This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
Have you considered how modern communication systems, like GSM networks, satellite communications, and broadcasting, manage multiple signals with precision? RF diplexers and duplexers make seamless signal sharing and optimal performance possible. Let’s explore the technology in this article.
Semiconductor nanodevices are tiny electronic components crucial in modern electronics due to their smaller size and improved performance. These devices enable faster processors, higher-density memory, and more efficient energy consumption.
Efficient antenna technology is critical for IoT, smart metering, and industrial connectivity. This article explores how omnidirectional antennas are now in demand to simplify designs and enhance performance.
A PEM fuel cell converts hydrogen and oxygen into electricity at around 80 degrees C, with water and heat as the only products. This guide covers electrochemistry, layer materials, efficiency limits, and cost and durability to help you understand the practical applications of this technology.
A guide covering the full radio-frequency design workflow, starting from setting specifications and choosing topologies to matching, simulation, layout, and verification, to help antenna engineers.
This article presents a detailed technical exploration of SiC MOSFET devices, covering material physics, device structure, switching behavior, and practical design considerations for high-efficiency power electronics systems.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
Have you considered how modern communication systems, like GSM networks, satellite communications, and broadcasting, manage multiple signals with precision? RF diplexers and duplexers make seamless signal sharing and optimal performance possible. Let’s explore the technology in this article.
Semiconductor nanodevices are tiny electronic components crucial in modern electronics due to their smaller size and improved performance. These devices enable faster processors, higher-density memory, and more efficient energy consumption.
Efficient antenna technology is critical for IoT, smart metering, and industrial connectivity. This article explores how omnidirectional antennas are now in demand to simplify designs and enhance performance.
AllSpice is a platform that empowers teams with advanced version control, seamless collaboration, and enhanced traceability, bringing robust oversight to complex design workflows and hardware development processes.
Researchers are the first to use traditional flat-knitting techniques to fabricate flexible, lightweight metasurfaces--large-aperture antennas--that can easily be stowed and deployed for long-range communications
'Fashion tech' refers to the use of big data, AI, AR/VR, and IT in customer services; the development of products incorporating functional materials and wearable devices; and the application of electronics and digital technologies in manufacturing, processing, and distribution processes.
The electrical isolation procedure is a process that ensures electrical equipment has been safely, securely and properly disconnected from the power source.
Plasma cleaning is a high-tech surface treatment that uses ionized gas to remove microscopic contaminants, enhancing adhesion and durability in materials. This article explains plasma cleaning’s role across industries, its eco-friendly benefits, and emerging trends in sustainable manufacturing.
Gallium nitride (GaN) offers superior efficiency and power density, with reliability assessed using the "bathtub curve" to predict and prevent failures from defects, overstress, and aging.
Spatial computing is revolutionizing the interaction between the digital world and the physical world, creating immersive experiences where virtual elements blend seamlessly with reality.
The first project is developing light-based chips to bridge the gap between photonics and electronics. The second project plans to make blood cells using blood stem cells. The two projects are the first ERC Synergy grants for TU/e.
The "smart home" is a near future housing concept that utilizes advanced information processing technologies to improve the efficiency and prosperity of life.
Large language models (LLMs) are increasingly automating tasks like translation, text classification and customer service. But tapping into an LLM’s power typically requires users to send their requests to a centralized server — a process that’s expensive, energy-intensive and often slow.