packages such as ball grid arrays.
A comprehensive exploration of open circuits, detailing their characteristics, detection methods, and the pivotal role they play in modern engineering systems.
This article delves into the innovative world of flexible printed circuit boards, uncovering their design, advancements, and transformative role in modern engineering applications.
This guide explores the crucial factors in capacitor polarity, its mathematical analysis, identification, and advanced practices for improved circuit performance.
Wire Electrical Discharge Machining (Wire EDM) has revolutionized precision machining, empowering manufacturers to tackle with intricacies in aerospace, medical devices, and electronics. This latest technology pushes boundaries with its ability to create complex shapes and achieve point accuracy.
Properties and application of paste technology for noise reduction in high frequency (110-170 GHz) electronic devices and packaging . This is a dispensable material can be easily installed in narrow spaces, suppressing noise inside electronic devices used in beyond 5G/6G
Transitioning from Lab-scale in Printed Electronics: Going from lab and pilot equipment to rotary screen printing. Learn about example applications in printed low-power displays for use in retail as well as cost-per unit calculation comparing flat-bed vs. rotary screen printing for mass production
Explore the different types of solder, their unique properties, and their critical roles in various engineering applications. Understand how to choose the right solder for your project and the considerations involved.
Low-cost, wearable sensors could increase access to care for patients with Parkinson’s disease. New machine-learning approaches and a baseline of data from healthy older adults improve the accuracy of the results from such sensors
This article delves into the fundamentals of EMI gaskets, types, and their critical role in protecting electronic devices and ensuring optimal performance in various engineering applications.