This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Wire Electrical Discharge Machining (Wire EDM) has revolutionized precision machining, empowering manufacturers to tackle with intricacies in aerospace, medical devices, and electronics. This latest technology pushes boundaries with its ability to create complex shapes and achieve point accuracy.
Properties and application of paste technology for noise reduction in high frequency (110-170 GHz) electronic devices and packaging . This is a dispensable material can be easily installed in narrow spaces, suppressing noise inside electronic devices used in beyond 5G/6G
Transitioning from Lab-scale in Printed Electronics: Going from lab and pilot equipment to rotary screen printing. Learn about example applications in printed low-power displays for use in retail as well as cost-per unit calculation comparing flat-bed vs. rotary screen printing for mass production
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Wire Electrical Discharge Machining (Wire EDM) has revolutionized precision machining, empowering manufacturers to tackle with intricacies in aerospace, medical devices, and electronics. This latest technology pushes boundaries with its ability to create complex shapes and achieve point accuracy.
Properties and application of paste technology for noise reduction in high frequency (110-170 GHz) electronic devices and packaging . This is a dispensable material can be easily installed in narrow spaces, suppressing noise inside electronic devices used in beyond 5G/6G
Transitioning from Lab-scale in Printed Electronics: Going from lab and pilot equipment to rotary screen printing. Learn about example applications in printed low-power displays for use in retail as well as cost-per unit calculation comparing flat-bed vs. rotary screen printing for mass production
Explore the different types of solder, their unique properties, and their critical roles in various engineering applications. Understand how to choose the right solder for your project and the considerations involved.
Low-cost, wearable sensors could increase access to care for patients with Parkinson’s disease. New machine-learning approaches and a baseline of data from healthy older adults improve the accuracy of the results from such sensors
This article delves into the fundamentals of EMI gaskets, types, and their critical role in protecting electronic devices and ensuring optimal performance in various engineering applications.
Silicon Carbide (SiC) wafers are specialized materials employed in semiconductor technology, crafted from silicon carbide. This article explores the advent of silicon carbide (SiC) wafers and how it has opened up new possibilities in power electronics.
Discover the Qoitech Otii Arc Pro, the ultimate power analysis tool for enhancing device energy efficiency. Learn how its precision, user-friendly interface, and unique battery optimization features can transform your electronic design and development projects for the better.
Discover the science behind EMI shielding and its crucial role in ensuring the reliability and performance of electronic devices across various industries.
This article delves into the various types of printed circuit boards, their fundamental concepts, structures, manufacturing processes, and advanced PCB technologies, highlighting their advantages, limitations, and typical applications.
EPFL researchers are targeting the next generation of soft actuators and robots with an elastomer-based ink for 3D printing objects with locally changing mechanical properties, eliminating the need for cumbersome mechanical joints.
To excel in the fast-paced electronics industry, you need not just adaptability, but a cultivated expertise to discern the far-reaching impact of your design decisions. This eBook is your key to building such expertise.
Explore the transformative potential of the ROCK 3 Compute Module in revolutionizing pipeline inspection. Discover the power and versatility of this innovative solution, designed to enhance safety, efficiency, and operational excellence in infrastructure maintenance.