Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
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Glossary of Semiconductors Terms
Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.
Your new PCBA project design needs to pass production validation testing (PVT) to prove it's ready for production. The planning you did for cost, quality assurance, quality control, and scalability now positions your project for success.
Semiconductors are the building blocks of modern electronics, powering everything from smartphones to satellites. This in-depth guide provides a comprehensive understanding of semiconductors' engineering principles and applications, delving into their fundamental concepts, materials, devices, manufacturing processes, and their impact on today's technology landscape.
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Semiconductors
Nordic Semiconductor is a fabless semiconductor company specializing in wireless technology that powers the IoT.
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Printed Circuit Board Vertical Interconnect Access (PCB VIAs) are small plated holes that create electrical connections between different circuit board layers. This article delves into the various types, functions, and best practices of PCB VIAs to help you optimize your PCB design.
Wearable electronic textiles are a demanding environment for reliable interconnects – the ability to function with movement and survive multiple cleanings and reuse. Good adhesion is particularly challenging in these wearable and conformable electronics applications. While solders provide the most conductive electrical connection, they are rigid and require not only the addition of an underfill adhesive but usually a post bond encapsulation. This Anisotropic Conductive Epoxy, provides reliable interconnections between electronic components and circuitry on textiles with excellent structural bonding, without encapsulation, even under repeated stretching and washings. This technology has been shown as a scalable assembly process for e-Textile manufacturing in an SMT line.
5 minutes read
Your new PCBA project design needs to pass production validation testing (PVT) to prove it's ready for production. The planning you did for cost, quality assurance, quality control, and scalability now positions your project for success.
3 minutes read
Wafer thinning is a part of the semiconductor manufacturing process. It is essentially grinding off the backside of the wafers to control their thickness and is useful for the production of ultra-thin wafers. These flattened wafers are used to effect stacked and high-density packaging in compact or microelectronic devices. This article discusses the meaning of wafer thinning, along with its various techniques and significance.
Cost of production has been a major barrier despite the fact that Cu raw material prices are far lower than Ag. This is because this large raw material cost difference does not often get translated into equally large nanoparticle dispersion or ink costs. Can this be overcome?
In general, silicone based conductive pastes are rare and the versions with AgCl fillers- needed for many medical wearable applications- are even rarer!
Warp knitting is an excellent candidate. It combines weaving and weft knitting, allowing the warp knitted fabrics to have the stability of woven fabrics and the elasticity of knitted ones.
Conformal EMI shielding is a megatrend on its way to become ubiquitous in electronics. The incumbent process is based on sputtering a tri-layer structure consisting of SUS on the EMC of the package. In these slides, you can see performance analysis and detailed cost analysis/projections.
2 minutes read
The progress of screen printing towards fine line printing has been incredible going from 100 µm features before 2010 to 70 µm to 2015 to 40 µm in 2018 and now pushing - in development- towards 20 µm and less. In parallel, the wet thickness of the printed line have gone down from 12um or so in 2018 to now just 4um.
As microLEDs inevitably shrink in size, the micro-bumping requirements for the microLED dies becomes more challenging. Direct wafer-based printing based on gravure offset techniques offers a promising solution in this regard. Indeed, this is another field where printed electronics can play a role.
The three themes are closely linked since QDs can be digitally printed as color conversation materials atop blue microLEDs to enable wide color gamut RGB uLED displays without requiring a separate transfer step for each color.. This is an important technology as it simplifies the manufacturing step for microLED and thus removing a major hinderence.
The new approach moves energy efficiently and could reduce energy losses converting light into electricity.
3 minutes read
At the DVT stage, your design is not yet ready for manufacturing. All certifications, qualifications, and specification requirements get tested now.
3 minutes read
PCB layers are the copper layers within a printed circuit board, laminated between or onto layers of conductive material. These layers are stacked to enhance the functionality of electronic devices. This article explores the concept of PCB layering, the various types of layers, and their benefits.
In this article, we look at how Super Low power Wi-Fi and Bluetooth LE enable smart locks to be more agile and reliable by demonstrating these features with a case study from Renesas.
