This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This guide is written for engineers and technical teams building connected devices who need clear, field-ready guidance without getting lost in standards documentation.
This session is built for design, packaging, and reliability engineers working on chiplet-based or 2.5D/3D IC systems, along with engineering managers evaluating how AI fits into their multiphysics and reliability workflows.
This article is a practical guide to motor speed control, covering PWM duty control, VFDs, scalar control, vector control, and field-oriented control for DC, BLDC, induction, PMSM, stepper, and servo motor systems.
This article details BLDC motor controllers, covering system roles, architectures, commutation methods, sensing techniques, power stages, protection, IC selection, application requirements and safety standards.
Half-duplex links take turns, while full-duplex links talk in both directions at once. This guide explains how each mode is built on real hardware, from Ethernet and RS-485 to Wi-Fi and 5G, what each costs you in throughput and latency, and how to choose between them.
Discover how SGD4x, SFA40, STCC4, and SEN6x sensors by Sensirion help engineers measure refrigerants, formaldehyde, CO₂, and multiple air quality parameters in compact, low-power designs.
Controlled impedance is the control of PCB trace impedance within specified tolerances. This article covers microstrip and stripline designs, IPC-2141A formulas, stackup selection, impedance tolerances, routing practices, and TDR testing for signal integrity.
One year after unveiling a first-of-its-kind 'microwave brain' microchip capable of computing on ultrafast data and wireless signals, researchers from the Cornell Duffield College of Engineering have shown how the chip can encode information into its own language.
This article is a practical guide to motor speed control, covering PWM duty control, VFDs, scalar control, vector control, and field-oriented control for DC, BLDC, induction, PMSM, stepper, and servo motor systems.
This article details BLDC motor controllers, covering system roles, architectures, commutation methods, sensing techniques, power stages, protection, IC selection, application requirements and safety standards.
Rising power demands from emerging industries are pushing manufacturers to maximize the performance and efficiency of their power supplies. Using advanced power semiconductor packaging technologies is becoming essential to meet the next-gen targets.
Princeton researchers have combined brain cells and advanced electronics into a 3D device that can be programmed to recognize patterns using computational techniques.
Discover how Industry 4.0, 5.0, and AI are transforming control panels into intelligent, secure, and scalable systems for modern industrial automation.
An interview with Ryan Smart, VP of Product at Harwin, discussing the challenges of shielding in high-reliability connectors, high-current design trends, and the hybrid power-and-signal connector layouts.
Learn how edge AI in wireless vibration sensors improves machine health monitoring, extends battery life, and enables smarter predictive maintenance in factories.
This article explains the IPC-A-610 standard for electronic assemblies, including solder joints, inspection criteria, product classes, and quality requirements for reliable PCB manufacturing and high-performance electronics.