This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This technical article explains, what is HBM, detailing its 3D-stacked architecture, the critical role of advanced packaging, and its application in modern GPUs, AI accelerators, and embedded systems.
When designing a printed circuit board (PCB), one of the most critical aspects to consider is the spacing between conductive elements, such as traces and pads.
Cornell researchers have built a programmable optical chip that can change the color of light by merging photons, without requiring a new chip for new colors.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
This technical article explains, what is HBM, detailing its 3D-stacked architecture, the critical role of advanced packaging, and its application in modern GPUs, AI accelerators, and embedded systems.
When designing a printed circuit board (PCB), one of the most critical aspects to consider is the spacing between conductive elements, such as traces and pads.
Cornell researchers have built a programmable optical chip that can change the color of light by merging photons, without requiring a new chip for new colors.
EV on-board chargers require precise protection against overvoltage, overcurrent, electric shock, and thermal stress. TDK delivers dedicated solutions across these domains to enhance safety, reliability, and compliance in high-voltage automotive systems.
ROHM's R&D facilities integrate EMC testing, motor bench evaluation, and advanced simulation to tackle electromagnetic noise, efficiency, and thermal challenges. Together, they create a preventive validation ecosystem that accelerates development and ensures reliable, compliant electronic systems.
Modern electronics and renewable energy systems depend on DC to AC inverters that convert a DC source into a clean sinusoidal AC output. This technical article explains the theory behind inverter circuits, their types, architectures, and practical design tips.
Master inverting vs non inverting op amp with a rigorous, engineer-friendly guide covering gain, bandwidth, noise, stability, and layout. Learn closed-loop design and verification used by TI/ADI application engineers. Build quieter, faster, stable amplifiers. Start designing confidently today.
SPI, or Serial Peripheral Interface, is a synchronous, full-duplex serial communication protocol used to connect a controller to one or more peripherals.
In the rapidly growing field of industrial robotics, reliable connectivity is essential for maintaining high signal integrity, especially in environments characterized by continuous motion and harsh conditions.
Electronics are booming, but outdated methods can't keep up. Read more to discover the three principles transforming how development teams collaborate.
This article aims to help design engineers and compliance teams understand the key distinctions between Class I and Class II appliances, how to interpret those in system design, and how to select a PSU that aligns with the required protection scheme.
A decimal counter is a digital circuit that cycles through zero to nine using logic components. It is essential in clocks and timers. Making a decimal counter using seven-segment displays offers great opportunities for students to learn sequential logic, clock signals, and circuit integration.
Advanced electronic components are enabling autonomous driving. This transformation is only possible with reliable, high-performance solutions tailored for automotive applications.
This comprehensive guide discusses the MOSFET symbol, explaining how gate, source, drain, and body connections are represented for N channel and P channel devices. It covers theoretical concepts, practical design guidelines, market trends and emerging technologies.